Netted Cu antimicrobial filtering metallic material and preparation thereof

A technology for filtering metal and mesh, which is applied in the field of high-porosity reticulated Cu antibacterial filter metal material and its preparation, can solve the problems of insufficient copper intake, poor beer taste, energy consumption, etc., and achieves a simple and easy preparation method line, increased intake, low cost effect

Inactive Publication Date: 2008-08-20
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
View PDF0 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The object of the present invention is to provide a high-porosity reticulated copper metal antibacterial filter material capable of killing beer yeast at room temperature and a preparation method thereof, so as to solve the problem of poor mouthfeel of beer after high-temperature sterilization and a large amount of Energy consumption and insufficient copper intake in the body

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Netted Cu antimicrobial filtering metallic material and preparation thereof
  • Netted Cu antimicrobial filtering metallic material and preparation thereof
  • Netted Cu antimicrobial filtering metallic material and preparation thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Foam sponge material (pore diameter is about 550 microns) is first sensitized, and the specific process and process parameter range of sensitization are: put the sample into sensitization solution (stannous chloride 20g / L, mass concentration 37% Hydrochloric acid 40ml / L and distilled water balance), soak for 3 minutes, remove and wash with water, and then immerse in a solution containing an oxidant at room temperature (silver nitrate 1.5g / L, add ammonia water to the solution transparency and distilled water balance) and soak for 10 minutes Form an active metal layer on the surface of the substrate, then take 200ml of electroless copper plating solution and add water to dilute it to 1L, soak the above-mentioned treated material in it for 20 seconds (to prevent the activation solution remaining on the surface of the sample from being brought into the electroless plating solution ), directly into the chemical copper plating solution at room temperature and soaked for 5 minu...

Embodiment 2

[0063] The difference from Example 1 is:

[0064] Foam sponge material (pore size is about 550 microns) is first sensitized, and at room temperature, the sample is put into sensitized solution (50ml / L of hydrochloric acid 50ml / L and distilled water surplus of stannous chloride 10g / L, mass concentration 37%) After soaking for 5 minutes, take it out and wash it, and then immerse it in a solution containing an oxidant at room temperature (silver nitrate 2.0g / L, add ammonia water to the transparent solution and the remainder of distilled water) and soak for 15 minutes to form an active metal layer on the surface of the substrate, and then take it out Dilute 200ml of electroless copper plating solution with water to 1L, soak the above-mentioned treated material in it for 30 seconds for a short time, then soak it in the electroless copper plating solution for 8 minutes at room temperature without washing with water, and plate copper to make the foam sponge material To obtain electri...

Embodiment 3

[0068] The difference from Example 1 is:

[0069]Foam sponge material (pore diameter is about 550 microns) is first sensitized, and at room temperature the sample is put into the sensitization solution (hydrochloric acid 40ml / L and distilled water surplus of stannous chloride 30g / L, mass concentration 37%) After soaking for 4 minutes, take it out and wash it, and then immerse it in a solution containing oxidant (silver nitrate 1.5g / L, ammonia water added to the solution transparency and distilled water remainder) at room temperature and soak for 20 minutes to form an active metal layer on the surface of the substrate, and then take it out Dilute 200ml of electroless copper plating solution with water to 1L, soak the above-mentioned treated material in it for 10 seconds, then soak in the electroless copper plating solution for 10 minutes at room temperature without washing with water, and then plate copper to make the foam sponge material obtain electrical conductivity. The com...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
pore sizeaaaaaaaaaa
pore sizeaaaaaaaaaa
Login to view more

Abstract

The invention relates to a manufacturing process technology for high porosity reticular metal material, in particular to a reticular copper antibacterial filtration metal material and a preparation method, which can kill saccharomyces cerevisiae at ambient temperature and kill other common bacteria at the same time, thus the problems of worse bear taste after high temperature sterilization, large energy consumption at the high temperature sterilization process and insufficient copper intake for human body are solved. In the high porosity reticular metal material, foam sponge is used as the matrix material and supported metal Cu is used to form a high porosity reticular metal material. The preparation method of the material is that the foam sponge is processed by conductive treatment and then a Cu coating is deposited on the surface of the foam sponge; after the copper coating reaches a needed thickness, the foam sponge is taken out for drying and then for heat treatment in a vacuum furnace or a furnace protected by argon to form a metal copper mesh, finally, a reticular Cu antibacterial filtration metal material which can kill saccharomyces cerevisiae at ambient temperature and other common bacteria at the same time is prepared. The reticular Cu antibacterial filtration metal material has the advantages that the porosity can be 85% to 95% and the aperture is adjustable from 350 to 500 micrometer according to our practical requirement.

Description

Technical field: [0001] The invention relates to a manufacturing technology of a high-porosity reticular metal material, specifically a high-porosity reticular Cu antibacterial filter metal material capable of killing beer yeast and other common fungi at room temperature and its Preparation. Background technique: [0002] The United Nations World Health Organization (WHO) proposes that the global theme of the 21st century is "health and the environment", and 60% of everyone's life and health are in their own hands [Document 1: Jin Zongzhe, Inorganic Antibacterial Materials and Applications (2004): 1 ]. In addition, the problem of energy shortage in the whole world is becoming more and more serious with the rapid development of industries in various countries. Therefore, it has become an urgent task to research and develop energy-saving, antibacterial and other functional and structurally integrated materials. [0003] In the United States, food processing enterprises must...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B01D39/12C25D1/08
Inventor 于志明韩恩厚
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap