Polyurethane resin, heat solidifying resin composition containing the same and its solidifying article

A technology of polyurethane resin and resin composition, applied in the field of solder heat resistance and resistance, to achieve the effect of low cost and high productivity

Active Publication Date: 2009-01-14
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

By using such a carboxyl group-containing polyurethane resin in combination with an epoxy resin as a thermosetting component, the above-mentioned problems of the conventional solder resist ink can be solved, but there is still room for improvement in properties such as solder heat resistance

Method used

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  • Polyurethane resin, heat solidifying resin composition containing the same and its solidifying article
  • Polyurethane resin, heat solidifying resin composition containing the same and its solidifying article
  • Polyurethane resin, heat solidifying resin composition containing the same and its solidifying article

Examples

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Embodiment

[0053] The present invention will be specifically described below by showing Examples and Comparative Examples. In addition, the following "parts" and "%" are mass standards unless otherwise stated.

Synthetic example 1

[0055] A polycarbonate diol derived from 1,5-pentanediol and 1,6-hexanediol (Ube Industries, Ltd. Co., Ltd., PCDL800, number average molecular weight 800) 360 g (0.45 mol), dimethylol butyric acid 81.4 g (0.55 mol), and a compound having one alcoholic hydroxyl group and one or more phenolic hydroxyl groups in one molecule Hydroxyphenethyl alcohol 22.1g (0.16mol). Next, add 187.9 g (1.08 mol) of toluene diisocyanate as polyisocyanate, heat to 60°C while stirring, stop heating, and heat again when the temperature in the reaction vessel begins to drop, continue stirring at 80°C, The absorption spectrum confirms the absorption spectrum of the isocyanate group (2280cm -1 ) disappears and the reaction is terminated. Next, carbitol acetate was added so that the solid content would be 50% by weight, and a viscous liquid polyurethane resin (varnish A) having a phenolic hydroxyl group containing a diluent was obtained. The acid value of the solid content of the obtained polyurethane ...

Synthetic example 2

[0057] A polycarbonate diol derived from 1,5-pentanediol and 1,6-hexanediol (Ube Industries, Ltd. Co., Ltd., PCDL800, number average molecular weight 800) 360 g (0.45 mol), dimethylol butyric acid 81.4 g (0.55 mol), and a compound having one alcoholic hydroxyl group and one or more phenolic hydroxyl groups in one molecule Hydroxyphenethyl alcohol 22.1g (0.16mol). Next, add 83.5 g (0.48 mol) of toluene diisocyanate and 111.6 g (0.60 mol) of trimethylhexamethylene diisocyanate as polyisocyanate, heat to 60 ° C while stirring, stop heating, and the temperature in the reaction vessel When it starts to decrease, heat again, continue to stir at 80°C, and confirm the absorption spectrum of the isocyanate group (2280cm -1 ) disappears and the reaction is terminated. Next, carbitol acetate was added so that the solid content would be 50% by weight, and a viscous liquid polyurethane resin (varnish B) having a phenolic hydroxyl group containing a diluent was obtained. The acid value o...

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Abstract

Provided is a polyurethane resin, a thermosetting resin composition including the same and a condensate thereof, forming into a flexible overlay film with excellent sealing performance, flexibility resistance, low warping performance, solder thermal endurance, chemigold plating endurance, electric insulativity and the like, providing a peotective film made of condensate in low cost, a flexible printed plate board of an insulation layer and the like. The polyurethane resin has a phenolic hydroxyl group, preferably has one phenolic hydroxyl group through reacting (a) polyisocyanate, (b) the compound with more than two alcoholic hydroxyl groups and (c) the compound with one alcoholic hydroxyl group and more than one phenolic hydroxyl group to be guided to a terminal. The thermosetting resin composition includes polyurethane resin with the phenolic hydroxyl group and thermoset compound, preferably epoxy resin. Preferably a curing accelerant is included.

Description

technical field [0001] The present invention relates to a polyurethane having a phenolic hydroxyl group suitable for forming a flexible film excellent in adhesion to a substrate, folding resistance, low warpage, solder heat resistance, chemical gold plating resistance, electrical insulation, etc. Resins and thermosetting resin compositions containing them, protective films and insulating materials made of their cured products, resistors used in the manufacture of printed circuit boards, especially in the manufacture of flexible printed circuit boards, and in the manufacture of tape-carrying packages Solder, protective films such as interlayer insulating films, insulating layers, backlights of liquid crystal displays, protective films for back electrodes of electroluminescence panels used in displays for displaying information, display panels of mobile phones, clocks, car audio, etc. It is useful for protective films, ICs, super LSI sealing materials, etc. Background techniqu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/28C08G18/83C08L75/04H05K3/28
CPCC08G18/40C08G18/54C08G18/58C08G18/72C08J3/247C08L75/04H05K1/00
Inventor 峰岸昌司米田一善
Owner TAIYO HLDG CO LTD
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