Process for preparing vanadium oxide film
A technology of vanadium oxide film and sputtering coating, which is applied in ion implantation plating, metal material coating process, coating, etc., can solve difficult problems, achieve excellent performance, reduce process difficulty, and increase repeatability.
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Specific embodiment one
[0019] 1. Using Si plated 3 N 4 The thin-film Si wafer is used as the substrate, and the substrate is cleaned and dried for use before coating.
[0020] 2. Using reactive ion sputtering coating process to prepare vanadium oxide thin film, the specific process conditions are:
[0021] Target material: pure metal vanadium; background vacuum degree: -3 Pa; Sputtering temperature: 200±1℃; O 2 :Ar=1:1.6; working pressure: 2.8±0.6Pa; O during sputtering 2 Flow rate: 2.4sccm; Ar flow rate during sputtering: 3.9±0.2sccm; Sputtering voltage: 240V;
[0022] Dynamic and precise control of the gas flow during the sputtering process until the end of the coating;
[0023] 3. Naturally cool to room temperature in an argon atmosphere.
[0024] The vanadium oxide film prepared according to the above-mentioned embodiment is analyzed by XPS analyzer to be a vanadium oxide mixed phase polycrystalline film based on vanadium dioxide; its resistance-temperature coefficient (TCR)...
Example Embodiment
Specific embodiment two
[0025] Steps 1 and 3 are the same and will not be repeated here; Step 2 is: preparing a vanadium oxide thin film by a reactive ion sputtering coating process, and the specific process conditions are:
[0026] Target material: pure metal vanadium; background vacuum degree: -3 Pa; Sputtering temperature: about 200℃; O 2 :Ar=1:2.0; working pressure: about 2.8Pa; O during sputtering 2 Flow rate: 1.8sccm; Ar flow rate during sputtering: about 3.9sccm; Sputtering voltage: 245V;
[0027] Dynamic and precise control of the gas flow during the sputtering process until the end of the coating;
[0028] The vanadium oxide film prepared according to the above-mentioned embodiment is analyzed by XPS analyzer to be a vanadium oxide mixed phase polycrystalline film based on vanadium dioxide; its resistance-temperature coefficient (TCR) is at 30°C, Achieve more than 5%.
Example Embodiment
Specific embodiment three
[0029] Steps 1 and 3 are the same and will not be repeated here; Step 2 is: preparing vanadium oxide thin films by reactive ion sputtering coating process, the specific process conditions are:
[0030] Target material: pure metal vanadium; background vacuum degree: -3 Pa; Sputtering temperature: about 200℃; O 2 :Ar=1:2.4; working pressure: about 2.8Pa; O during sputtering 2 Flow rate: 1.6sccm; Ar flow rate during sputtering: about 3.9sccm; Sputtering voltage: 250V;
[0031] Dynamic and precise control of the gas flow during the sputtering process until the end of the coating;
[0032] The vanadium oxide film prepared according to the above-mentioned embodiment is analyzed by XPS analyzer to be a vanadium oxide mixed phase polycrystalline film based on vanadium dioxide; its resistance-temperature coefficient (TCR) is at 30°C, Achieve more than 3.2%.
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