Diffusion soldering method capable of making copper-aluminium joint binding strength high
A technology combining strength and brazing method, applied in the direction of welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problems of high cost and limitation, achieve short production cycle, low manufacturing cost, and realize mass production Effect
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Embodiment 1
[0023] Embodiment 1: the red copper plate C11000 (T of thickness 1mm 2 ) and vacuum diffusion brazing of pure aluminum plate 1035 (L4) with a thickness of 6mm, the length of the workpiece is 80mm, and the width is 60mm.
[0024] The specific process steps are as follows:
[0025] Before welding, immerse the pure aluminum plate 1035 and Al-Si-Mg solder in 30% nitric acid (with a concentration of 58%-62% NHO) at 25-30°C 3 + pure water preparation) in aqueous solution, soak for 8 to 12 minutes (12 minutes for aluminum plate, 8 minutes for flake Al-Si-Mg solder), remove the oil stain and oxide film on the surface, and then rinse with cold water and hot water, Blow dry with hot air; put the red copper plate in 10% NaOH aqueous solution with a mass volume percentage of 80-90°C, soak for 10 minutes, take it out and rinse its surface with clean water, after drying, place it in a solution containing a mass volume percentage of 10% Dip in 2% sodium carbonate and 12.5% sulfuric acid ...
Embodiment 2
[0027] Embodiment 2: the red copper plate C11000 (T of thickness 2mm 2 ) and vacuum diffusion brazing of anti-rust aluminum plate 3A12 (LF21) with a thickness of 4mm, workpiece size: copper plate 60mm×40mm, aluminum plate 100mm×40mm.
[0028] The specific process steps are as follows:
[0029] Before welding, immerse the anti-rust aluminum plate 3A12 and Al-Si-Mg solder into 30% nitric acid (with a concentration of 58% to 62% NHO 3 +Purified water preparation) aqueous solution, at 28~35℃ for 10~12min (12min for aluminum plate, 10min for flake Al-Si-Mg brazing material), remove the oil stain and oxide film on the surface, and then rinse with cold water 1. After rinsing with hot water, dry; place the red copper plate in a 10% NaOH aqueous solution with a mass volume percentage of 85°C, soak for 8 minutes, take it out and rinse its surface with clean water, dry it, and then place it in a Immerse in an aqueous solution of 3% sodium carbonate and 12.5% sulfuric acid at a temper...
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