Integrated electronic module preparing method capable of improving electrode end-face reliability

Abstract

The invention provides a method of making the integrating electrical components that can improve the reliability of electrode end surface. The method comprises the steps of making body, insulating cover layer on body, double poles and making electroplating welding interface. The method of making insulating cover layer by using nano insulating hole sealing materials to cover hex-surface coating components improves the insulating impedance of integrating electrical components and the reliability of electrode end surface. After high sintering, the insulating materials adhere to the surface of component body uniformly. The high insulating impedance of the nano-insulating hole sealing materials can improve the insulating impedance of components' surface and electric plating is feasible.

Description

technical field

[0001] The invention relates to a manufacturing method of an integrated electronic component, in particular to a manufacturing method of an integrated electronic component capable of improving the reliability of an electrode end face. Background technique

[0002] In terms of the current booming trend and application of the 3C industry, in order to meet the market demand for all electronic and electrical products to be thin, light and small, it is no doubt that all electronic components must also establish a multi-style, light and short design concept. Traditional electronic components have few space and scope considerations, so the matching electronic and electrical products are relatively bulky and occupy more space. Integrated electronic components are also one of the main electronic component products developed in response to market demand, such as resistors, capacitors, inductors, metal oxide varistors, thermistors, etc., which can be easily found in cur...

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