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Phase change storage unit and method for dual shallow groove separated bipolar transistor selection

A bipolar transistor, shallow trench isolation technology, applied in the field of memory, can solve the problems of cost reduction, disadvantage, high price, etc.

Active Publication Date: 2008-09-10
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Samsung has been committed to the research of phase-change memory based on bipolar transistor gating in recent years (J.H.Oh et al., IEDM, 2006, p.49), and has achieved remarkable results, and has produced a 512M devices; however, in Samsung's research and patents, the epitaxial method is used to manufacture bipolar transistors. This method is expensive and is not conducive to cost reduction. Therefore, if a cheaper structure and manufacturing can be provided method will greatly increase its due value

Method used

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  • Phase change storage unit and method for dual shallow groove separated bipolar transistor selection
  • Phase change storage unit and method for dual shallow groove separated bipolar transistor selection
  • Phase change storage unit and method for dual shallow groove separated bipolar transistor selection

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Embodiment 1

[0075] figure 1 Shown is a cross-sectional view of an embodiment memory cell, for manufacturing figure 1 For the phase-change memory cell shown, first, a medium-doped low-resistance layer is formed on a silicon substrate by ion implantation; silicon lines are carved out to form bit lines, and the etching depth is until the above-mentioned doped layer is etched , form a deep shallow trench isolation (STI); then form two layers of silicon material layers with different conductivity types in a specific area by ion implantation; prepare a bipolar transistor on the bit line by photolithography, and form a shallower STI; Finally, a phase-change memory cell is fabricated on top of a bipolar transistor to form a basic memory device structure.

[0076] The substrate of the first conductivity type may be p-type or n-type, and here a p-type substrate is taken as an example for convenience of description. Figures 2A to 2G Shown is figure 1 The specific fabrication process for the illu...

Embodiment 2

[0078] Figure 3A Shown is right Figure 2G The improvement of the structure of the bipolar transistor is prepared, and the Figure 2C After the shown bipolar transistor, a hollow bipolar transistor is formed through a semiconductor process, and the gap formed in the bipolar transistor is filled with a dielectric material 26, and then a center with a dielectric 26 is formed by chemical mechanical polishing. Ring Bipolar Transistor. This embodiment and embodiment 1 figure 1Another difference shown is that no additional electrode layer is deposited between the phase change material and the bipolar transistor, but doped silicon or silicide is directly used as a heating electrode. The thin layer silicide 27 formed on the annular bipolar transistor is obtained by ion implantation or diffusion, and it has lower electrical conductivity and lower thermal conductivity than the W metal electrode. Figure 3B Shown is Figure 3A The cross-sectional view taken along line 1-1 in the in...

Embodiment 3

[0080] The first conductivity type substrate in this embodiment is still p-type as an example. For the structure shown in Example 2

[0081] A thick n-type heavily doped low-resistance layer is formed on a p-type substrate by ion implantation, and the cross-sectional view is shown in Figure 4A shown;

[0082] The pattern is carved by photolithography, and the top view is shown in 4B, where 80 is the etched silicon line, and 81 is the deep STI directly to the formed bit line, the purpose is to separate each bit line;

[0083] Bipolar diodes are formed by ion implantation and semiconductor processes, such as Figure 4C shown;

[0084] Fill the dielectric material to form STI, where the shallower STI separates the bipolar transistors on the same bit line and forms grooves on the transistors, such as Figure 4D shown;

[0085] CVD deposition electrode layer 91 and dielectric layer 92, such as Figure 4E shown;

[0086] After chemical mechanical polishing, such as Figure ...

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Abstract

The invention provides a phase change memory cell structure that is gated by bipolar transistors and isolated by double shallow trenches and a manufacturing method thereof. On a base of p-type or n-type conduction in a first conduction type, bit lines of a second conducting type with low resistance are utilized to serve as a collecting electrode of the bipolar transistors and the bit lines are separated by relatively deep shallow trench isolation (STI); a base electrode and an emitting electrode of the first conduction type are prepared above the bit lines, the bipolar transistors formed on the same bit line are separated by relatively shallow STI; finally, a phase change memory cell is prepared on each bipolar transistor. The bipolar transistors are manufactured and the phase change memory cell is prepared on each bipolar transistor largely by ion injection and regular semiconductor technique, and the memory cell is gated and operated by the bipolar transistors. Compared with the phase change memory cell with the existing structure, the phase change memory cell structure provided by the invention has high density and low manufacturing cost, and one bipolar transistor can correspond to a plurality of phase change memory cells.

Description

technical field [0001] The invention relates to a single-eye structure and a manufacturing method of a phase-change memory device, more precisely, to a phase-change memory unit and a method based on bipolar transistor gating based on double shallow trench isolation. It belongs to the field of memory in microelectronics. Background technique [0002] Phase-change memory (PCM) is currently a hot spot in the research of a new generation of non-volatile memory, and has broad market prospects. It combines high-speed, high-density, simple structure, low cost, radiation resistance, and non-volatility. , is currently widely optimistic about the next generation of memory, it will have the opportunity to replace the widely used flash memory, thus occupying an important position in the field of electronic memory. [0003] High-density PCM is an important direction for the development of PCM at present, and replacing MOS transistors with bipolar transistors is an effective way to incre...

Claims

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Application Information

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IPC IPC(8): H01L27/24H01L23/522H01L21/822H01L21/762H01L21/768G11C11/56G11C16/02
Inventor 张挺宋志棠刘波封松林陈邦明
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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