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Technique for coating layer of power type white light LED plane based on water-soluble sensitization glue

A photosensitive adhesive and power-type technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of non-repeatable thickness of phosphor powder, poor uniformity of LED light output, limited yield and industrialized mass production, etc., to improve optical uniformity Sexuality and thermal stability, the effect of improving the overall performance

Inactive Publication Date: 2007-12-26
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, under the existing process conditions, the fluorescent powder layer is mainly obtained by mixing phosphor particles with transparent colloid (such as epoxy glue, silica gel, etc.), and coating the mixed layer of phosphor powder and colloid through potting, spraying and other processes. The thickness is uneven, so that the uniformity of LED light output is poor, and the colloid mixed with phosphor has a certain attenuation, which also affects the life of white LED products
And the phosphor thickness between devices cannot be repeated, which greatly limits the yield and industrialized mass production

Method used

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  • Technique for coating layer of power type white light LED plane based on water-soluble sensitization glue
  • Technique for coating layer of power type white light LED plane based on water-soluble sensitization glue

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Weigh 3.5g of polyvinyl alcohol (PVA) and 43.8mg of sodium dodecylsulfonate mixed with 25ml of deionized water, then add 2.5ml of absolute ethanol and 0.5ml of glacial acetic acid, stir and dissolve in a boiling water bath for about 10min, The solution is transparent and homogeneous, without nodules. Stand still until the bubbles disappear;

[0042] Weigh 315.8mg of ammonium dichromate (ADC) and mix with 6ml of deionized water evenly, and place in a dark room;

[0043] Mix the PVA solution with the ADC solution, add 6ml of silicone defoamer diluted 20 times, stir evenly, and place in a dark room;

[0044] Measure and mix 310ul of silica gel A and silica gel B in equal volume, weigh 800mg of yellow fluorescent powder, mix with the mixed silica gel evenly, and then mix with 3.1ml of the mixed photosensitive adhesive liquid in the previous step to obtain a photosensitive adhesive suspension containing fluorescent powder liquid (i.e. slurry);

[0045] Dispense the photos...

Embodiment 2

[0050] Weigh 3.763g of polyvinyl alcohol (PVA) and mix it with 50ml of deionized water, stir and dissolve in a boiling water bath for about 15min, the solution appears transparent and homogeneous, without nodules. Stand still until the bubbles disappear;

[0051] Weigh 315.8mg of ammonium dichromate (ADC) and mix with 6ml of deionized water evenly, and place in a dark room;

[0052] Mix the PVA solution with the ADC solution, stir evenly, and place it in a dark room;

[0053] Measure and mix 310ul of silica gel A and silica gel B in equal volume, weigh 800mg of yellow fluorescent powder, mix with the mixed silica gel evenly, and then mix with 3.1ml of the mixed photosensitive adhesive liquid in the previous step to obtain a photosensitive adhesive suspension containing fluorescent powder Liquid (ie powder slurry), remove the air bubbles in the powder slurry in a vacuum drying oven;

[0054] Dispense the photosensitive powder paste on the front surface of the chip, coat evenl...

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Abstract

Plane coat technique includes following steps: (1) preparing organic colloid; (2) preparing solution of photosensitizer; (3) mixing organic colloid with photosensitizer according to proportion, adding a small quantity of dispersant or defoaming agent dispersed to organic colloid evenly to form sensitization system accorded with requirement; (4) preparing suspension of sensitization colloid of containing phosphor powder; mixing phosphor powder with sensitization liquid prepared in step (3) according to proportion, mixing them evenly so as to prepare slurry of phosphor powder; (5) coating the slurry obtained in step (4) on surface of LED chip so as to form coat layer of phosphor powder; dry in the shade or air-dry in darkroom; (6) exposure and develop obtains layer of phosphor powder with plane structure; (7) solidifying layer of phosphor powder with plane structure obtained in step (6) to make physicochemical characteristics stable.

Description

technical field [0001] The invention relates to the field of optoelectronic technology, in particular to a power-type white LED plane coating process based on water-soluble photosensitive glue. Background technique [0002] LED is the abbreviation of light emitting diode. In 1993, a technological breakthrough was made in the blue GaN light-emitting diode, and in 1996, white LED was realized. White LED has the advantages of low voltage drive, low power consumption, high reliability, long life, etc., and is a green lighting source that meets environmental protection and energy saving. Therefore, its appearance has aroused great enthusiasm and great attention from governments and many business companies. [0003] So far, there are four known ways to achieve white LEDs, one of which is to coat a layer of yellow phosphor (YAG:Ce 3+ ), the yellow phosphor absorbs part of the blue light emitted from the blue LED chip and converts it into yellow light, and the yellow light and th...

Claims

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Application Information

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IPC IPC(8): H01L33/00
Inventor 饶海波李君飞侯斌
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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