Shape memory Co-Zn-Al alloy grains reinforced composite Sn-Ag welding material and its prepn process

A technology of memory alloy and particle reinforcement, which is applied in welding equipment, metal processing equipment, welding/cutting media/materials, etc., can solve the problems of increased cost, little effect, and difficulty in uniform compounding of nickel-titanium shape memory alloy particles, etc., to achieve economical Good performance, good wettability effect

Inactive Publication Date: 2007-05-02
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the poor wettability between the nickel-titanium shape memory alloy particles and the solder and the substrate, it is very difficult to successfully compound the nickel-titanium shape memory alloy particles in the matrix evenly. Flux is used to improve its wettability, but on the one hand, it has little effect, and on the other hand, the increase in cost is also a problem

Method used

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  • Shape memory Co-Zn-Al alloy grains reinforced composite Sn-Ag welding material and its prepn process
  • Shape memory Co-Zn-Al alloy grains reinforced composite Sn-Ag welding material and its prepn process
  • Shape memory Co-Zn-Al alloy grains reinforced composite Sn-Ag welding material and its prepn process

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example 1

[0015] The tin and silver with a purity of 99.99% are heated to 1200°C in a vacuum melting furnace under the protection of argon at a mass ratio of 96.5:3.5, and magnetically stirred at the same time to make the alloy composition uniform. Then the water freezes. In order to make the alloy fully uniform, the alloy was turned over and reheated to 1200 ° C to melt, while magnetically stirring and water cooling. This is repeated five times to obtain a button-shaped tin-silver eutectic lead-free solder with a diameter of about 3.0-3.5 cm. Heat the copper-zinc-aluminum shape memory alloy particles (20-50 μm in size) with a mass ratio of 74:22:4 to 800°C in a vacuum environment, keep them warm for 10 minutes, and quickly quench them in water to generate thermoelastic Martensite in the alloy. body, so that it has a two-way shape memory effect between 25°C and 60°C. Then put the prepared copper-zinc-aluminum shape memory alloy particles with a mass ratio of 1% together with the tin-s...

example 2

[0017] The tin and silver with a purity of 99.99% are heated to 1500°C in a vacuum melting furnace under the protection of argon in a mass ratio of 96.5:3.5, and are magnetically stirred at the same time to make the alloy composition uniform. Then the water freezes. In order to make the alloy fully uniform, the alloy was turned over and reheated to 1500°C to melt, while magnetically stirring and water cooling. This is repeated five times to obtain a button-shaped tin-silver eutectic lead-free solder with a diameter of about 3.0-3.5 cm. Heat the copper-zinc-aluminum shape memory alloy particles (20-50 μm in size) with a mass ratio of 74:22:4 to 800°C in a vacuum environment, keep them warm for 10 minutes, and quickly quench them in water to generate thermoelastic Martensite in the alloy. body, so that it has a two-way shape memory effect between 30°C and 80°C. Then put the prepared copper-zinc-aluminum shape-memory alloy particles with a mass ratio of 5% together with tin-sil...

example 3

[0019] The tin and silver with a purity of 99.99% are heated to 1400°C in a vacuum melting furnace under the protection of argon at a mass ratio of 96.5:3.5, and are magnetically stirred at the same time to make the alloy composition uniform. Then the water freezes. In order to make the alloy fully uniform, the alloy was turned over and reheated to 1400°C to melt, while magnetically stirred and water-cooled. This is repeated five times to obtain a button-shaped tin-silver eutectic lead-free solder with a diameter of about 3.0-3.5 cm. Heat the copper-zinc-aluminum shape memory alloy particles (20-50 μm in size) with a mass ratio of 66:28:6 to 800°C in a vacuum environment, keep them warm for 10 minutes, and quickly quench them in water to generate thermoelastic Martensite in the alloy. body, so that it has a two-way shape memory effect between 20°C and 70°C. Then put the prepared copper-zinc-aluminum shape memory alloy particles with a mass ratio of 3% together with tin-silve...

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Abstract

The present invention belongs to the field of composite lead-free welding material technology. The composite welding material contains lead-free welding material of Sn and Ag in the weight ratio of 96.5 to 3.5 and shape memory alloy of Cu, Zn and Al in the weight ratio of 66-74 to 24-28 to 2-6 and grain size of 20-50 microns in the content of 1-5 wt%. The preparation process of the composite welding material includes the following steps: preparing eutectic lead-free welding material through smelting with Sn and Ag in purity of 99.99 %; preparing the shape memory alloy thermoelastic martensite of Cu, Zn and Al; and hot mixing the shape memory alloy grains and the eutectic lead-free welding material and water cooling. The composite welding material can prolong the service life of weld spot in varying work temperature owing to the shape memory effect.

Description

technical field [0001] The invention relates to a copper-zinc-aluminum shape memory alloy particle-reinforced tin-silver composite solder and a preparation method thereof, belonging to the technology of composite lead-free solder. Background technique [0002] Emphasizing environmental protection and advocating green products are the general trend of world economic development. The use of traditional lead-tin solder has a history of about two thousand years, and it is widely used in the modern electronic assembly industry. However, due to the damage of lead to the human nervous system and the harm to human health that cannot be ignored, the problem of lead pollution has been paid more and more attention by people, so that there is a high demand for lead-free electronic products in the world. Waste of Electrical and Electronic Equipment (WEEE), led by the European Union, called for an end to the use of lead-containing materials in the electronics assembly industry in 2006. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
Inventor 沈骏刘永长高后秀
Owner TIANJIN UNIV
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