Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Sn-Cu-Cr lead-free soldering material and its preparation

A lead-free solder, sn-cu-cr technology, applied in welding equipment, welding/cutting medium/material, welding medium, etc., can solve unsatisfactory anti-oxidation and corrosion performance, cost increase, alloy melting point, welding reliability , process yield and insufficient oxidation resistance

Inactive Publication Date: 2007-01-17
BEIJING COMPO ADVANCED TECH
View PDF0 Cites 23 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Sn-Ag-Cu solder containing 3 to 4% silver can provide good reliability and process yield, but the oxidation and corrosion resistance is not satisfactory, and the cost is increased due to the inclusion of precious metals; Sn-Cu eutectic solder and Its modified alloy is cheap and easy to obtain, but it has deficiencies in alloy melting point, welding reliability, process yield and oxidation resistance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sn-Cu-Cr lead-free soldering material and its preparation
  • Sn-Cu-Cr lead-free soldering material and its preparation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The preparation of embodiment 1 Sn-Cu0.7-Cr0.3:

[0024] According to the weight percentage, Cu is 0.7% and Cr is 0.3%. Prepare 5.0kg of Sn-Cu10 master alloy and 5.0kg of Sn-Cr7.5 master alloy in a vacuum medium-frequency induction melting furnace. During the preparation process: ① first melt the weighed pure Sn in a vacuum induction melting furnace to 650°C, Add the weighed pure Cu flakes, stir and melt until the furnace temperature is 500-600°C, stir and keep warm for 10 minutes, pour into a square ingot to prepare a Sn-Cu10 master alloy; ②First put the weighed pure Sn in a vacuum medium frequency induction furnace Melt, add the weighed pure Cr block, stir and melt until the furnace temperature is 1300-1400°C, stir and keep warm for half an hour, pour into a square ingot to prepare a Sn-Cr7.5 alloy; analyze the uniformity of each master alloy composition. Take 14.0g of Sn-Cu10 master alloy, 8.00g of Sn-Cr7.5 master alloy, and 178.0g of pure Sn. Then melt pure Sn in ...

Embodiment 2

[0025] The preparation of embodiment 2 Sn-Cu0.2-Cr0.1:

[0026] Proportion calculated by weight percentage, Cu is 0.2%, Cr is 0.1%. The preparation of the master alloy is the same as in Example 1. Weigh 4.0g of Sn-Cu10 master alloy, 2.70g of Sn-Cr7.5 master alloy, and 193.3g of pure Sn. First melt pure Sn in a resistance furnace and heat it to 300°C, then add Sn-Cu10 master alloy and Sn-Cr7.5 master alloy in turn, heat it to 300°C and keep it for 10 minutes, pour it into a cylindrical mold, and wait until the ingot is completely solidified Then remelt the ingot to 300°C and keep it warm for 10 minutes, pull out the surface oxide slag, and pour it into a mold to make an ingot for use.

Embodiment 3

[0027] The preparation of embodiment 3 Sn-Cu0.9-Cr0.6:

[0028] Proportion calculated by weight percentage, Cu is 0.9%, Cr is 0.6%. The preparation of the master alloy is the same as in Example 1. Weigh 18.0g of Sn-Cu10 master alloy, 16.0g of Sn-Cr7.5 master alloy, and 166.0g of pure Sn. First melt pure Sn in a resistance furnace and heat it to 300°C, then add Sn-Cu10 master alloy and Sn-Cr7.5 master alloy in turn, heat it to 300°C and keep it for 10 minutes, pour it into a cylindrical mold, and wait until the ingot is completely solidified Then remelt the ingot to 300°C and keep it warm for 10 minutes, pull out the surface oxide slag, and pour it into a mold to make an ingot for use.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A lead-free Sn-Cu-Cr solder is proportionally prepared from Cu, Cr, alloy of one or more of Ga, Bi, In, Ni, P, Ge, Ag, Al, Sb, Zn and RE, and Sn through smelting in vacuum or protecting atmosphere to preparing intermediate alloys Sn-Cu, Sn-Cr and Sn-Ag, and proportional smelting.

Description

technical field [0001] A chromium-containing lead-free solder and a preparation method thereof belong to the technical field of tin-based lead-free solder manufacture. Background technique [0002] Sn-Pb solder has long been used as a packaging connection material due to its good soldering performance, reliable process, stable use, and low manufacturing cost; however, with people's awareness of environmental protection and higher requirements for material performance, the existing lead-containing The issue of solder substitutes is imminent. As a new type of lead-free electronic packaging solder, it should have good process performance (low melting point, small melting range, good wettability, good corrosion and oxidation resistance, good mechanical properties, good conductivity), high process yield ( Fast spreading speed, high welding yield, high slag forming rate), good reliability of solder joints (high bonding strength of solder joints, good creep resistance), low cost, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26C22C1/03
Inventor 张富文贺会军杨福宝胡强朱学新徐骏石力开
Owner BEIJING COMPO ADVANCED TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com