Silicon-phosphor-containing heat-stable hybridized epoxide resin and the preparing method and application thereof

A technology of epoxy resin and phosphorous silicon, which is applied in electrical components, circuits, circuit substrate materials, etc., can solve the problems of the reduction of thermal properties and mechanical properties of epoxy resins
CN101113196AInactive Publication Date: 2008-01-30海南中科翔新材料科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
海南中科翔新材料科技有限公司
Publication Date
2008-01-30
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a heatproof hybrid epoxy resin containing phosphosilicate as well as the preparation method and the application thereof. The preparation method of epoxy resin is that: counting in mass fraction, 100 epoxide polyalkyl silicane, 50 to 120 organic solvent are mixed with 0.001 percent to 0.5 percent catalyst agent of epoxide polyalkyl silicane mass, then under 50 to 120 DEG C, 10 to 40 deionized water is dropwised in mixing solution by hydrolyzing and reflowing for 2 to 8 hours before 1 to 100 active material containing phosphor is added in, and the organic solvent used for reaction is removed after 3 to 10 hours reaction under 100 to 160 DEG C, thus acquiring the heatproof hybrid epoxy resin containing phosphosilicate, the number-average molar mass is 500-6000. After being separately solidified or compound solidified with normal epoxy resin, the heatproof hybrid epoxy resin containing phosphosilicate has the advantages of good mechanical property, flame retardant property and heat-resistant quality, tensile strength up to 43 to 94 Mpa, limiting oxygen index up to 23 to 38 and glass transition temperature up to 165 to 187 DEG C, can be used widely as electronic industrial base material with high-performance.
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Description

technical field

[0001] The invention belongs to the field of polymer materials, in particular to a phosphorus-containing silicon heat-resistant hybrid epoxy resin and its preparation method and application. Background technique

[0002] The electronics industry represented by electronic computers and mobile phones is the fastest-growing high-tech industry in the past two decades. The rapid development of the electronics industry has also led to the development of thermosetting resins that are closely related to it. Thermosetting resins are used in all electronics industries. In the field of resin materials, the epoxy resin system is the largest due to its superior performance and low cost, accounting for more than 40%. It is widely used in the manufacture of printed circuit boards and the packaging of semiconductors and electronic devices. A very important polymer material.

[0003] With the emergence of advanced electronic technology, the improvement of heat-resistant and ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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