Silicon carbide thin film forming device and silicon carbide thin film producing method
A film forming and silicon carbide technology, which is used in the field of silicon carbide film forming devices and the preparation of silicon carbide films by a precursor conversion method, can solve problems such as thermal expansion coefficient and lattice mismatch, and achieve stable performance, dense and uniform, and thickness. control effect
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Embodiment 1
[0038] 1) Take 10g of the PCS precursor, and fix the size of the film nozzle 63 of the film spray plate 6 in the melt spinning film by adjusting the screws 61, 62, 65, 66, the left splint 64, and the right splint 67, and then degas the PCS Treatment: Put PCS solid polycarbosilane into the spray film material barrel 7 of the silicon carbide film forming device, install the upper sealing cover 1, the ejector rod 2, the spray film plate 6, the gasket 4 and the lower sealing cover 5, and fix it with Screws 11, 12, 51, and 52 are locked. After assembly, put the silicon carbide film forming device filled with polycarbosilane into the vacuum furnace, set the temperature rise program, and the temperature rises from room temperature to 270°C in 100 minutes, and then rises to 270°C in 20 minutes. 290°C, and then kept at 290°C for 3h. Take out the molding device, loosen the fixing screws 11, 12, 51, 52, remove the upper sealing cover 1, the gasket 4, the spray film plate 6 and the lower ...
Embodiment 2
[0050] 1) Take 10g of the PCS precursor, and fix the size of the film nozzle 63 of the film spray plate 6 in the melt spinning film by adjusting the screws 61, 62, 65, 66, the left splint 64, and the right splint 67, and then degas the PCS Treatment: Put PCS solid polycarbosilane into the spray film material barrel 7 of the silicon carbide film forming device, install the upper sealing cover 1, the ejector rod 2, the spray film plate 6, the gasket 4 and the lower sealing cover 5, and fix it with Screws 11, 12, 51, and 52 are locked. After assembly, put the silicon carbide film forming device filled with polycarbosilane into the vacuum furnace, set the temperature rise program, and the temperature rises from room temperature to 270°C in 100 minutes, and then rises to 270°C in 20 minutes. 290°C, and then kept at 290°C for 3h. Take out the molding device, loosen the fixing screws 11, 12, 51, 52, remove the upper sealing cover 1, the gasket 4, the spray film plate 6 and the lower ...
Embodiment 3
[0058]1) Take 10g of the PCS precursor, and fix the size of the film nozzle 63 of the film spray plate 6 in the melt spinning film by adjusting the screws 61, 62, 65, 66, the left splint 64, and the right splint 67, and then degas the PCS Treatment: Put PCS solid polycarbosilane into the spray film material barrel 7 of the silicon carbide film forming device, install the upper sealing cover 1, the ejector rod 2, the spray film plate 6, the gasket 4 and the lower sealing cover 5, and fix it with Screws 11, 12, 51, and 52 are locked. After assembly, put the silicon carbide film forming device filled with polycarbosilane into the vacuum furnace, set the temperature rise program, and the temperature rises from room temperature to 270°C in 100 minutes, and then rises to 270°C in 20 minutes. 290°C, and then kept at 290°C for 3h. Take out the molding device, loosen the fixing screws 11, 12, 51, 52, remove the upper sealing cover 1, the gasket 4, the spray film plate 6 and the lower s...
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Abstract
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