PVD bushing magnetron sputtering technique using bushing before-sputtering negative grid bias in sputtering cabin to clean
A magnetron sputtering and negative bias technology, applied in the field of bearing bush production technology, can solve the problem of limited adhesion strength and achieve the effect of improving adhesion strength
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Embodiment 1
[0021] like figure 1 As shown, through the PVD bearing bush magnetron sputtering process of negative bias cleaning before sputtering the bearing bush in the sputtering cabin, the conventional method of producing PVD bearing bushes is firstly used outside the cabin through chemical degreasing, pickling, electrolytic degreasing, ultrasonic cleaning, and treatment. Groove, crane, oven, rectifier, control subsystem, etc. are pre-sputtered, the bearing is installed on the fixture in the magnetron sputtering chamber, the magnetron sputtering chamber is vacuumed, the bearing is cleaned by negative bias before sputtering, and the PVD bearing substrate 1 In the vacuumized sputtering chamber, a stainless steel target is used to energize the PVD bearing substrate 1, the voltage of the PVD bearing substrate 1 is -1600 volts; the current of the PVD bearing substrate 1 is 2.5 amperes; the processing time is 3 minutes. The first diffusion layer 3 is sputtered by magnetron, the PVD bearing su...
Embodiment 2
[0032] like figure 1 As shown, the PVD bearing bush magnetron sputtering process through the negative bias cleaning of the bearing bush in the sputtering chamber, the negative bias cleaning process conditions of the bearing bush before sputtering: the voltage of the PVD bearing substrate 1 is -300 volts; the current of the PVD bearing substrate 1 is 0.4 ampere; treatment time is 40 minutes; magnetron sputtering first diffusion layer 3 process conditions: PVD bearing substrate negative bias voltage is -300 volts; PVD bearing bush substrate current is 0.5 ampere; nickel target negative voltage is -620 volts; The target current is 1 ampere; the treatment time is 40 minutes; finally the weight percent of each component of the first diffusion layer 3 is as follows: Cu 5%; CuPb 5%; CuPbSn 5%; CuPbSn 10%; CuNi 10%; CuPbSnNi 15%; CuPbNi Surplus: first diffusion layer 3 thickness 0.5um, the processing condition of described magnetron sputtering second diffusion layer 5: adopt the aluminu...
Embodiment 3
[0035] like figure 1 As shown, the PVD bearing bush magnetron sputtering process through the negative bias cleaning of the bearing bush before sputtering in the sputtering chamber, the negative bias cleaning process conditions of the bearing bush before sputtering: the voltage of the PVD bearing substrate 1 is -750 volts; the current of the PVD bearing substrate 1 is 1.5 amperes; treatment time is 40 minutes; magnetron sputtering first diffusion layer 3 process conditions: PVD bearing substrate negative bias voltage is -1000 volts; PVD bearing substrate substrate current is 1.2 amperes; nickel target negative voltage is -400 volts; The target current is 0.6 ampere; processing time: 23 minutes; finally the weight percent of each component of the first diffusion layer 3 is as follows: Cu 2.5%; CuPb 3.5%; CuPbSn 7.5%; CuPbSn 7.5%; CuNi 20%; CuPbSnNi 9%; Amount; first diffusion layer 3 thickness 1um, the process condition of described magnetron sputtering second diffusion layer 5:...
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