Low temperature fast curing adhesive for mounting chip element and device

Abstract

The low temperature fast curing adhesive for mounting chip element and device is compounded with liquid epoxy resin 30-60 wt%, diluent 5-15 wt%, curing agent 8-20 wt%, promoter 2-10 wt%, thixotropic agent 4-12 wt%, plasticizer 5-10 wt%, pigment 1-3 wt% and inorganic filler 0-20 wt%. It has curing period of 80 sec at 120 deg.c and 180 sec at 100 deg.c, adhesion strength of 10-20 MPa, absolute resistivity high than 1013 Ohm. cm, water absorption less than 0.5 %, storage life over 2 months at 20 deg.c, and zero rolling. It is used in the surface mounting of electronic elements and device.

Description

technical field [0001] The invention relates to an adhesive material, in particular to a low-temperature fast-curing adhesive for mounting chip components used in the surface mounting technology of chip components in the electronic industry. technical background [0002] With the rapid development of the electronics industry, the performance requirements for surface mount technology (SMT) adhesives are getting higher and higher. Not only do electronic components require high surface mount strength, high temperature resistance, and good electrical insulation in automated assembly line production, It is suitable for SMT automatic placement machine placement or stencil printing placement, and requires low curing temperature and short time. However, the existing surface mount adhesives for chip components generally need to be cured at 150°C, which will cause damage to some components. For example, the curing time of a chip in a chemical institute is 5 minutes at 150°C, and The ...

AI Technical Summary

Problems solved by technology

However, the existing surface mount adhesives for chip components generally need to be cured at 150°C, which will cause damage to some components. For ...