Adhesive composition, adhesive sheet, and back grinding method for semiconductor wafer

Inactive Publication Date: 2011-06-16
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0012]In the present invention, by using isobonyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the composition; and a backgrinding meth

Problems solved by technology

Moreover, as the diameter of the wafer increases, wafer damage such as wafer contamination and cracks frequently occur during the backgrinding process.
However, details d

Method used

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  • Adhesive composition, adhesive sheet, and back grinding method for semiconductor wafer
  • Adhesive composition, adhesive sheet, and back grinding method for semiconductor wafer
  • Adhesive composition, adhesive sheet, and back grinding method for semiconductor wafer

Examples

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example 1

[0061]A monomer mixture (100 parts by weight) comprising isobonyl acrylate, methyl acrylate, ethyl acrylate, n-butyl acrylate and 2-hydroxyethyl acrylate was prepared such that 5 parts by weight of isobonyl acrylate (IBOA) were contained in the mixture, and the glass transition temperature of the polymer prepared from the mixture was −25° C. Then, the monomer mixture was polymerized to prepare an acrylic pressure-sensitive adhesive polymer having a solid content of 45 weight %. Next, an isocyanate cross-linking agent was added to the prepared pressure-sensitive adhesive polymer in an amount of 2 parts by weight, relative to 100 parts by weight of the pressure-sensitive adhesive polymer. The resultant was applied to an ethylene-acetic acid vinyl copolymer film having a thickness of 80 μm, and then dried, thus preparing a pressure-sensitive adhesive layer (thickness: 20 μm). The prepared pressure-sensitive adhesive sheet was aged for 2 hours at 50° C., and then subjected to tests to b...

example 2

[0062]Except for the fact that a monomer mixture (100 parts by weight) comprising isobonyl acrylate, methyl acrylate, ethyl acrylate, n-butyl acrylate and 2-hydroxyethyl acrylate was used such that 10 parts by weight of isobonyl acrylate (IBOA) were contained therein and the glass transition temperature of the polymer prepared from the mixture was −9° C., the pressure-sensitive adhesive sheet was prepared in the same manner as Example 1.

example 3

[0063]Except for the fact that a monomer mixture (100 parts by weight) comprising isobonyl acrylate, methyl acrylate, ethyl acrylate, n-butyl acrylate and 2-hydroxyethyl acrylate was used such that 20 parts by weight of isobonyl acrylate (IBOA) were contained therein and the glass transition temperature of the polymer prepared from the mixture was −1° C., the pressure-sensitive adhesive sheet was prepared in the same manner as Example 1.

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Abstract

The present invention relates to a pressure-sensitive adhesive composition including a polymer of a monomer mixture containing isobonyl (meth)acrylate, a pressure-sensitive adhesive sheet, and a semiconductor wafer backgrinding method. In the present invention, by using isobonyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition; and a backgrinding method using the pressure-sensitive adhesive sheet can be provided.

Description

TECHNICAL FIELD[0001]The present invention relates to a pressure-sensitive adhesive composition, a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition, and a backgrinding method using the pressure-sensitive adhesive sheet.BACKGROUND ART[0002]With the recent tendency towards miniaturization and weight-reduction of electronic products, there is an increasing demand for leadless, thin-film, and high-integration chip semiconductor packages. To meet the demand, a need for large-diameter thin-film wafers included in the semiconductor packages is also increasing.[0003]In order to effectively cope with the tendency towards large diameter thin-film semiconductor wafers, it is important to precisely control a backgrinding process, which is a wafer grinding process, and a dicing process, which is a reorganizing process. To this end, high-performance techniques capable of controlling these processes are required. The backgrinding process involves mech...

Claims

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Application Information

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IPC IPC(8): C08F220/28C09J7/02B32B33/00B32B38/00C09J7/22C09J7/38
CPCC08F220/18Y10T428/1476C09J7/0246C09J133/04C09J133/08C09J133/10C09J2201/606C09J2203/326C09J2423/006C09J2427/006C09J2433/00C09J2467/006C09J2475/006C09J4/06Y10T428/264Y10T428/266Y10T428/2891C08F220/14C08F2220/1808C08F2220/1825C08F2220/281H01L21/6836H01L2221/68327H01L2221/6834C09J7/38C09J7/22C09J2301/302C08F220/1802C08F220/1811C08F220/1804C08F220/20C09J133/06
Inventor KIM, SE RABAEK, YOON JEONGKIM, JANG SOONLEE, JAE KWANPARK, HYUN WOO
Owner LG CHEM LTD
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