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Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the Composite

a technology of metal covering and composites, applied in the direction of superimposed coating process, liquid/solution decomposition chemical coating, transportation and packaging, etc., can solve the problems of kirkendall voids (air gaps) generated, peeling of tin plated layers, and inability to say that the foregoing method is sufficient to solve problems, etc., to achieve effective peeling prevention, effective inhibition of peeling, and superior

Inactive Publication Date: 2010-08-26
JX NIPPON MINING& METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0037]As a result of the above, a metal covered polyimide composite, a method of producing the composite and an apparatus for producing the composite of the present invention can effectively prevent peeling in a non-adhesive flexible laminate (especially a two-layer flexible laminate), particularly can effectively inhibit peeling from the interface of a copper layer and a tin plating, and yield a superior effect of being able to improve the adhesion strength.

Problems solved by technology

However, a problem in that this tin plated layer may peel occurs.
A major cause of such peeling is the Kirkendall voids (air gaps) that are generated between the copper layer and the tin plated layer due to the electroplating process.
In addition, as described later, since a copper layer boundary may occur even with the same electrolytic bath, it cannot be said that the foregoing method is a sufficient solution to the problem.
In addition, with a copper layer in which only the uppermost layer is thick, the other copper layers must be made thin by just that much, and there is a problem in that the balance of the copper layers will be lost.
In light of the above, a zigzag-type electroplating process that requires numerous electroplating baths is undesirable, and it is preferable to reduce the number of electroplating baths as much as possible.
Nevertheless, this drum electroplating method also entails its own problems.
However, at the initial stage of starting the electroplating process, the metal seed layer formed on the polyimide surface is unable to withstand a large current since its thickness is limited.
However, this idea is unrealistic since it merely proposes the use of one anode because the control of the current density for each anode is troublesome.
In other words, besides the supply method being unclear, the flow velocity of the plating solution will be disturbed and it will not be possible to ensure a uniform flow velocity if mesh or the like is disposed, regardless of the supply method that is adopted.
Specifically, with Patent Literature 1, mesh or the like will become an impediment whereby the flow velocity of the plating solution cannot be controlled, and it will be difficult to ensure the uniformity of the amount of electrodeposition in a direction that is parallel to the rotational axis of the drum.
Aside from the problem of Kirkendall voids, this idea relates to the problem of plating uniformity, and it could be said that it is an unrealistic method.
In addition, this technology fails to even recognize the problem of Kirkendall voids.
Accordingly, it could be said that the conventional technologies fail to teach a fundamental solution to the problem of Kirkendall voids that arise between the copper layer and the tin layer.

Method used

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  • Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the Composite
  • Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the Composite
  • Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the Composite

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0086]There is no particular limitation in the material used as the polyimide film. For instance, Upilex by Ube Industries, Kapton by DuPont-Toray, Apical by Kaneka are commercially available, and any one of these polyimide films can be applied in the present invention. The present invention is not limited to this kind of specific variety. In the Examples and Comparative Examples Upilex-SGA by Ube Industries is used as the polyimide film.

[0087]Foremost, the polyimide film was placed in a vacuum apparatus and, after evacuation, the polyimide film was subject to surface modification treatment using plasma.

[0088]Next, a tie-coat layer (Ni-20 wt % Cr) of 25 nm was formed on the foregoing polyimide film surface subject to the plasma treatment by way of sputtering.

[0089]Subsequently, a metal seed layer (copper layer) of 300 nm was formed by sputtering.

[0090]This can also be formed by electroless plating, but sputtering was performed in the Examples.

[0091]Then, the drum-based two bath-type...

example 2

[0100]Next, as with Example 1, the drum-based two bath-type electroplating apparatus shown in FIG. 1 was used to form the copper plated layer wherein, in order to reduce the number of zones, in Cell A, zone 3 and zone 4 were electrically connected, and the distance L between zone 3 and zone 4 was adjusted to be approximately ½ of the distance d between the anode and the plating object in order to form the copper plated layer; and, in Cell B, zone 7 and zone 8 were electrically connected, and the distance L between zone 7 and zone 8 was adjusted to be approximately ½ of the distance d between the anode and the plating object.

[0101]As a result of forming the copper layer, as described above, only a slight plated layer was formed in zone 1 and zone 2 of Cell A. Moreover, no plated layer was formed in zone 5 and zone 6 of Cell B. The results were the same as Example 1.

[0102]Consequently, the copper layer was mainly formed in zone 3, zone 4, and zone 7+zone 8. The results are shown in Ta...

example 3

[0110]Next, in addition to the plating conditions of Example 2, the copper plated layer was formed upon turning off the current of zone 1 and zone 2. In turning off the current of zone 1 and zone 2, dummy anodes prepared with an insulating material in the same shape was disposed in place of the normal anodes in zone 1 and zone 2.

[0111]As a result of forming the copper layer, in Cell A, a plated layer was not formed in zone 1 and zone 2. In addition, in Cell B also, a plated layer was not formed in zone 5 and zone 6.

[0112]Consequently, a copper layer was formed in zone 3+zone 4, and zone 7+zone 8. The results are shown in Table 3. As shown in Table 3, a copper plated layer of 4.25 μm was formed in zone 3+zone 4, and that of 4.25 μm in zone 7+zone 8.

[0113]By way of reference, it was 0 μm in zone 1 and zone 2 and 0 μm in zone 5 and zone 6.

TABLE 3Zone123 + 4567 + 8Thickness0.000.004.250.000.004.25Thickness: Plating thickness (μm) per zone

[0114]The cross section of the copper layer obtai...

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PUM

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Abstract

Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating, wherein the copper plated layer or copper alloy plated layer includes three layers to one layer of the copper layer or copper alloy layer. The provided metal covered polyimide composite can effectively prevent peeling in a non-adhesive flexible laminate (especially a two-layer flexible laminate), particularly can effectively inhibit peeling from the interface of a copper layer and tin plating. Additionally provided are a method of producing the composite and an apparatus for producing the composite.

Description

TECHNICAL FIELD[0001]The present invention relates to a metal covered polyimide composite for use as a mounting material of electronic components such as a flexible print substrate, TAB, COF (Chip on Film), and additionally relates to a method of producing the composite and an apparatus for producing the composite.BACKGROUND ART[0002]An FCCL (Flexible Copper Clad Laminate), in which metal conductor layers primarily formed from copper are laminated on a polyimide film, is broadly used as a circuit board material in the electronics industry. Among the above, a non-adhesive flexible laminate (especially a two-layer flexible laminate) that does not include an adhesive layer between a polyimide film and a metal layer is catching attention on the demands of finer pitches of the circuit wiring width.[0003]As a method of producing a non-adhesive flexible laminate; in particular a non-adhesive flexible laminate capable of accommodating fine pitches, primarily performed is a so-called metaliz...

Claims

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Application Information

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IPC IPC(8): B32B15/01B32B15/20C25D5/10C25D5/12C25D17/00H05K3/06
CPCC23C18/1601Y10T428/12903C23C28/023C25D5/10C25D7/0635H05K1/0346H05K3/022H05K3/241H05K3/388H05K2201/0154H05K2203/1476H05K2203/1545C23C28/021C23C28/028Y10T428/12847Y10T428/1291C23C18/1653C25D5/617
Inventor KOHIKI, MICHIYAMICHISHITA, NAONORIMAKINO, NOBUHITO
Owner JX NIPPON MINING& METALS CORP