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High temperature resistant inorganic fibre reinforced injection type phenolic moulding plastics

A phenolic molding compound and inorganic fiber technology, used in the field of special engineering plastics, can solve the problem that the fluidity and curing stability of the molding compound cannot meet the requirements, the curing flow deformation and curing rate requirements, and the phenolic molding compound cannot be widely used. application and other issues, to achieve the effect of improving the degree of sophistication, high heat distortion temperature, and high temperature appearance stability

Inactive Publication Date: 2004-11-10
上海欧亚合成材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for a long time, the selection of phenolic molding compound components and proportions cannot meet the requirements of solidification flow behavior and curing rate, which makes the fluidity and curing stability of the molding compound fail to meet the requirements during the molding process. Plastics cannot solve the problem of rapid performance degradation at high temperature
Therefore, phenolic molding compounds cannot be widely used in high temperature fields

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Using acid-process phenolic resin as the binder, selecting an appropriate curing system, and adopting a dry method to produce, the components and contents of the phenolic molding compound obtained are as follows:

[0024] a., acid method phenolic resin, the weight ratio is 30.0~40.0%;

[0025] b, urotropine, the weight ratio is 5.0~20.0%;

[0026] c, glass fiber (3mm), the weight ratio is 10.0~4.0%;

[0027] d. One or more of magnesium oxide, iron oxide and zinc oxide, the weight ratio is 0.5-5.0%;

[0028] E, calcium hydroxide, the weight ratio is 0.1~0.5%;

[0029] f, stearic acid, the weight ratio is 0.5~2.5%;

[0030] G, zinc stearate, the weight ratio is 0.5~2.5%;

[0031] h, EBS, the weight ratio is 0.5-1.0%;

[0032] i, mica powder, the weight ratio is 5.0~15.0%;

[0033] j, talcum powder, the weight ratio is 1.0~4.0%;

[0034] K, calcium carbonate, the weight ratio is 1.0~5.0%;

[0035] 1. Aluminum hydroxide, the weight ratio is 1.0-5.0%;

[0036] m, ca...

Embodiment 2

[0040] Using acid-process phenolic resin as a binder, selecting an appropriate curing system, and adopting dry production, the components of the obtained molding compound are 15.0-30.0% by weight of acid-process phenolic resin, and 1.0-4.0% by weight of urotropine. The weight of mica powder is 5.0-15.0%, the weight of calcium carbonate is 1.0-5.0%, the weight of aluminum hydroxide is 1.0-4.0%, and the other components, weight ratio and process route are the same as in Example 1.

[0041] Under the same test conditions as in Example 1, the performance of the phenolic molding compound is tested, and the test results are as follows: the specific gravity is 1.81g / cm 3 , The bending strength is 92Mpa, the heat distortion temperature is 237°C, and the high temperature appearance stability is 250°C×2h.

Embodiment 3

[0043] Use acid-process phenolic resin as binder, select appropriate curing system, and adopt dry method to produce. The components of the obtained molding compound are 25.0-30.0% by weight of acid-process phenolic resin, 15.0-20.0% by weight of mica powder, and other components Point and weight ratio and processing route are identical with embodiment 2.

[0044] Under the same test conditions as in Example 1, the performance of the phenolic molding compound is tested, and the test results are as follows: the specific gravity is 1.85g / cm 3 , The bending strength is 87Mpa, the heat distortion temperature is 241°C, and the high temperature appearance stability is 250°C×2h.

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Abstract

The present invention discloses a high-temp. resistant inorganic fibre reinforced injection type phenol aldehyde moulding material, including 15-40 wt% of phenolic resin, 1-20 wt% of solidifying agent, 10-40 wt% of inorganic reinforcement material, 0.5-5 wt% of plasticizer, 0.5-5 wt% of solidification accelerator and 5-50 wt% of inorganic filling material. Said phenol aldehyde moulding material possesses high thermal deformation temp. and high-temp. appearance stability.

Description

technical field [0001] The invention relates to a special engineering plastic, in particular to a high-temperature-resistant inorganic fiber-reinforced injection-type phenolic molding compound. Background technique [0002] Phenolic molding compounds, especially phenol-formaldehyde molding compounds filled with mineral fillers and glass fibers, have a methylol structure formed by different numbers of phenol rings and formaldehyde and high heat-resistant glass fibers. The methylol structure has a strong stability The glass fiber itself has heat resistance and high stress strength, and it plays a reinforcing role in the molding compound, which makes the phenolic molding compound have excellent dimensional stability under high temperature and high stress. For the same reason, the thermal degradation stability of phenolic molding compound at high temperature is better than other general plastics. Because the phenolic molding compound has these advant...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/04C08L61/06
Inventor 朱永茂刘勇沐霖王鸿
Owner 上海欧亚合成材料股份有限公司
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