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Aldehyde-free adhesives for artificial board

A technology of wood-based panels and adhesives, applied in the direction of adhesives, etc., can solve problems such as hazards and formaldehyde pollution, achieve broad market prospects, promote non-formaldehyde, and have good economic and social benefits

Inactive Publication Date: 2005-01-05
NANJING FORESTRY UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to fundamentally solve the pollution and harm of formaldehyde in the wood-based panel industry, we use polymer compounds, cross-linking agents, anti-fungal agents, fillers and deionized water to prepare formaldehyde-free adhesives for wood-based panels, which can be used to replace urea-formaldehyde adhesives. in the production of wood-based panels

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] Embodiment 1 styrene (20%)-glycidyl acrylate (8%)-acrylonitrile (8%)-butyl acrylate (4%) copolymer emulsion

[0054] Styrene 200g

[0055] Glycidyl acrylate 80g

[0056] Acrylonitrile 80g

[0057] Butyl acrylate 40g

[0058] Emulsifier (OP-10) 15g

[0059] Sodium Lauryl Sulfate 5g

[0060] Polyvinyl alcohol (PVA) 40g

[0061] Deionized water 536g

[0062] Potassium persulfate 4g

[0063] In a 2L four-necked flask equipped with a thermometer, a stirring rod, a reflux condenser, a constant pressure funnel and a heater, add 40g of polyvinyl alcohol (PVA) and 536g of water, heat and control it at a temperature of 75°C, and stir until poly After vinyl alcohol is completely dissolved, add 4g potassium persulfate, 5g sodium lauryl sulfate and 15g emulsifier (OP-10), stir and dissolve evenly, then add 200g styrene, 80g glycidyl acrylate, 80g acrylonitrile and 1 / 3 of 40g of butyl acrylate monomer mixture, temperature controlled at 75°C, within 1.5h, add another 2 / 3 of th...

Embodiment 2

[0064] Embodiment 2 vinyl acetate (29%)-glycidyl acrylate (8%)-butyl acrylate (3%) copolymer emulsion

[0065] Vinyl acetate 290g

[0066] Glycidyl acrylate 80g

[0067] Butyl acrylate 30g

[0068] Emulsifier (OP-10) 15g

[0069] Sodium Lauryl Sulfate 5g

[0070] Polyvinyl alcohol (PVA) 40g

[0071] Deionized water 536g

[0072] Potassium persulfate 4g

[0073] In a 2L four-necked flask equipped with a thermometer, a stirring rod, a reflux condenser, a constant pressure funnel and a heater, add 40g of polyvinyl alcohol (PVA) and 536g of water, heat and control it at a temperature of 75°C, and stir until poly After vinyl alcohol is completely dissolved, add 4g potassium persulfate, 5g sodium lauryl sulfate and 15g emulsifier (OP-10), stir and dissolve evenly, then add 290g vinyl acetate, 80g glycidyl acrylate and 30g acrylic acid One-third of the butyl ester monomer mixture was controlled at 75° C., and the other two-thirds of the monomer mixture was continuously dropped...

Embodiment 3

[0075] a.40% styrene (20%)-glycidyl acrylate (8%)-acrylonitrile (8%)-butyl acrylate (4%) copolymer emulsion

[0076] 800g

[0077] b. Corn starch 80g

[0078] c. Sodium pentachlorophenolate 10g

[0079] d. Deionized water 80g

[0080] e. Diethylenetriamine 30g

[0081] After a, b, c and d are mixed and stirred evenly, add curing agent e and stir evenly before use. The curing temperature of the formaldehyde-free adhesive for wood-based panels of the present invention is 50°C to 180°C.

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Abstract

The invention relates to an artificial board aldehyde-free adhesive, providing a method of preparing the adhesive. And its characteristic: in substance, it uses cross-linking and curing high-molecular compound, cross-linking agent, mildewproof agent, fillings and deionized water to prepare the adhesive to replace the urea formaldehyde for producing artificial boards, and it can radically eliminate dissociative formaldehyde pollution and harm in the industry.

Description

technical field [0001] The invention relates to a formaldehyde-free adhesive for wood-based panels, belonging to the field of adhesives. Background technique [0002] Urea-formaldehyde glue is widely used because of its high bonding strength, good cold water resistance, chemical corrosion resistance, simple manufacture, and low cost. In the wood-based panel industry, the usage of urea-formaldehyde glue accounts for the total amount of various glues in the wood-based panel industry. About 70% of. However, the disadvantage of urea-formaldehyde glue is that it is brittle and easy to age. What is more serious is that a large amount of formaldehyde will be released during the production process, which will pollute the environment and endanger the health of production workers. Continuous release of free formaldehyde endangers the physical and mental health of users. With the continuous strengthening of people's awareness of health and environmental protection, the harm of urea-f...

Claims

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Application Information

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IPC IPC(8): C09J133/00
Inventor 刘福生
Owner NANJING FORESTRY UNIV
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