The invention relates to the technical field of
chip mounting detection, in particular to a
chip mounting position identification method based on
thermocompression bonding equipment. According to the method, the key point temperature, strain, collection coordinates and initial mounting coordinates are collected through the preset position deployment parameter collection group, the dynamic
error correction model based on the AEKF
algorithm is subjected to
state prediction, Kalman
gain calculation and state updating to output the x / y / z axis
thermal deformation offset, dynamic
thermal deformation compensation is achieved, the mounting position recognition precision is improved, and the mounting precision is improved. The core problem of data
distortion caused by uncompensated deviation in the prior art is solved; according to the method, the four-dimensional
association mapping system is established and associated with the defect monitoring and abnormity tracing
system, the matching fit total value is output based on the
chip characteristic three-dimensional
coupling calculation, then the
equipment state adaptation information is obtained, the equipment parameters are adjusted, the mounting stability of different types of chips is guaranteed, and the defect rate of a complex packaging scene is reduced.