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Method for preparing printed circuit board and light emitting diode

A technology of light-emitting diodes and printed circuit boards, which is applied in the direction of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve problems such as low efficiency, and achieve the effect of improving the success rate and uniform surface

Inactive Publication Date: 2009-12-23
EVERLIGHT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The first light-emitting diode was made by Holonyak in the 1960s with gallium arsenic phosphide. At that time, it was displayed in red light, and the efficiency was quite weak, only 0.1lm / W.

Method used

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  • Method for preparing printed circuit board and light emitting diode
  • Method for preparing printed circuit board and light emitting diode
  • Method for preparing printed circuit board and light emitting diode

Examples

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Embodiment Construction

[0016] Figure 1-4 A partial enlarged view of a printed circuit board for light-emitting diodes at various manufacturing stages is shown according to a preferred embodiment of the present invention. Please refer to figure 1 Firstly, a conductive metal layer is formed on the substrate 100 . Afterwards, the conductive metal layer is defined in a predetermined pattern to form the conductive lines 200 on the substrate 100 . A plurality of different functional areas are included on the conductive circuit 200 . In this embodiment, the die bonding area 112 and the welding area 114 of the conductive circuit 200 are partially enlarged to illustrate the concept of the present invention.

[0017] In a preferred embodiment, the substrate 100 is made of glass epoxy resin. The conductive circuit 200 is made of copper. Since the brightness of the LED is related to the reflectivity of the surface of the die-bonding region 112 . Therefore, if figure 2 As shown, a thin layer of silver 2...

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Abstract

The invention discloses a LED PCB making method, firstly forming conducting metal layer on a substrate; then, defining the conducting metal layer to form a circuit, which has multiple bonding regions and multiple soldering regions; and finally forming thin Au layers in these soldering regions.

Description

technical field [0001] The invention relates to a manufacturing method and structure of a printed circuit board for diodes, in particular to a manufacturing method and structure of a printed circuit board for light-emitting diodes. Background technique [0002] The first light-emitting diode was made by Holonyak in the 1960s with gallium arsenic phosphide. At that time, it was displayed in red light, and the efficiency was quite weak, only 0.1lm / W. Until 1996, when Japan developed blue light-emitting diodes and broke through the bottleneck of related technologies, light-emitting diodes became a new light source that attracted the attention of the lighting industry. Light-emitting diodes are a type of compound semiconductors, which use the energy released in the form of light when electrons and holes in P-type and N-type semiconductor materials are combined. Because light-emitting diodes have the advantages of small size, long life, low driving voltage, low power consumption...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/498H01L33/00H05K3/00H05K1/02
CPCH01L2924/0002
Inventor 刘邦言黄薰德
Owner EVERLIGHT ELECTRONICS