Lead frame for integrated circuit or discrete components ultra-thin non-pin packing

A technology of discrete components and integrated circuits, applied in the direction of electrical components, circuits, electrical solid devices, etc., can solve the problems of high electroplating cost, discounted flexibility, slow heat dissipation rate, etc., and achieve low material cost, stable quality, and high efficiency. Effect
CN1992252AActive Publication Date: 2007-07-04长电科技管理有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
长电科技管理有限公司
Publication Date
2007-07-04

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Abstract

This invention relates to an IC or discrete component super-thin leg-free packaging leading-line frame, including the substrate, the chip bearing base and the fight line inward-feet bearing base, the chip bearing base and the fight line inward-feet bearing base protruding upward to set up on the substrate surface, and corresponding to the chip bearing base and the fight line inward-feet bearing base, the substrate has corresponding chip region and the fight line inward-feet to depress on the substrate surface; the chip bearing base and the fight line inward-feet base bottom being the metal layer (11,12); above the chip bearing base and the fight line inward-feet base metal layer, first sputtering a metal activation layer (2), and then sputtering a copper metal or alloy layer (31, 32); above the fight line inward-feet bearing base copper metal or alloy layer, sputtering a silver metal, or nickel metal, or palladium metal layer (52). This invention has strong welding performance, excellent quality, lower costs, smoother production, and strong applicability, and for cutting tools and blades, it can play a maximum efficiency, multi-chip arranged flexibly, no plastic infiltration or other various difficulties, and for the environment protection.
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Description

Technical field:

[0001] The invention relates to an integrated circuit or discrete component ultra-thin non-pin packaging process and its packaging structure, in particular to a lead frame for integrated circuit or discrete component ultra-thin non-pin package. It belongs to the technical field of packaging of integrated circuits or discrete components. Background technique:

[0002] The traditional ultra-thin and footless packaging process of integrated circuits or discrete components and its packaging structure, its packaging type is an array-type assembly that is cut into a single unit. Its substrate type is etched. It mainly has the following deficiencies:

[0003] 1. Special adhesive tape is required. In order to prevent the plastic from penetrating into the lead frame during high-pressure encapsulation, increasing the risk of solder joint insulation, and if the post-treatment of plastic penetration occurs, it is easy to destroy the metal layer of the solder joint. A...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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