Photoelectric conversion device and its making method and electrode
A photoelectric conversion device and manufacturing method technology, applied in photovoltaic power generation, circuits, electrical components, etc., can solve the problems of lower photoelectric conversion efficiency, high series resistance, and process fragmentation, so as to improve photoelectric conversion efficiency, reduce series resistance, reduce The effect of warping
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no. 1 example
[0049] Please refer to FIG. 2 , the photoelectric conversion device 2 according to the first embodiment of the present invention includes a photoelectric conversion element 21 and an electrode pair 22 .
[0050] The photoelectric conversion element 21 includes a first semiconductor layer 211 and a second semiconductor layer 212, wherein the first semiconductor layer 211 and the second semiconductor layer 212 are connected to each other to form a junction, as light energy generates electron / hole pairs Separation. As shown in Figure 2, in this embodiment, the first semiconductor layer 211 is a p-type semiconductor, and the second semiconductor layer 212 is an n-type semiconductor, of course, the first semiconductor layer 211 can also be an n-type semiconductor. semiconductor, and the second semiconductor layer 212 is a p-type semiconductor, wherein the dopant of the p-type semiconductor can be, for example, boron (boron) and gallium (gallium), etc., and the dopant of the n-type ...
no. 2 example
[0057] Please refer to FIG. 5, an electrode 20 for a photoelectric conversion device according to a second embodiment of the present invention is characterized in that: its coefficient of thermal expansion is between 5×10 -7 / °C to 1×10 -5 / °C.
[0058] In this embodiment, the photoelectric conversion device 2 includes a first semiconductor layer 211 and a second semiconductor layer 212, and the first semiconductor layer 211 and the second semiconductor layer 212 are connected to each other to form a junction. The material, structural features and functional features of the photoelectric conversion device 2 are as described in the first embodiment, so they will not be repeated here.
[0059] The electrode 20 of this embodiment is connected to the first semiconductor layer 211 or the second semiconductor layer 212, and its material can be selected from at least tin oxide, indium tin oxide, aluminum zinc oxide, indium zinc oxide and diamond-like film. One of them is a transpar...
no. 3 example
[0061] Please refer to FIG. 6, a method for manufacturing a photoelectric conversion device according to a third embodiment of the present invention includes the following steps: In step S1, a second semiconductor layer is formed on a first semiconductor layer, and In step S2, coating a first electrode on the first semiconductor layer and coating a second electrode on the second semiconductor layer, so that the first electrode and the second electrode are respectively connected to the first semiconductor layer and the second semiconductor layer, wherein The coefficient of thermal expansion of the first electrode is between 5 x 10 -7 / °C to 1×10 -5 / °C.
[0062] Before step S1, the first semiconductor layer is formed by doping a silicon wafer by diffusion method or ion implantation method, and the thickness range of the first semiconductor layer is 60 μm to 300 μm. Here, the first semiconductor layer can be A p-type semiconductor or an n-type semiconductor. Wherein the dopan...
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