Polyimide metal laminated plate and its producing method

A polyimide layer, polyimide technology, applied in the direction of metal layered products, printed circuit manufacturing, chemical instruments and methods, etc., can solve the problems of large surface roughness, high manufacturing cost, and deterioration of light transmission

Inactive Publication Date: 2003-06-25
MITSUI CHEM INC
View PDF0 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The surface of the film for the insulating layer using this method is smooth, and the surface is kept smooth because there is basically no change after sputtering evaporation, and its light transmittance is high, and image recognition during ICB can be performed. High, but the connection force between the metal and the insulating layer is weak, especially when there is a heating process during the patch, the connection force of the sputtered material after such heating is significantly reduced, and wiring is generated during circuit processing and subsequent processes Fatal defects such as peeling, although various efforts

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polyimide metal laminated plate and its producing method
  • Polyimide metal laminated plate and its producing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0089] Hereinafter, the present invention will be described in more detail based on examples. In addition, the surface treatment adhesion amount of the metal foil, the maximum roughness of the metal foil surface, the Beer strength of the metal foil and the thermoplastic polyimide layer, etc. shown in the examples were measured by the following methods.

[0090] (1) Surface treatment adhesion

[0091] Using a fluorescent X-ray measuring device for analysis, the sample cut into a disc shape with a diameter of 40 mm was measured, and the adhesion amount per unit area was obtained by conversion. The unit is mg / dm2.

[0092] (2) Arithmetic mean roughness: Ra(μm)

[0093] Using a surface roughness meter (manufactured by Small Board Research Institute, type: サ-フコ-ダ-SE-30D), according to JIS B-0601 standard, the cut-off value is 0.25mm, and the measured length is 2.5mm. On the surface of the foil, three points are randomly selected in the directions parallel to and perpendicular to...

Synthetic example 1

[0110] 1636 g of DMAc as a solvent was added to a container equipped with a stirrer and a nitrogen gas introduction tube, and 146.2 g of APB was added thereto, and stirred at room temperature until dissolved. Thereafter, 142.5 g of BPDA was added and stirred at 60°C to obtain a polyamic acid solution. The polyamic-acid content rate of the solution of the obtained polyamic acid was 15 weight%, and the E-type viscosity at 25 degreeC was 550 cps.

Synthetic example 2

[0112] 1718.6 g of DMAc as a solvent was put into a container equipped with a stirrer and a nitrogen introduction tube, and 146.2 g of APB was added thereto, and stirred at room temperature until dissolved. Then, BTDA157.1g was added, it stirred at 60 degreeC, and the polyamic acid was obtained. The content rate of the polyamic acid of the obtained polyamic-acid solution was 15 weight%, and the E-type viscosity at 25 degreeC was 500 cps.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Average roughnessaaaaaaaaaa
Adhesionaaaaaaaaaa
Adhesionaaaaaaaaaa
Login to view more

Abstract

The object of this invention is to provide a method for manufacturing a polyimide and metal compound sheet with a tight seal between a metal foil and a polyimide layer so as to serve as a high density circuit substrate. In this invention, in a polyimide and metal compound sheet, at least a side of the polyimide layer is formed with a metal layer. The surface roughness of the bordering face between the metal layer and the polyimide layer is less than 0.30 mum Ra. The amount of silicon adhesion at the bordering face between the metal layer and the polyimide layer is 0.001 to 0.01 mg/dm<2>. The amount of chromium adhesion is 0.01 to 0.05 mg/dm<2>. The amount of zinc adhesion is less than 0.07 mg/dm<2>. The amount of nickel adhesion is 0.07 to 0.5 mg/dm<2>.

Description

technical field [0001] The present invention relates to a polyimide metal laminate widely used in flexible wiring boards and a manufacturing method thereof. More specifically, it relates to excellent adhesion between a metal layer and a polyimide layer, and is applicable to high-density circuit boards. A polyimide metal laminate plate excellent in light transmittance of the material and a manufacturing method thereof. Background technique [0002] In recent years, with the development of small and portable electronic equipment, polyimide metal laminates that can be mounted in high density as parts and components of circuit board materials have been widely used. Moreover, in order to adapt to the high density, it is desirable to have a polyimide metal laminate board suitable for micro-pattern processing with a wiring width of 10-50 μm. The bill strength requirement of the adhesion index must be high. [0003] However, the metal foil used for polyimide metal laminates requir...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/38B32B15/08
CPCB32B15/08H05K1/036H05K3/4694H05K2203/0307
Inventor 大坪英二田代雅之森峰宽小林正尚广田幸治児玉洋一
Owner MITSUI CHEM INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap