Positive photosensitive resin composition

A technology of photosensitive resin and composition, applied in the directions of optics, optomechanical equipment, and photosensitive materials for optomechanical equipment, etc., can solve the problems of insufficient effect, difficulty, change in shape of relief pattern of PBO precursor, etc., Achieves the effect of less change in properties, good shape of hardened relief pattern, and excellent scum removal

Active Publication Date: 2006-08-16
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its effect is not sufficient, especially when the molecular weight of the PBO precursor is large, people are looking for a substance that does not cause development residue (scum) and can exert the effect of suppressing film reduction.
[0009] In addition, although the relief pattern formed by the developed PBO precursor can be converted into a hardened relief pattern formed by a heat-resistant PBO resin by heat treatment, there is also the following problem: Unhardened PBO precursor flow, large changes in relief pattern shape
[0010] Furthermore, when the composition is stored at room temperature or the like, various properties such as sensitivity and developing time change greatly, and there is a problem that it is difficult to use it in a process under the same conditions.

Method used

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  • Positive photosensitive resin composition
  • Positive photosensitive resin composition
  • Positive photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

reference example 1

[0086] Reference Example 1

[0087] In a multi-necked flask (separable flask) with a capacity of 3 L, 183.1 g (0.5 moles) of 2,2'-bis(3-amino-4-hydroxyphenyl) hexafluoropropane, 640.9 g of N,N-Dimethylacetamide (DMAC), 63.3 g (0.8 moles) of pyridine, formed a homogeneous solution. 118.0 g (0.4 mol) of 4,4'-diphenyl ether diformyl chloride dissolved in 354 g of diethylene glycol dimethyl ether (DMDG) was added dropwise thereto from a dropping funnel. At this time, the multi-necked flask was cooled in a water bath at 15 to 20°C. The time required for the dropwise addition was 40 minutes, and the temperature of the reaction liquid was at most 30°C.

[0088] After 3 hours of dripping, add 30.8g (0.2 moles) of 1,2-cyclohexyl dicarboxylic anhydride to the reaction solution, leave it for 15 hours with stirring at room temperature, and block all of the polymer chain with carboxycyclohexyl amide groups. 99% of amine end groups. The reaction rate at this time can be easily calculat...

reference example 2

[0090] Reference Example 2

[0091] In a multi-necked flask with a capacity of 2L, mix and stir 197.8g (0.54 mole) 2,2'-bis(3-amino-4-hydroxyphenyl)-hexafluoropropane, 75.9g (0.96 mole) at room temperature (25°C) Pyridine, 692g of DMAC were dissolved. 19.7 g (0.12 mol) of 5-norbornene-2,3- dicarboxylic anhydride was dissolved in 88 g of DMDG, and was added dropwise thereto from a dropping funnel. The time required for the dropwise addition was 40 minutes, and the temperature of the reaction liquid was 28° C. at the maximum.

[0092] After the dripping is over, heat with a hot water bath at 50°C and stir for 18 hours, measure the infrared spectrum of the reaction solution, and confirm that there are 1385 and 1772 cm -1 The characteristic absorption of the imino group.

[0093] Then, it was cooled to 8°C in a water bath, and 142.3 g (0.48 mol) of 4,4'-diphenyl ether dicarboxylic dichloride dissolved in 398 g of DMDG was added dropwise thereto from a dropping funnel. The tim...

Embodiment 1～3 and comparative example 1～2

[0094] Examples 1-3 and Comparative Examples 1-2

[0095] 100 parts by mass of the hydroxyl polyamide (P-1 or P-2) obtained in each of the above-mentioned reference examples, 20 parts by mass of a photosensitive diazoquinone compound having the structure of the following formula Q-1, 10 parts by mass of the compound of the following formula F The phenolic compounds of -1 to F-4 structures were dissolved in 170 parts by mass of GBL, and then filtered through a 0.2 μm filter to prepare the positive photosensitive resins of Examples 1 to 3 and Comparative Examples 1 to 2 described in Table 1. combination.

[0096]

[0097]

[0098] (1) Evaluation of composition characteristics

[0099] The above-mentioned positive photosensitive resin composition was spin-coated on a 5-inch silicon wafer with a spin coater (Dspin636) manufactured by Dainippon Sculin Manufacturing Co., Ltd., and pre-baked at 130° C. for 180 seconds with a hot plate. A coating film of 10.7 μm was formed. T...

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PUM

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Abstract

Disclosed is a positive photosensitive resin composition which comprises 100 parts by mass of a hydroxy polyamide, 1-30 parts by mass of a phenolic compound having only one benzene ring, and 1-100 parts by mass of a photosensitive diazoquinone compound.

Description

technical field [0001] The present invention relates to a positive-type photosensitive resin composition used as a surface protection film and an interlayer insulating film of a semiconductor device, a method for producing a heat-resistant cured relief pattern using the positive-type photosensitive resin composition, and A semiconductor device having the hardened relief pattern. Background technique [0002] Conventionally, polyimide resins having excellent heat resistance, electrical characteristics, mechanical characteristics, etc. have been used for surface protection films and interlayer insulating films of semiconductor devices. This polyimide resin is generally supplied in the form of a photosensitive polyimide precursor composition, coated, patterned with active light, developed, thermal imidization, etc., and can be used in semiconductors. It is easy to form a surface protection film, an interlayer insulating film, etc. on a device, and it has the feature that the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/037G03F7/022G03F7/004G03F7/023H01L21/027
CPCG03F7/0233
Inventor 佐佐木隆弘藤山英之
Owner ASAHI KASEI KK
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