Integrated electronic module preparing method capable of improving electrode end-face reliability

Abstract

The invention provides a method of making the integrating electrical components that can improve the reliability of electrode end surface. The method comprises the steps of making body, insulating cover layer on body, double poles and making electroplating welding interface. The method of making insulating cover layer by using nano insulating hole sealing materials to cover hex-surface coating components improves the insulating impedance of integrating electrical components and the reliability of electrode end surface. After high sintering, the insulating materials adhere to the surface of component body uniformly. The high insulating impedance of the nano-insulating hole sealing materials can improve the insulating impedance of components' surface and electric plating is feasible.

Description

technical field [0001] The invention relates to a manufacturing method of an integrated electronic component, in particular to a manufacturing method of an integrated electronic component capable of improving the reliability of an electrode end face. Background technique [0002] In terms of the current booming trend and application of the 3C industry, in order to meet the market demand for all electronic and electrical products to be thin, light and small, it is no doubt that all electronic components must also establish a multi-style, light and short design concept. Traditional electronic components have few space and scope considerations, so the matching electronic and electrical products are relatively bulky and occupy more space. Integrated electronic components are also one of the main electronic component products developed in response to market demand, such as resistors, capacitors, inductors, metal oxide varistors, thermistors, etc., which can be easily found in cur...

AI Technical Summary

Problems solved by technology

However, although this integrated electronic component processing method improves the previous one-by-one insulating layer processing, the subsequent production still requires mechanical grinding of the two terminal electrode surfaces one by one, which is still a slow and low-yield manufacturing method. To meet the demand, it is still necessary to invest in grinding equipment for processing, which is also an expensive and inefficient production method

[0008] The above method of manufacturing integrated electronic components is the current manufacturing method uniformly adopted by the industry, and there are still differences in the manufacturing methods formed under the constraints of different component materials. As can be seen from the above description, the product body made of ceramic materials has more obvious advantages , for example: the structure of the product body is high, the body has high resistivity, and the subsequent electroplating process can be directly performed, etc., while the products made of oxidized metal have weaker advantages, such as: the material body has low resistivity and poor structure compactness , After the end face of the electrode is completed, the reliability of the welding surface cannot be improved by electroplating, so that the previous material characteristics cannot provide high surface resistivity and the electroplating project of the welding surface of the end electrode

[0009] Taking metal oxide varistors as an example, in order to achieve high insulation resistance and improve the reliability of the electrode end face, it needs to invest a lot of equipment and production manpower before it can be mass-produced, so this kind of production method still has great improvement space

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