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Absorbing compounds for spin-on glass anti-reflective coatings for photolithography

A technology for spinning glass and compounds, which is applied in the field of light-absorbing spinning glass materials and absorbing compounds, and can solve problems such as increasing processing complexity.

Inactive Publication Date: 2003-09-17
HONEYWELL INT INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Additional chemical vapor deposition methods increase processing complexity

Method used

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  • Absorbing compounds for spin-on glass anti-reflective coatings for photolithography
  • Absorbing compounds for spin-on glass anti-reflective coatings for photolithography

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Synthesis of 9-Anthracenemethoxy-methyldiethoxysilane

[0031] In a 3-liter flask, mix 92.37 g (0.419 mol) methyltriacetoxysilane (MTAS), 87.36 g (0.419 mol) 9-anthracenemethanol, 38.56 g (0.839 mol) ethanol, 595.51 g (10.20 mol) acetone . The solution was stirred under nitrogen atmosphere for 7 days. The solution was degassed to remove the acetic acid by-product.

Embodiment 2

[0033] Synthesis of Absorbent SOG Containing 9-Anthracenemethoxymethyldiethoxysilane

[0034] In a 1-liter flask, 297 g (4.798 mol) of isopropanol, 148 g (2.55 gmol) of acetone, 123 g (0.593 mol) of TEOS, 77 g (0.432 mol) of MTEOS, 200 g of 9-anthracenemethoxy -Methyldiethoxysilane, produced in Example 1, 2.61 grams (0.009) mol rosenic acid, 10 grams (0.024mol) 2-hydroxy-4 (3-triethoxysilyl propoxy) - Benzophenone, 0.09 grams (0.0004 mol) of 2,6-dihydroxyanthraquinone, 0.6 grams of 1.0 M nitric acid and 72 grams (3.716 mol) of deionized water were mixed. The flask was refluxed for 4 hours. 43 grams (0.590 mol) of butanol were added to the solution. The solution was filtered. The solution was dispensed, followed by thickness spinning at 3000 rpm for 20 seconds and baking at 80°C and 180°C for 1 minute respectively. Optical properties were measured with a N & K Technology Model 1200 analyzer. The film thickness was 2801 angstroms. At 248 nm, the refractive index (n) is 1.4...

Embodiment 3

[0036] Synthesis of 9-Anthracenemethoxy-triethoxysilane

[0037] In a 3 liter flask, 110.73 grams (0.419 mol) of tetraacetoxysilane (TAS), 87.36 grams (0.419 mol) of 9-anthracenemethanol, 57.98 grams (1.2585 mol) of ethanol, 595.51 grams (10.20 mol) of acetone were mixed. The solution was stirred under nitrogen atmosphere for 7 days. The solution was degassed to remove the acetic acid by-product.

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Abstract

As the organic light-absorbing compound, an absorbing ether-like compound comprising a silicon ethoxy, silicon diethoxy or silicon triethoxy species linked to a naphthalene or anthracene chromophore through an oxygen bond is used. The absorbing ether-like compound is incorporated into the spin-on-glass material to provide an antireflective coating material for deep ultraviolet lithography. The method for the synthesis of this light-absorbing ether compound is based on the reaction of an alcohol-substituted chromophore with an acetoxy silicon compound in the presence of an alcohol. Also provided is a method of making an absorbent spin-on-glass material comprising an absorbent etheroid compound.

Description

technical field [0001] The present invention relates generally to light-absorbing spin-on-glass materials, and more particularly to absorbing compounds that can be incorporated into spin-on-glass materials for use as antireflection layers in photolithography, and methods of producing the absorbing compounds. Background of the invention [0002] To meet demands for faster performance, the feature sizes of integrated circuit device components continue to decrease. The fabrication of devices with smaller component sizes poses new challenges in many of the methods commonly used in semiconductor fabrication. One of the most important of these fabrication methods is photolithography. [0003] It has long been recognized that line width deviations in patterns produced by photolithography can arise from optical interference of light reflected from underlying layers on semiconductor wafers. Variations in photoresist thickness due to the surface morphology of the underlying layer al...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/11C03C17/30C07F7/18C08K5/5415C08L83/05C09D4/00C09D183/04H01L21/027
CPCC03C17/30C07F7/1804C09D4/00C09D183/04Y10T428/31663C08G77/04C08L2666/44C08G77/42
Inventor T·巴德温M·里奇J·德拉格H·-J·吴R·斯佩尔
Owner HONEYWELL INT INC
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