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Needle cylinder injection type leadless solder paste for heat radiator welding

A lead-free solder paste, injection technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of inapplicability, and achieve the benefits of precise control, good rheology, and good anti-slump performance Effect

Inactive Publication Date: 2008-11-12
PERFECTION SCI & TECH DONGGUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the coating method used for this solder paste is traditional stencil printing, which is not suitable for syringe injection coating of solder paste on the heat sink

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Embodiment 1: Stir 87% spherical lead-free solder powder and 13% brazing flux evenly, wherein the composition of brazing filler metal is: 42.3% tin, 57.5% bismuth and 0.2% lanthanum-cerium mixed rare earth; the composition of brazing flux is shown in Table 1 In Example 1, mix them evenly, heat to dissolve, let stand to room temperature, refrigerate at 5-10°C for 48 hours to prepare the required brazing flux, and then mix it with brazing material. The prepared solder paste is filled into a syringe by using a hydraulic press to prepare a syringe-injectable lead-free solder paste, which is then refrigerated at 5-10°C for later use.

Embodiment 2

[0018] Example 2: Compared with Example 1, the composition of the solder is: 42.48% tin, 58% bismuth and 0.02% lanthanum-cerium mixed rare earth; the composition of the solder is shown in Example 2 in Table 1.

Embodiment 3

[0019] Embodiment 3: Compared with Example 1, 88% spherical lead-free solder powder and 12% solder are stirred evenly, wherein the solder is composed of: 42.2% tin, 57.5% bismuth and 0.3% lanthanum-cerium mixed rare earth; The composition of the flux is shown in Example 3 in Table 1.

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Abstract

The invention discloses a needle cylinder injection-typed lead-free solder paste used for the welding of radiators; the lead-free solder paste contains a tin-bismuth-rare earth lead-free solder mixed with a soldering flux. The soldering flux comprises 40 to 45 percent of resin (such as hydrogenation resin glycerol and alkyd resin), 10 to 15 percent of active agent (such as alkyl poly-glycosides and monoethanolamide sulfosuccinate), 2.1 to 3.1 percent of thixotropic agent (such as amide modified hydrogenated castor oil and Ethylene bis stearamide stearic amide), 0.8 to 1.2 percent of special additive (such as release agent, antioxidant and resist), and residual quantity of solvent (such as glycol dipropionate ether acetate and 1,3-propanediol). The needle cylinder injection typed lead-free solder paste of the invention has low welding temperature, comparatively low viscosity, better rheological property under the action of the pressure, and better anti-collapse performance after the solder paste is coated, and is especially applicable to the welding of the radiators, and is beneficial to precisely controlling the dosage of the welding paste and saving the cost.

Description

technical field [0001] The invention relates to a lead-free solder paste for soldering electronic products, which is especially suitable for injecting and dripping the solder paste on radiators. Background technique [0002] Heat dissipation has become a major stumbling block restricting the rapid development of chip performance, and is a life-threatening issue for the entire information industry and even the global economy. Reliable radiator welding is the guarantee of good cooling effect of the chip. As people pay more attention to environmental protection and their own health, it is imperative to make solder paste lead-free. Due to the poor thermal shock resistance of the heat sink used for chip heat dissipation, it is necessary to choose a solder paste with a lower soldering temperature during soldering. The existing lead-free solder pastes include tin-silver, tin-copper and other series, and the soldering temperature is mostly above 200°C, which cannot meet the requir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/26B23K35/363
Inventor 徐安莲邓小安卫国强
Owner PERFECTION SCI & TECH DONGGUAN
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