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Silicon slice alignment signal collecting and processing system and processing method using the same

A technology of silicon wafer alignment and signal acquisition, applied in the direction of photolithography, optics, instruments, etc. on the pattern surface, can solve the problems of reducing system real-time performance and alignment efficiency, increasing calculation time, etc., to shorten processing time, Effect of increasing computation time, avoiding iterative solution process

Active Publication Date: 2008-08-20
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Problems solved by technology

In the process of aligning sampling signal processing, the use of nonlinear fitting model can have wider applicability, and high alignment accuracy can also be obtained for sampling signals with large amplitude fluctuations, but the solution process needs to be solved through an iterative method , which increases the calculation time and reduces the real-time performance and alignment efficiency of the system

Method used

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  • Silicon slice alignment signal collecting and processing system and processing method using the same
  • Silicon slice alignment signal collecting and processing system and processing method using the same
  • Silicon slice alignment signal collecting and processing system and processing method using the same

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Embodiment Construction

[0038] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0039] figure 1A schematic diagram of a silicon wafer alignment system is shown. The composition of the lithography apparatus includes: an illumination system 1 for providing an exposure beam; a mask table 4 for supporting a reticle 3 with a mask pattern and a periodic structure alignment grating for mask alignment Mark 2; a projection optical system 5 for projecting the mask pattern on the reticle 3 onto the silicon wafer 6; a substrate table 8 for supporting the silicon wafer 6, and an alignment grating mark 10 is engraved on the substrate table 8; The moving table 9 is used to drive the substrate table to reciprocate linearly in x and y directions. The moving table 9 is collected and controlled by the servo motion control system 11 and the measurement system IFx and IFy; the lighting system 12 is used to provide silicon wafer alignment i...

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Abstract

The invention provides a silicon chip aligning semaphore acquisition and processing system. The system can achieve the functions of gathering, filtering, modulating and demodulation from light signal to electric signal in real-time, synchronizing gathering and processing of location data, satisfy silicon chip alignment function of light scribing device through fitting processing of sample-taking signal. The invention also provides a processing method fir silicon chip aligning signal. The method adapts high order non-linearity signal fitting mould to obtain firstly envelope parameter of sample-taking signal in multiplestep fitting processing method and translates high order non-linearity signal fitting mould into 1 order linearity mould to obtain phase information of sample-taking signal.

Description

technical field [0001] The invention relates to an alignment technology processing method in semiconductor integrated circuit lithography production equipment, in particular to a silicon chip alignment signal acquisition and processing system and processing method. Background technique [0002] In the manufacturing process of integrated circuits IC or other micro-devices, through photolithography equipment, multi-layer masks with different mask patterns are sequentially imaged on silicon wafers coated with photoresist under precise alignment, such as semiconductor silicon sheet or LCD panel. The main function of the alignment system of the lithography device is to achieve mask-silicon wafer alignment before overlay exposure, so as to meet the requirements of overlay accuracy. At present, the alignment method adopted by most photolithography equipment is grating alignment. Grating alignment means that a uniform illumination beam is irradiated on the grating alignment mark a...

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Application Information

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IPC IPC(8): G03F7/20G03F9/00
Inventor 李运锋陈延太韦学志陈勇辉周畅
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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