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Preparation method of micro member for MEMS

A technology of micro-electronic machinery and micro-components, applied in micro-structure technology, micro-structure device, manufacturing micro-structure device, etc., can solve the problem of high equipment investment, achieve high dimensional accuracy, loose process conditions, and wide application.

Inactive Publication Date: 2005-09-07
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because this technology requires high-energy synchrotron radiation X-rays for lithography, the equipment investment is high, and this technology cannot be widely used.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0009] Embodiment 1. The making of micro-cross:

[0010] 1) Fabrication of microelectronic mechanical photoresist patterns:

[0011] Under the background vacuum degree of 7.0E-3, working air pressure of 5Pa, sputtering power of 110W, target distance of 14 cm, and time of 26 minutes, a metal substrate was sputtered on a silicon substrate by magnetron sputtering ( Substrate material can be selected iron, nickel etc.), present embodiment selects iron substrate for use, and substrate thickness is between 30-100nm; Then clean with deionized water, get rid of the negative photoresist of certain thickness; The patterned chromium plate is used as a mask, and ultraviolet light with a wavelength of 400nm is used as the exposure light source, and the exposure time is 45s. This embodiment adopts wet development, and the developing solution is the RFX-2277 negative film developing solution produced by Suzhou Ruihong Electronic Chemicals Co., Ltd., a Sino-Japanese joint venture. ethyl est...

Embodiment 2

[0024] Embodiment 2. The making of microgear nickel member:

[0025] 1) Fabrication of microelectronic mechanical photoresist patterns:

[0026] Under the conditions of background vacuum degree of 6.0E-3, working pressure of 10Pa, sputtering power of 200W, target distance of 20cm, and time of 50 minutes, a layer of metal nickel substrate was sputtered on the silicon substrate by magnetron sputtering method. , the thickness of the substrate is between 30-100nm; then wash it with deionized water; use a negative photoresist, use a chromium plate with a micro-gear pattern as a mask, and use ultraviolet light with a wavelength of 400nm as the exposure light source, and the exposure time is 90s . This embodiment adopts wet development, and the developing solution is the RFX-2277 negative film developing solution produced by Suzhou Ruihong Electronic Chemicals Co., Ltd., a Sino-Japanese joint venture. ethyl ester, and then washed with deionized water to obtain a negative photoresis...

Embodiment 3

[0039] Embodiment 3. The making of micro-gear-shaped metal member:

[0040] 1) Fabrication of microelectronic mechanical photoresist patterns:

[0041] Under the conditions of background vacuum ≥ 5.0E-3, working pressure 0.1Pa, sputtering power 20W, target distance 5 cm, time 5 minutes, sputter a layer of metal substrate on silicon substrate by magnetron sputtering method (substrate material can be selected iron, nickel etc. for use), present embodiment selects iron substrate for use, and substrate thickness is between 30-100nm; Then clean with deionized water, with negative photoresist; The chromium plate is used as a mask, and ultraviolet light with a wavelength of 400nm is used as the exposure light source, and the exposure time is 60s. In this embodiment, wet development is adopted. After development, fixation is carried out in a fixing solution, and then washed with deionized water to obtain a negative photoresist pattern on the substrate.

[0042] 1) Fabrication of mic...

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PUM

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Abstract

The invention discloses the micro-component preparation method for micro-electronic mechanic system use. The method is: clean the substrate of the component, then put it in the chemical casting liquor to cast nickel, at last remove the negative photo resist on the casting catalyzing base to get the micro-component. The invention has wide adaptation range. The substrate is only required smooth. The invention uses chemical casting replacing the electric casting, so as to the technique is simple and the cost is low. The invention has little requirements for the technique conditions and the finished products ratio is high.

Description

technical field [0001] The invention relates to a method for preparing a microcomponent for a microelectromechanical system. Background technique [0002] MEMS is the result of the combination of microelectronics technology, machinery and optics. It is a new technology emerging in the early 1990s and another revolutionary experiment in the application of microelectronics technology. MEMS is expected to become a key device in many industrial fields, including information and communication technology, automobiles, measurement tools, biomedicine, electronics, etc. There are three main processing technologies for manufacturing MEMS. The first is the use of chemical corrosion or integrated circuit technology to process silicon materials represented by the United States to form silicon-based MEMS devices; the second is based on Japan. The method represented by using traditional mechanical processing methods, that is, using large machines to create small...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00
Inventor 蒋建清杨长勇于金董岩方峰
Owner SOUTHEAST UNIV
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