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Plating solution of palladium alloy and method for plating using the same

a technology of palladium alloy and solution, which is applied in the direction of membranes, cell components, separation processes, etc., can solve the problems of uneven exterior appearance of the plated film, and achieve the effect of high hydrogen permeability and durability

Inactive Publication Date: 2008-03-27
TANAKA PRECIOUS METAL IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0011]In the plating solution of the present invention, the neutral amino acid as a ligand for the palladium complex works to suppress variation of pH level of the plating solution, controlling separation of precipitate or the like. It is therefore possible to deposit a uniform plated film having a constant palladium / metal salt ratio. A uniform plated film has a high mechanical strength and is suitable for hydrogen separation membranes. Moreover, the plating solution has a low environmental load, because of lack of toxic compounds, e.g., cyan.

Problems solved by technology

However, those containing sulfur, e.g., cystine and methionine, may give a plated film of uneven exterior appearances.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

examples 1 to 5

[0028]These examples used respective neutral amino acids of serine, valine, alanine, glycine and leucine as ligands for palladium complexes. The plating treatment was carried out with plating solution compositions and under conditions shown in Table 1.

TABLE 1Solution compositionConcentrationExample 1Palladium saltPalladium chloride(Pd concentration)10g / LGold saltSodium gold sulfite(Au concentration)1g / LNeutral amino acidDL-serine1mol / LStabilizerSodium sulfite50g / LBuffering agentDisodium hydrogen40g / LphosphatePlating conditions . . . pH 9, 60° C., 1 A / dm2Example 2Palladium saltPalladium chloride(Pd concentration)5g / LGold saltSodium gold sulfite(Au concentration)1g / LNeutral amino acidDL-valine1mol / LStabilizerSodium sulfite50g / LBuffering agentsodium carbonate50g / LPlating conditions . . . pH 10, 60° C., 1 A / dm2Example 3Palladium saltPalladium chloride(Pd concentration)5g / LGold saltSodium gold sulfite(Au concentration)1g / LNeutral amino acidDL-alanine0.5mol / LStabilizerSodium sulfite50g / LB...

examples 6 and 7

[0030]These examples used a silver salt and a copper salt as a metal salt, respectively, and the plating treatment was carried out with plating solution compositions and under conditions shown in Table 3.

TABLE 3Solution compositionConcentrationExample 6Palladium saltPalladium chloride(Pd concentration)10g / LSilver saltSilver nitrate(Ag concentration)0.1g / LNeutral amino acidAsparagine0.5mol / LStabilizerSodium thiosulfate50g / LBuffering agentDipotassium hydrogen50g / LphosphatePlating conditions . . . pH 70, 60° C., 1 A / dm2Example 7Palladium saltPalladium chloride(Pd concentration)10g / LCopper saltCopper nitrate(Cu concentration)1.0g / LNeutral amino acidAsparagine0.5mol / LStabilizerDipotassium citrate100g / LBuffering agentDipotassium hydrogen50g / LphosphatePlating conditions . . . pH 7.0, 60° C., 1 A / dm2

[0031]On completion of the plating treatment, each of the thin films of alloy formed was visually observed for the external appearance, and analyzed by ICP emission spectroscopy for eutectoid ra...

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Abstract

The present invention relates to a plating solution of palladium alloy and has an object to provide a plating solution of palladium alloy highly stable and capable of stably forming a plated film of a given alloy composition. The present invention relates to a plating solution of palladium alloy containing a palladium complex and a metal salt, wherein the palladium complex is coordinated with at least one neutral amino acid selected from the group consisting of glycine, alanine, valine, leucine, serine, threonine, asparagine, glutamine and tyrosine as a ligand.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a plating solution of palladium alloy and a method for plating using the same.[0003]2. Description of the Related Art[0004]A plated palladium alloy has been used for dental and decorative purposes, catalysts, electrical contacts, and so forth. It is also used for hydrogen separation membranes, because it selectively absorbs hydrogen and allows it to permeate. It is known that when used for a hydrogen separation membrane, palladium alone tends to suffer hydrogen embrittlement, and is alloyed with Ag, Au or Cu to improve durability while keeping hydrogen permeation capacity for plating.[0005]U.S. Pat. No. 4,048,023 discloses a plating solution of Pd—Au alloy comprising an amine-containing palladium chloride and a gold salt of sulfurous acid. Japanese Patent Laid-Open No. 2005-256129 discloses a plating solution of Pd—Ag alloy which contains palladium and silver ions and at least one of nit...

Claims

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Application Information

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IPC IPC(8): C25D3/56
CPCB01D53/228B01D67/0069C01B3/505B01D2323/48C25D3/567B01D2323/08C25D3/52
Inventor ISHIKAWA, TOMOKOKITADA, KATSUTSUGU
Owner TANAKA PRECIOUS METAL IND
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