Method for preparing acceptor zinc oxide film material by using thermal-oxidative zinc nitride

A zinc oxide thin film and zinc nitride technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of inability to achieve effective doping, difficulty in obtaining p-type zinc oxide materials, and the like. The effect of controllable experimental conditions

Inactive Publication Date: 2004-06-09
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that due to the self-compensation effect of the wide bandgap semiconductor material, the doped nitrogen acceptor impurities have mutual repulsion in the zinc oxide, and

Method used

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Examples

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Effect test

Embodiment 1

[0007] Example 1 of the present invention: Preparation of p-type zinc oxide material by thermal oxidation of high-quality zinc nitride single crystal thin film

[0008] The temperature of the high-temperature diffusion furnace is selected as 500°C; the concentration of donor carriers grown on the quartz substrate and silicon substrate is 7×10 18 -9×10 18 .cm -3 , the resistivity range is 7-8×10 -3 The Ω.cm high-quality zinc nitride single crystal film is placed in a high-temperature diffusion furnace, and the temperature control accuracy is ±1°C. Introduce high-purity oxygen, and the oxidation time is 1 hour, then the acceptor concentration range is 3-5×10 17 .cm -3 p-ZnO material with hexagonal structure.

Embodiment 2

[0009] Example 2 of the present invention: Preparation of p-type zinc oxide material by thermal oxidation of high-quality zinc nitride single crystal thin film

[0010] will grow on quartz substrates and silicon substrates with a donor carrier concentration of 7×10 18 -9×10 18 .cm -3 , the resistivity range is 7-8×10 -3 The Ω.cm high-quality zinc nitride single crystal film is placed in a high-temperature diffusion furnace, and the furnace temperature is selected to be 700°C; the temperature control accuracy is ±1°C. Introduce high-purity oxygen, and the oxidation time is 1.5 hours, then the acceptor concentration range is 4-8×10 17 .cm -3 p-ZnO material with hexagonal structure.

Embodiment 3

[0011] Example 3 of the present invention: Preparation of p-type zinc oxide material by thermal oxidation of high-quality zinc nitride single crystal thin film

[0012] will grow on quartz substrates and silicon substrates with a donor carrier concentration of 7×10 18 -9×10 18 .cm -3 , the resistivity range is 7-8×10 -3 The Ω.cm high-quality zinc nitride single crystal film is placed in a high-temperature diffusion furnace, and the furnace temperature is selected as 800°C; the temperature control accuracy is ±1°C. Introduce high-purity oxygen, and the oxidation time is 2 hours, then the acceptor concentration range is 3-5×10 18 .cm -3 p-ZnO material with hexagonal structure.

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Abstract

This invention relates to a preparation method of film materials of acceptor Zn oxide obtaining P-type Zn oxide material by high temperature thermal-oxidating Zn nitride single crystal film to control the acceptor impurity concentration of type-P Zn oxide material by controlling oxidation temperature and thermal-oxidative time. Nitride in cubic antiferro Mn ore is easy to be substituted by oxygen under high temperature and form hexagonal P-type Zn oxide, realizing nitride doped substitution to from P-type Zn oxide and process its film materials with the accepter concentration of 6X10 to the power 16 - 4X10 to the power 18 cm to the power -3 and hexagonal P-type Zn oxide film material, realizing control of Zn oxide electricity performance and carrier concentration which Satifies the needs of preparing P-N material of Zn oxide and photo electronic apparatus.

Description

technical field [0001] The invention belongs to the technical field of semiconductor materials, and relates to a method for preparing an acceptor (p-type) type zinc oxide thin-film optoelectronic material by thermally oxidizing zinc nitride for zinc oxide ultraviolet light-emitting tubes, laser diodes and ultraviolet detectors. Background technique [0002] Zinc oxide material is a semiconductor material with wide direct bandgap (3.3eV), because its exciton binding energy (60meV) is much larger than room temperature thermal energy (26meV), it can achieve efficient exciton-related ultraviolet stimulated emission at room temperature . Therefore, it is an important material for the preparation of ultraviolet light-emitting tubes and laser diodes. However, due to the self-compensation effect of wide-bandgap semiconductor materials, the doped nitrogen acceptor impurities have mutual repulsion in zinc oxide, and it is difficult to achieve effective doping. It is difficult to obtai...

Claims

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Application Information

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IPC IPC(8): H01L21/20H01L21/36H01L31/00H01L33/00
Inventor 刘益春李炳生马剑钢吕有明申德振
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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