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Liquid state photo sensitive insulating ink used for cascade circuit board

A technology of insulating ink and circuit, applied in the direction of ink, optics, application, etc., can solve the problems of poor heat resistance, low resolution and high manufacturing cost of the insulating layer

Inactive Publication Date: 2004-12-22
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The existing liquid photosensitive insulating ink has low resolution, poor heat resistance to form an insulating layer after curing, and high manufacturing cost

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Example 1 The formula of a liquid photosensitive insulating ink for single-component multilayer circuit boards is as follows:

[0045] Component wt(%)

[0046] Acrylic oligomer 25.0

[0047] Trimethylolpropane triacrylate 12.0

[0048] SB510 (Sartomer company) 10.0

[0049] I-907 10.0

[0050] Epoxy cresol phenolic resin (epoxy value = 200~250) 32.5

[0051] Polyphenylene ether 1.0

[0052] TAIC 0.5

[0053] Phthalocyanine green 1.5

[0054] Filler (fumed silica) 1.5

[0055] 94.0

[0056] Additive leveling agent 0.5

[0057] Defoamer 0.5

[0058] Solvent used carbitol acetate (type and quantity depend on construction method) 5.0

Embodiment 2

[0059] Example 2 The formula of a liquid photosensitive insulating ink for single-component multilayer circuit boards is as follows:

[0060] Component wt(%)

[0061] Pentaerythritol triacrylate 16.0

[0062] Acrylic oligomer 23.0

[0063] SB500 (Sartomer company) 12.0

[0064] I-907 4.0

[0065] I-184 4.0

[0066] Polyphenylene ether 2.0

[0067] SMA 0.5

[0068] Epoxy cresol phenolic resin (epoxy value = 200~250) 32.5

[0069] Malachite green 1.5

[0070] Filler (fumed silica) 1.5

[0071] 97.0

[0072] Additive leveling agent 0.5

[0073] Defoamer 0.5

[0074] Solvent used Carbitol acetic acid (type and quantity depend on construction method) 2.0

Embodiment 3

[0075] Embodiment 3 The formula of a liquid photosensitive insulating ink for multilayer circuit boards is divided into two parts, as follows:

[0076] Component wt(%)

[0077] PART A

[0078] Diacrylate oligomer of bisphenol A epoxy resin 20.0

[0079] Trimethylolpropane triacrylate oligomer 10.0

[0080] I-907 5.0

[0081] I-1173 5.0

[0082] Phthalocyanine Green 1.0

[0083] Trimellitic anhydride 7.0

[0084] Defoamer 2.0

[0085] 50.00

[0086] PART B

[0087] Cresol novolac epoxy resin 35.0

[0088] Trimethylolpropane triacrylate oligomer 5.0

[0089] PTFE 5.0

[0090] TAIC 2.0

[0091] Dicyandiamide 1.0

[0092] Defoamer 0.5

[0093] Calcium carbonate 1.0

[0094] Leveling agent 0.5

[0095] 50.00

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PUM

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Abstract

A photosensitive insulating liquid ink for the laminated circuit board is prepared from the biacrylate oligomer of biphenal A and epoxy resin, phenolic epoxy resin, trihydroxymethylpropane triacrylate oligomer, cross-linking agent, phototrigger, solidifying agent of epoxy resin, pigment, filler, thermosetting resin, compatibilizer, assistant and solvent. Its advantages are strong developing solubility and high resistance to high temp.

Description

Technical field [0001] The invention relates to the field of coating materials for printed circuit boards, in particular to a liquid photosensitive insulating ink for laminated circuit boards. Background technique [0002] In the early multi-layer circuit boards, the inter-layer interconnection and the assembly of the component pins all relied on all-through plated through holes (PTH) to perform. At that time, the assembly was not dense and the wiring was not much, so the problem was not big. With the improvement of the functions of electronic products and the increase of parts, the early through-hole insertion has gradually developed into a surface-mounting that saves board space. After 1980, "Surface Mount Technology" (SMT) began to enter mass production, making printed circuit boards (PCBs) an important topic in small holes and fine lines. However, this double-sided mounting method using solder paste and wave soldering still has certain limitations. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/50G03F7/00
Inventor 杨卓如周亮程江文秀芳潘莉莎朱惠贤王斋民
Owner SOUTH CHINA UNIV OF TECH