Process for preparing FeS2 on monosilicon substrate by magnetically controlled sputter to Fe film
A monocrystalline silicon wafer, magnetron sputtering technology, applied in the direction of final product manufacturing, sustainable manufacturing/processing, electrical components, etc., can solve the problem of thin film peeling, and achieve the effect of not easy local peeling and high adhesion
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Embodiment 1
[0020] Two single-crystal silicon wafers with a thickness of 0.9 mm and orientations of (100) and (111) were used as film-carrying substrates. First place the silicon chip in concentrated sulfuric acid to oxidize, thoroughly clean with deionized water, then use hydrofluoric acid to remove the surface oxide layer, and then thoroughly clean with deionized water. After the above operation was repeated twice, the silicon wafer was vibrated with ultrasonic wave in alcohol solution for 10 min. The surface-treated silicon wafers were dried in a thermostat at 150°C for 4 hours.
[0021] A magnetron sputtering device is used to deposit a pure iron film on a silicon wafer substrate, the target material purity is 99.99% Fe, and the thickness is 0.8mm. Before deposition, evacuate to a residual gas pressure lower than 3.0×10 -3 Pa and replaced with argon for 3 times. Pure iron films with different thicknesses of 25, 46, 55, 80 and 150 nm were deposited by controlling the sputtering time...
Embodiment 2
[0024] The substrate, the surface treatment before sputtering and the sputtering process are the same as those in Embodiment 1.
[0025] Pack the pure iron film and the sublimed sulfur powder which can produce the required mass of 80kPa pressure calculation at 500°C vulcanization temperature in a quartz tube, and evacuate until the residual gas pressure is lower than 1.0×10 -2 Pa and filled with argon for 5 times and then sealed. Place the sealed pure iron film in a heating furnace and heat it up to 500°C at a rate of 3°C / min for a thermal vulcanization reaction for 10 hours. After fully forming iron disulfide, cool it down to room temperature at a rate of 2°C / min.
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