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Architected liquid metal networks and processes of making and using same

a liquid metal network and liquid metal technology, applied in the direction of printed circuit aspects, circuit bendability/stretchability, conductive pattern formation, etc., can solve the problems of many conductors being subject to forces, losing their ability to conduct current, so as to improve overall performance

Pending Publication Date: 2020-05-07
GOVERNMENT OF THE UNITED STATES AS REPRESENTED BY THE SEC OF THE AIR FORCE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent is about creating liquid metal networks that have better control over their electrical, electromagnetic, and thermal properties when they're stretched. As a result, these networks can perform better and be more easily processed.

Problems solved by technology

Many conductors are subject to forces, such as strain, during their use cycle.
As conductors elongate under strain, they start to lose their ability to conduct current.
Once the conductors break, they lose their ability to conduct current.
Unfortunately, such liquid metal conductive systems typically must be activated and / or require materials that comprise ligands.
Such ligands are typically organics that add processing complexity and / or may contaminate other electronic components.
Applicants recognized that the source of the aforementioned problems lie in the fact that liquid metal conductive systems are random self-assembled networks that, do to their random nature, cannot provide the desired spatial control of electrical, electromagnetic, and thermal properties as a function of strain.

Method used

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  • Architected liquid metal networks and processes of making and using same
  • Architected liquid metal networks and processes of making and using same

Examples

Experimental program
Comparison scheme
Effect test

example 1

Production of 11-Phosphonoundecyl Acrylate Functionalized EGaIn Liquid Metal Encapsulates

[0107]Gallium and Indium were combined to produce a eutectic liquid alloy of GaIn (14.2 atom % In, 85.8 atom % Ga). A total of 9 milligrams of the ligand 11-phosphonoundecyl acrylate was dissolved in 10 milliliters of ethanol (200 proof, anhydrous USP) and added to a 20 milliliters glass vial containing 200 milligrams of the GaIn alloy. The mixture was sonicated in an ultrasonic bath at 45° C. for two hours to produce GaIn particles having a number average diameter of about 3 microns. The resulting colloidal solution was centrifuged at 2600 RCF for 3 minutes and the supernatant was removed and replaced. This process was repeated three times, after which the particles were suspended in 4 milliliters of ethanol.

example 2

Production of 12-Azidododecylphosphonic Acid Functionalized EGaIn Liquid Metal Encapsulates

[0108]To produce nanoscale EGaIn-based liquid metal encapsulates functionalized with 12-azidododecylphosphonic acid, a multi-functional ligand molecule, 0.1 milliliters of EGaIn (14.2 atom % In, 85.8 atom % Ga) was placed into a 20 milliliters, 28 millimeters outer diameter borosilicate glass scintillation vial containing 14.9 milliliters absolute ethanol. A 3 millimeters ultrasonic probe microtip driven by a Sonics and Materials, Inc. VCX500 ultrasonic processor was then immersed approximately half of the vial height into the ethanol. Parafilm was then used to seal the vial opening as completely as possible to minimize solvent loss during ultrasonication. Sonication was then carried out for two hours at an amplitude of 17% while the vial temperature was held constant at a temperature of 10° C. using a water bath to produce nanoscale EGaIn particles having a number average diameter of about 16...

example 4

Production of 11-Mercaptoundecanoic Acid Functionalized EGaIn Liquid Metal Encapsulates

[0112]11-mercaptoundecanoic acid functionalized particles were made by placing 0.1 milliliters of EGaIn liquid metal into a 20 milliliters, 28 millimeters outer diameter borosilicate scintillation vial. To this vial was added 14.9 milliliters of a 64 millimolar solution of 11-mercaptoundecanoic acid in absolute ethanol. A 3 millimeter ultrasonic probe microtip driven by a Sonics and Materials, Inc. VCX500 ultrasonic processor was then immersed approximately half of the vial height into the ethanol. Parafilm was then used to seal the vial opening as completely as possible to minimize solvent loss during ultrasonication. Sonication was then carried out for sixteen hours at an amplitude of 30% while the vial temperature was held constant at a temperature of 10° C. using a water bath to produce nanoscale EGaIn particles having a number average diameter of about 60 nanometers. Excess ligand was removed...

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PUM

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Abstract

The present invention relates to architected liquid metal networks and processes of making and using same. The predetermined template design technology of such architected liquid metal networks provides the desired spatial control of electrical, electromagnetic, and thermal properties as a function of strain. Thus, resulting in improved overall performance including process ability.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]The present application claims priority to U.S. Provisional Application Ser. No. 62 / 754,624 filed Nov. 2, 2018, U.S. Provisional Application Ser. No. 62 / 754,631 filed Nov. 2, 2018, U.S. Provisional Application Ser. No. 62 / 754,635 filed Nov. 2, 2018, the contents of which are hereby incorporated by reference in their entry.RIGHTS OF THE GOVERNMENT[0002]The invention described herein may be manufactured and used by or for the Government of the United States for all governmental purposes without the payment of any royalty.FIELD OF THE INVENTION[0003]The present invention relates to architected liquid metal networks and processes of making and using same.BACKGROUND OF THE INVENTION[0004]Many conductors are subject to forces, such as strain, during their use cycle. As conductors elongate under strain, they start to lose their ability to conduct current. Once the conductors break, they lose their ability to conduct current. In response to this p...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/09H05K3/10
CPCH05K3/10H05K2203/1131H05K2201/0245H05K1/09H05K2203/1105H05K1/0283H05K2201/0314H05K2201/0224H05K1/092H05K2203/0783H05K3/22
Inventor THRASHER, CARL J.TABOR, CHRISTOPHER E.FARRELL, ZACHARY J.MORRIS, NICHOLAS J.YUEN, MICHELLE CHING-SUM
Owner GOVERNMENT OF THE UNITED STATES AS REPRESENTED BY THE SEC OF THE AIR FORCE