Polyimide metal laminated plate and its producing method

Abstract

The object of this invention is to provide a method for manufacturing a polyimide and metal compound sheet with a tight seal between a metal foil and a polyimide layer so as to serve as a high density circuit substrate. In this invention, in a polyimide and metal compound sheet, at least a side of the polyimide layer is formed with a metal layer. The surface roughness of the bordering face between the metal layer and the polyimide layer is less than 0.30 mum Ra. The amount of silicon adhesion at the bordering face between the metal layer and the polyimide layer is 0.001 to 0.01 mg / dm<2>. The amount of chromium adhesion is 0.01 to 0.05 mg / dm<2>. The amount of zinc adhesion is less than 0.07 mg / dm<2>. The amount of nickel adhesion is 0.07 to 0.5 mg / dm<2>.

Description

technical field [0001] The present invention relates to a polyimide metal laminate widely used in flexible wiring boards and a manufacturing method thereof. More specifically, it relates to excellent adhesion between a metal layer and a polyimide layer, and is applicable to high-density circuit boards. A polyimide metal laminate plate excellent in light transmittance of the material and a manufacturing method thereof. Background technique [0002] In recent years, with the development of small and portable electronic equipment, polyimide metal laminates that can be mounted in high density as parts and components of circuit board materials have been widely used. Moreover, in order to adapt to the high density, it is desirable to have a polyimide metal laminate board suitable for micro-pattern processing with a wiring width of 10-50 μm. The bill strength requirement of the adhesion index must be high. [0003] However, the metal foil used for polyimide metal laminates requir...

AI Technical Summary

Problems solved by technology

The surface of the film for the insulating layer using this method is smooth, and the surface is kept smooth because there is basically no change after sputtering evaporation, and its light transmittance is high, and image recognition during ICB can be performed. High, but the connection force between the metal and the insulating layer is weak, especially when there is a heating process during the patch, the connection force of the sputtered material after such heating is significantly reduced, and wiring is generated during circuit processing and subsequent processes Fatal defects such as peeling, although various efforts have been made to improve this problem, they have not yet been resolved.

[0008] In addition, there is a flexible metal laminate obtained by directly coating polyimide resin dissolved in a solvent on a metal foil and drying it, which is called a casting. In order to ensure the connection with the metal foil by this method In the past, metal foil with a large surface roughness had to be used, and the surface of the insulating layer connected to the metal became uneven, and the light transmittance deteriorated due to diffuse reflection, so it could not be used for image recognition that had to pass through the insulating layer

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