Electroplating preparation method for copper cladded aluminum wire or copper cladded magnesium alloy wire

A copper-clad aluminum-magnesium and aluminum-magnesium alloy technology, applied in the plating of superimposed layers, cable/conductor manufacturing, circuits, etc., can solve problems such as insufficient bonding fastness between metals, achieve economical and practical bonding force, and low scrap rate , the effect of low proportion of the product

Inactive Publication Date: 2008-05-28
仲庆
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Problems solved by technology

[0005] 3. During the test, if the second galvanizing is carried out according to the conventional process formula of aluminum electroplating: zinc oxide (ZnO) 20g / L, sodium hydroxide (NaOH) 120g / L, and the adaptation temperature is 15-30 degrees Celsius, The residence time is 20-40 seconds. After a large number of tests, it is found that if the product produced according to the above data has no problems on the surface, that is to say, if it is electroplated on aluminum parts, it is considered a qualified product, but the wire rod after electroplating is shrinking during drawing. Decopper phenomenon occurs when the length of the diameter extends to about 10 times, which means that the bonding fastness between the metals is not enough

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Embodiment Construction

[0023] The electroplating preparation method of copper-clad aluminum or copper-clad aluminum-magnesium alloy wire of the present invention comprises the following steps:

[0024] 1. Preparation of φ2-4mm aluminum wire or aluminum-magnesium alloy wire: heat an aluminum ingot with a purity of more than 99.7% in a special square refractory brick structure melting furnace, and heat it to 700 degrees Celsius with coal and natural gas to melt and boil it. Then add (1.2-5% as needed) magnesium metal, and some additives (if no magnesium metal is added, it can be prepared into pure aluminum wire), stir slowly with the stirrer in the furnace to make the magnesium evenly distributed in the metal solution, and boil For about 1 hour, remove the slag stains such as alumina floating on the surface, and open one or two round holes with a diameter of Ф6-8mm on the iron plate about 15mm below the liquid level of the metal solution. At this time, the aluminum-magnesium alloy The solution flows o...

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Abstract

The invention discloses a process for preparing copper cladding aluminum or copper cladding wire of aluminum magnesium alloy, which utilizes a continuous striking-wire copper plating pipeline of being in series connection with a plurality of lengthening electric plating aluminum-magnesium parts plating groove, sets out line uninterruptedly between adjacent plating grooves, and arranges a transiting water ditch between front groove and rear groove which can avoid wire to contact with air to generate oxide coating when changing the grooves. A problem of burning wire can be resolved by adjusting main plating current to about 300 A before having to shutdown in short time. Simultaneously, the invention employs technique of thickening dip galvanized coating and wiping off zinc cover of the zinc dipping by pickling to overcome the main difficulty of utilizing electric plating method to produce copper cladding aluminum wire or copper cladding wire of aluminum magnesium alloy. Compared with coating method, the invention has the advantages of great binding force between metals, high concentricity of copper layer and core wire, low production cost on producing high tensile strength and high stretch rate production, low reject rate, low product specific gravity and the like, and is a good method for producing copper cladding aluminum wire and copper cladding wire of aluminum magnesium alloy by the electroplating method.

Description

technical field [0001] The invention relates to a preparation method for producing copper-clad aluminum-magnesium alloy wire by using an electroplating method, and belongs to the field of electroplating. Background technique [0002] Due to the rapid development of the global economy in recent years, the demand for copper, especially the demand for copper in the wire and cable market, is increasing day by day. In addition, the mineral resources of copper are decreasing year by year, which has caused the price of copper to rise continuously in recent years. Substitute products of copper, such as the preparation method of copper-clad steel braided thin wire (seeing patent application number: 200610040893.8), copper-clad aluminum-magnesium alloy wire and its preparation method (seeing patent application number: 200510040343.1), etc., use a small amount of copper and Other metals are combined to make products to replace copper, so as to reduce the consumption of copper and reduc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/30C25D5/42C25D3/38C25D7/06C23C28/02H01B13/00H01B5/02
Inventor 仲庆
Owner 仲庆
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