Conductive paste and multilayer printed wiring board using same

A multi-layer printing, conductivity technology, applied in conductive materials, conductive materials, printed circuits, etc., can solve problems such as voids, and achieve increased conductivity, high conductivity, conductivity and high via hole filling. Effect

Inactive Publication Date: 2007-09-05
SUMITOMO ELECTRIC IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This tends to create gaps

Method used

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  • Conductive paste and multilayer printed wiring board using same
  • Conductive paste and multilayer printed wiring board using same
  • Conductive paste and multilayer printed wiring board using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] Conductive paste was prepared as follows: 50 parts by weight of

[0079] The bisphenol A type resin [EPIKOTE (trademark) 1256, manufactured by Japan Epoxy Resin Co., Ltd.] was dissolved in 75 parts by weight of butyl carbitol acetate; the silver-coated flake copper filler was used as a conductive The conductive filler is added to the epoxy resin [ADEKA CORPORATION, EPR4030] modified by rubber (NBR) of 380g / eq (weight per epoxy equivalent) in 50 parts by weight, so that the conductive filler is in the conductive paste The percentage in the solid content of the silver coating is 55% by volume, the 99% cumulative particle size of the silver-coated flake copper filler is 5.5 μm, the average particle size is 1.7 μm, and has a silver-copper alloy surface layer; in addition, the butyl carbit Alcohol acetate was added as a solvent; the resulting mixture was kneaded with a three-roll mill; and, 17 parts by weight of an imidazole latent hardener [Novacure (trademark) HX-3941HP, m...

Embodiment 2

[0081] Prepare conductive paste in the same manner as in Example 1, except that, with 50 parts by weight of unit epoxy equivalent weight, bisphenol F type epoxy resin [EPIKOTE (trademark) 806, produced by Manufactured by Japan Epoxy Resin Co., Ltd.] instead of rubber-modified epoxy resin.

Embodiment 3

[0083] Conductive paste was prepared in the same manner as in Example 1, except that 50 parts by weight of the unit epoxy equivalent weight was 152 g / eq of bifunctional naphthalene-type epoxy resin [Dainippon Ink and Chemicals, Incorporated, HP4032] instead Rubber modified epoxy resin.

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Abstract

The present invention provides a conductive paste comprising flake conductive fillers having a 99% cumulative particle size of 25 [mu]m or less and a binder resin as essential components. The flake conductive fillers are metal particles having a silver-copper alloy surface layer. The conductive paste according to the present invention is fused with a part of a copper foil circuit to which the conductive paste is to be connected during connection by heating and pressurization, and has high electrical conductivity and high fill ration in a via hole. Thus, the conductive paste according to the present invention provides a multilayer printed wiring board that has high reliability of connection and excellent interlayer connection.

Description

technical field [0001] The present invention relates to a conductive paste having high conductivity, which is used for filling via holes of multilayer printed wiring boards, and for forming bumps or bumps of multilayer printed wiring boards. circuit. The present invention also relates to a multilayer printed wiring board (multilayer printed wiring board) using the conductive paste. Background technique [0002] Multilayer printed wiring boards are known as a technology that allows high-density packaging of components and the shortest connections of components. The term "connection" as used herein means electrical continuity. Interstitial Via Hole (IVH) technology is used in the manufacture of multilayer printed wiring boards requiring higher density packaging. IVH technology is characterized in that via holes passing through adjacent layers are filled with conductive material to connect adjacent layers. According to the IVH technology, an interlayer connection can be for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B1/00H05K3/12H05K3/46
CPCH05K3/4069H05K2201/0394Y10T428/24322Y10T428/24339H01B1/22H05K3/4617H05K1/095H05K2201/0245H01B1/02H05K3/46
Inventor 冈良雄泷井齐林宪器
Owner SUMITOMO ELECTRIC IND LTD
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