Method of activating non-conducting base plate for non-electric plating

A non-conductive, electroless plating technology, used in liquid chemical plating, the formation of electrical connection of printed components, metal material coating processes, etc., can solve the problem of easy particle aggregation, waste of cost, and large particle size of tin-palladium alloy colloid particles. and other problems, to achieve the effect of high stability and simple process

Inactive Publication Date: 2003-03-19
CHANG CHUN PETROCHEMICAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Moreover, the tin-palladium alloy colloidal particles prepared by the tin-palladium alloy colloidal particle manufacturing process have a large particle size, and the particles are easy to aggregate into large-scale particle precipitation, and the activation solution loses its catalytic activity, resulting in waste of cost

Method used

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  • Method of activating non-conducting base plate for non-electric plating
  • Method of activating non-conducting base plate for non-electric plating
  • Method of activating non-conducting base plate for non-electric plating

Examples

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Embodiment 1

[0041] In this embodiment, the palladium metal nanoparticle activation solution activates the epoxy resin substrate, and conducts electroless plating reaction to deposit copper metal. An epoxy resin substrate with an area of ​​2 cm×1 cm was immersed in a palladium metal nanoparticle activation solution at a temperature of 50° C. for 10 minutes. Such as figure 1 The shown average particle diameter is the TEM image of the palladium metal nanoparticle activation solution of 3.36nm. The formula of palladium metal nanoparticle activation solution is as follows: palladium acetate (Pd(OAc) 2 ) 0.4g sodium dodecyl sulfate (SDS) 2.88g deionized water 100ml

[0042] After the substrate is washed with water, it is immersed in an electroless copper plating aqueous solution with a pH value of 11.8-12.2 for 10 minutes to carry out an electroless copper plating reaction, and copper is deposited on the epoxy resin substrate. The composition of the electroless copper plating aqueous solutio...

Embodiment 2

[0043] In this embodiment, the palladium metal nanoparticle activation solution activates the epoxy resin substrate, and carries out the electroless plating reaction to deposit nickel metal in the alkaline electroless nickel plating solution. An epoxy resin substrate with an area of ​​2 cm×1 cm was immersed in a palladium metal nanoparticle activation solution at a temperature of 50° C. for 10 minutes. The palladium metal nanoparticle activation solution consists of the following: palladium chloride (PdCl 2 ) 0.08g sodium dodecyl sulfate (SDS) 2.88g deionized water 100ml and then wash the substrate with water, then immerse in the electroless nickel plating aqueous solution with a temperature of 80 to 85°C and pH = 8 for 10 minutes to conduct electroless plating The electroplating nickel reaction deposits nickel on an epoxy resin substrate. The composition of the electroless nickel plating aqueous solution is as follows: nickel chloride 0.1M sodium citrate 0.15M sodium hypopho...

Embodiment 3

[0045] In this embodiment, the palladium metal nanoparticle activation solution activates the epoxy resin substrate, and carries out the electroless plating reaction to deposit nickel metal in the acidic electroless nickel plating solution. An epoxy resin substrate with an area of ​​2 cm×1 cm was immersed in a palladium metal nanoparticle activation solution at a temperature of 50° C. for 10 minutes. Palladium metal nanoparticle activation solution formula is as follows: palladium acetate (Pd(OAc) 2 ) 0.02g sodium dodecyl sulfate (SDS) 2.88g deionized water 100ml and then wash the substrate with water, immerse in the electroless nickel plating aqueous solution with a temperature of 80 to 85°C and a pH of 5.35, and perform electroless plating for 10 minutes Nickel reacts, and nickel metal is deposited on the epoxy resin substrate. The composition of the electroless nickel plating aqueous solution is as follows: nickel chloride 0.1M sodium citrate 0.15M sodium hypophosphite 0.0...

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Abstract

The present invention relates to the process of using nano metal particle activating liquid for non-electric plating and propose one process of activating non-conducting base plate for non-electric plating. Nano particle water solution containing noble metal element and its alloy is used as the activating liquid for non-electric plating and conducting metal layer may be deposited on the non-conducting base plate and inside its nanometer level holes via the non-electric plating process. By means of the said process, conducting copper or nickel layer may be formed on the non-conducting base plate and inside its nano level holes with copper or nickel water solution.

Description

field of invention [0001] The invention relates to a method for activating a non-conductive substrate for an electroless plating reaction process, in particular to a method for applying a metal nanoparticle activation solution to an electroless plating process, which is a process for activating a non-conductive substrate for electroless plating. The method of electroplating reaction is to use the aqueous solution of nanoparticles containing precious metal elements and their alloys as the activation solution of the electroless plating process to deposit a conductive metal layer on the substrate. This method can be widely used in the industrial process of making electronic circuits, such as the plated through hole process (PTH process) of printed circuit boards and the process of VLSI copper metal interconnection. Background technique [0002] Electroless plating technology has always been the most important technology in the industrial process of electronic circuit production...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/31H05K3/42
Inventor 李建良万其超
Owner CHANG CHUN PETROCHEMICAL CO LTD
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