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Thermosetting resin composition

A resin composition, thermosetting technology, applied in other chemical processes, chemical instruments and methods, etc., can solve the problems of accelerating the reactivity of the resin system, affecting the gel time of the resin composition, etc.

Inactive Publication Date: 2008-07-09
ITEQ DONGGUAN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The use of solvents such as DMF and N-methylpyrrolidone will accelerate the reactivity of the resin system and seriously affect the gel time of the resin composition, which will bring certain problems to the gluing process.

Method used

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  • Thermosetting resin composition
  • Thermosetting resin composition
  • Thermosetting resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0084] The preparation of embodiment 1MPGE / BMI prepolymer (hereinafter referred to as prepolymer I) (see attached table 2):

[0085] 21.9 grams of MPGE (0.0886 equiv.), 31.7 grams of 4,4'-diaminodiphenylmethane type bismaleimide (0.0885 equiv.) and 104.0 grams of butanone (solvent) were added to a reflux condenser equipped with tube, stirrer and thermometer in a three-neck round bottom flask, N 2 Stir under the atmosphere and heat up to 80°C, slowly add 0.073 g of azobisisobutylcyanide (free radical initiator) twice, reflux for 20 minutes, then add 0.048 g of hydroquinone (polymerization inhibitor), and cool to room temperature . A solution of prepolymer I with a solids content of 34.0% was obtained.

Embodiment 2

[0086] The preparation of embodiment 2MPGE / BMI prepolymer (hereinafter referred to as prepolymer II) (see attached table 2):

[0087] Each reactant and method are with embodiment 1, but the consumption of each reactant becomes respectively: 43.8 gram MPGE (0.177equiv.), 31.8 gram 4,4'-diaminodiphenylmethane type bismaleimide (0.0885 equiv.), methyl ethyl ketone 147.1 grams, azobisisobutyronitrile 0.108 grams, hydroquinone 0.070 grams. A prepolymer II solution with a solids content of 34.0% was obtained.

[0088] The preparation of table 2MPGE / BMI prepolymer

[0089]

[0090] The synthetic reaction equation of prepolymer I:

[0091]

[0092] Copolymerization product in prepolymer I

[0093] The synthesis reaction equation of prepolymer II:

[0094]

[0095] Copolymerization product in prepolymer II

Embodiment 3 to Embodiment 14 and comparative example 1 to comparative example 3

[0096] Embodiment 3 to embodiment 14 and comparative example 1 to comparative example 3 thermosetting resin compositions:

[0097] The formula of each embodiment is shown in attached table 3 and attached table 4.

[0098] The resin composition formula of table 3 embodiment 3-10

[0099]

[0100] The resin composition prescription of table 4 embodiment 11-14 and comparative example 1-3

[0101]

[0102] In prepolymer I and prepolymer II formula, the molar ratio (hereinafter referred to as MR) of BMI and MPGE is respectively 1: 1 and 1: 2, and in embodiment 3 to embodiment 10, filler ratio is 30% or 60% (mainly in order to investigate the impact of different fillers and their contents on the performance of the substrate); in the formulas of Example 11 and Example 12, the proportions of fillers are respectively 30% and 50%; in the formulas of Example 13 and Example 14, the proportions of fillers are respectively Be 30% and 50%, but the content of bromine in the system has...

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Abstract

The invention discloses a heat convertible resin composition, which comprises epoxide resin which can have combined polymerization with bimaleimide, which occupies 1.75%-18.0% weight of solid of composition, bimaleimide compound which occupies 0.15% to 12.5% weight of solid of composition, free radical initiator, whose addition amount occupies 0.01% to 0.15% molecular fraction which reflects the total monomers, inhibitor whose dosage is a half to a time of initiating agent, styrene monomer- maleic anhydride oligomer which occupies 17.5%-47.0% weight of solid of composition, filling material which occupies 20%-60% weight of solid of composition, dissolvent whose addition amount occupies 30%-50% weight of composition, and combustion inhibitor which can be used to the cover-copper board industry. The invention forms homogeneous solution in low boiling point solvent, the cover-copper board which is produced has the advantages of high vitrifying transformation temperature, excellent dielectric property, low expansion coefficient, low water absorption ratio, high heat shock resistance, excellent heat conductivity and the like.

Description

technical field [0001] The invention relates to a thermosetting resin composition, in particular to a high-performance resin composition corresponding to the packaging requirements of electronic components and integrated circuits (IC). Background technique [0002] The increasing demand for electronic information products in light, thin, small and high density drives the development of printed circuit boards in the direction of thinner lines and micro-hole technology. Coupled with the continuous progress of miniaturized surface mount technology, the demand for high-end IC packaging substrates continues to increase. [0003] The traditional IC packaging uses a lead frame as a carrier for the IC conduction line and supporting the IC, and it connects pins on both sides or around the lead frame. With the development of IC packaging technology, the number of pins has increased (more than 300 pins), the wiring density has increased, and the number of substrate layers has increase...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L25/08C08K5/3415C09K3/10
Inventor 贺育方粟立军
Owner ITEQ DONGGUAN
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