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Silicon-phosphor-containing heat-stable hybridized epoxide resin and the preparing method and application thereof

A technology of epoxy resin and phosphorous silicon, which is applied in electrical components, circuits, circuit substrate materials, etc., can solve the problems of the reduction of thermal properties and mechanical properties of epoxy resins

Inactive Publication Date: 2008-01-30
海南中科翔新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although phosphorus-containing or silicon-containing epoxy resins have a better flame-retardant effect than ordinary epoxy resins, at the same time, the limitations of molecular design and other conditions reduce the thermal and mechanical properties of epoxy resins.

Method used

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  • Silicon-phosphor-containing heat-stable hybridized epoxide resin and the preparing method and application thereof
  • Silicon-phosphor-containing heat-stable hybridized epoxide resin and the preparing method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] With the glycidoxybutyl trimethoxysilane of 100g, 0.2g catalyst dibutyl tin laurate (the consumption of catalyst is 0.2% of the glycidoxybutyl trimethoxysilane quality) and 90g butyl ether solvent Add it into a three-necked flask, add 25g of deionized water dropwise under stirring at 60°C, and drop it in 30 minutes. After reacting at 60°C for 6 hours, a silicon-containing hybrid epoxy resin is obtained, and then add 25.7g of diethyl phosphate , Reflux at 150°C for 5 hours, and cool to remove the solvent butyl ether and the by-product methanol to obtain 94.0 g of phosphorus-containing silicon heat-resistant hybrid epoxy resin with a number average molecular weight of 1779.

[0037] Take 30g of the above-mentioned phosphorus-containing silicon heat-resistant hybrid epoxy resin and compound it with 100g of F51 epoxy resin, and then use 19.4g of triethylenetetramine to cure (the specific process conditions are the same as those in the specification, the same below). The lim...

Embodiment 2

[0039] With the glycidoxypropyl methyldimethoxysilane of 100g, 0.01g catalyst triethylamine (the consumption of catalyst is 0.01% of glycidoxypropylmethyldimethoxysilane quality), 60g toluene and Add 60g of benzene mixed solvent into a three-necked flask, add 40g of deionized water dropwise under stirring at 120°C, and finish adding dropwise in 40 minutes. After reacting at 120°C for 2 hours, a silicon-containing epoxy resin is obtained, and then add DOPO19. 6g, reflux reaction at 100°C for 10h, and cooling to remove the solvent toluene, benzene and by-product methanol to obtain 92.6g of phosphorus-containing silicon heat-resistant hybrid epoxy resin with a number average molecular weight of 954.

[0040] Take 20g of the above-mentioned phosphorus-containing silicon heat-resistant hybrid epoxy resin and compound it with 100g of E51 type epoxy resin, and then use 58.4g of polyamide to cure it. The limiting oxygen index of the cured product is 28.0, the tensile strength is 55MPa...

Embodiment 3

[0042] With the glycidoxypropyl methyl diisopropoxysilane of 100g, 0.001g catalyst hydrochloric acid (the consumption of catalyst is 0.001% of glycidoxypropyl methyl diisopropoxysilane quality) and 50g tetrahydrofuran solvent Add it into a three-necked flask, add 10g of deionized water dropwise under stirring at 50°C, and drop it in 60 minutes. After reacting at 50°C for 8 hours, a silicon-containing epoxy resin is obtained, and then add 10g of phosphoric acid and dimethyl phosphate 16.4 g, reflux at 130°C for 5 hours, and cool to remove the solvent tetrahydrofuran and the by-product isopropanol to obtain 74.1 g of phosphorus-containing silicon heat-resistant hybrid epoxy resin with a number average molecular weight of 569.

[0043] Take 25g of the above-mentioned phosphorus-containing silicon heat-resistant hybrid epoxy resin and compound it with 100g of E44 type epoxy resin, and then use 28.5g of diaminodiphenyl sulfone to cure. The limiting oxygen index of the cured product...

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Abstract

The invention discloses a heatproof hybrid epoxy resin containing phosphosilicate as well as the preparation method and the application thereof. The preparation method of epoxy resin is that: counting in mass fraction, 100 epoxide polyalkyl silicane, 50 to 120 organic solvent are mixed with 0.001 percent to 0.5 percent catalyst agent of epoxide polyalkyl silicane mass, then under 50 to 120 DEG C, 10 to 40 deionized water is dropwised in mixing solution by hydrolyzing and reflowing for 2 to 8 hours before 1 to 100 active material containing phosphor is added in, and the organic solvent used for reaction is removed after 3 to 10 hours reaction under 100 to 160 DEG C, thus acquiring the heatproof hybrid epoxy resin containing phosphosilicate, the number-average molar mass is 500-6000. After being separately solidified or compound solidified with normal epoxy resin, the heatproof hybrid epoxy resin containing phosphosilicate has the advantages of good mechanical property, flame retardant property and heat-resistant quality, tensile strength up to 43 to 94 Mpa, limiting oxygen index up to 23 to 38 and glass transition temperature up to 165 to 187 DEG C, can be used widely as electronic industrial base material with high-performance.

Description

technical field [0001] The invention belongs to the field of polymer materials, in particular to a phosphorus-containing silicon heat-resistant hybrid epoxy resin and its preparation method and application. Background technique [0002] The electronics industry represented by electronic computers and mobile phones is the fastest-growing high-tech industry in the past two decades. The rapid development of the electronics industry has also led to the development of thermosetting resins that are closely related to it. Thermosetting resins are used in all electronics industries. In the field of resin materials, the epoxy resin system is the largest due to its superior performance and low cost, accounting for more than 40%. It is widely used in the manufacture of printed circuit boards and the packaging of semiconductors and electronic devices. A very important polymer material. [0003] With the emergence of advanced electronic technology, the improvement of heat-resistant and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/14C08G59/68H01L23/29H05K1/03
Inventor 刘伟区侯孟华苏倩倩
Owner 海南中科翔新材料科技有限公司
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