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Method of preparing ultra low dielectric constant polyimide membrane by polyamide ester precursor phase transformation

An ultra-low dielectric constant, polyimide film technology, applied in the field of preparation of polymer dielectric materials, can solve the problems of high cost, difficult to scale, complex preparation method, etc., and achieves low cost, simple process and equipment , good thermal stability

Inactive Publication Date: 2007-03-07
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] The purpose of the present invention is to provide a method for preparing ultra-low dielectric constant polyimide film by phase transformation of polyamide ester precursor, so as to solve the problem of complex preparation method, high cost and difficult scale of existing low dielectric constant polyimide film. the problem of

Method used

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  • Method of preparing ultra low dielectric constant polyimide membrane by polyamide ester precursor phase transformation
  • Method of preparing ultra low dielectric constant polyimide membrane by polyamide ester precursor phase transformation
  • Method of preparing ultra low dielectric constant polyimide membrane by polyamide ester precursor phase transformation

Examples

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Embodiment 1

[0056] Example 1: The various implementation conditions and the structure and performance of the obtained ultra-low dielectric constant polyimide film are shown in Table 1.

[0057]

Embodiment 2

[0058] Example 2: The various implementation conditions and the structure and properties of the obtained ultra-low dielectric constant polyimide film are shown in Table 2.

[0059]

Embodiment 3

[0060] Example 3: The various implementation conditions and the structure and properties of the obtained ultra-low dielectric constant polyimide film are shown in Table 3.

[0061]

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Abstract

The invention discloses a preparing method of ultra-low dielectric constant polyimide film, which comprises the following steps: dissolving polyesteramide in the N, N-dimethyl acetamide, N, N-dimethyl formamide or N-methyl pyrrolidone to obtain the filming liquid with density at 15-30%; filtering the filming liquid; degassing; scraping on the stainless steel support to form liquid film with thickness at 50-500 um; solidifying support with liquid film in the hardening bath; immersing film to clean through alcohol or acetone; drying to obtain former film of polyesteramide; disposing the former film of polyesteramide in the nitrogen or argon gas to heat to obtain the product.

Description

technical field [0001] The technical field of the invention is the preparation technology of polymer dielectric materials, in particular to a method for preparing ultra-low dielectric constant polyimide film by phase inversion of polyamide ester precursor. Background technique [0002] In recent years, with the continuous development of the electronics and microelectronics industries, the integration of electronic and electrical equipment and its components has continued to increase, the device density and connection density have increased, and the line width has decreased, resulting in increased resistance-capacitance coupling and delayed signal or energy transmission. The increase in time, line loss, and interference noise of signals or energy between different lines directly affects the performance of equipment and components. In order to shorten the cycle time of signals and energy between conductor lines, reduce transmission lag, cross-interference and capacitive coupli...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L79/08C08G73/10
Inventor 朱宝库张梅徐又一
Owner ZHEJIANG UNIV
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