Unlock instant, AI-driven research and patent intelligence for your innovation.

Photosensitive composition, photosensitive film, permanent pattern forming method, and printed board

A photosensitive composition and photosensitivity technology, applied in the direction of printed circuit, printed circuit manufacturing, circuit, etc.

Inactive Publication Date: 2012-01-18
FUJIFILM CORP
View PDF42 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, there has not been provided a specific high molecular compound to provide a sensitivity, resolution, electroless gold plating resistance, and storage stability, which can effectively form high-definition permanent patterns (protective films, interlayer insulating films, and resistive films). Solder patterns, etc.), a photosensitive film, a permanent pattern forming method using the photosensitive film, and a printed circuit board using the permanent pattern forming method to form a permanent pattern are to be further improved and developed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Photosensitive composition, photosensitive film, permanent pattern forming method, and printed board
  • Photosensitive composition, photosensitive film, permanent pattern forming method, and printed board
  • Photosensitive composition, photosensitive film, permanent pattern forming method, and printed board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0638] Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited by these examples.

Synthetic example 1

[0640] Into a 1,000 mL three-necked flask, 159 g of 1-methoxy-2-propanol was added, and the mixture was heated to 85°C under nitrogen flow. A solution of 159 g of 1-methoxy-2-propanol of 63.4 g of benzyl methacrylate, 72.3 g of methacrylic acid, and 4.15 g of V-601 (manufactured by Wako Pure Chemical Industries, Ltd.) was dripped there over 2 hours. After completion of the dripping, it was further heated for 5 hours and allowed to react. Next, heating was stopped to obtain a copolymer of benzyl methacrylate / methacrylic acid (30 / 70 mol % ratio).

[0641] Next, 120.0 g of the copolymer solution was transferred to a 300 mL three-necked flask, 16.6 g of glycidyl methacrylate and 0.16 g of p-methoxyphenol were added, and the mixture was stirred and dissolved. After dissolution, 2.4 g of tetraethylammonium chloride was added, and the mixture was heated to 100° C. to perform an addition reaction. After confirming disappearance of glycidyl methacrylate by gas chromatography, heating...

Synthetic example 2～27

[0646] In order to obtain the desired polymer compound, the same procedure as in Synthesis Example 1 was carried out, except that benzyl methacrylate, methacrylic acid and glycidyl methacrylate in Synthesis Example 1 were appropriately changed to arbitrary monomers, The polymer compounds 2 to 27 shown in Tables 1 to 5 were prepared, respectively.

[0647] [Table 1]

[0648]

[0649] [Table 2]

[0650]

[0651] [table 3]

[0652]

[0653] [Table 4]

[0654]

[0655] [table 5]

[0656]

[0657] In Tables 1 to 5, * 1 represents a mixture of the structure represented by the following structural formula (a) and the structure represented by (b) (the mixing ratio is unknown), * 2 represents the mixing of the structure represented by the following structural formula (c) and (d) (the mixing ratio is unknown).

[0658] Structural formula (a)

[0659] Structural formula (b)

[0660] Structural formula (c)

[0661] Structural formula (d)

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
softening pointaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

Disclosed is a photosensitive composition which is excellent in sensitivity, resolution, electroless gold plating resistance and storage stability by containing a certain polymer compound. This photosensitive composition enables to efficiently form a high-precision permanent pattern (such as a protective film, an interlayer insulating film and a solder resist pattern). Also disclosed are a photosensitive film, a permanent pattern forming method using such a photosensitive film, and a printed board having a permanent pattern formed by such a permanent pattern forming method. Specifically disclosed is a photosensitive composition containing a binder, a polymerizable compound, a photopolymerization initiator, and an alkali-insoluble thermal crosslinking agent. The binder contains a polymer compound which has an aromatic group optionally containing a heterocycle and an ethylenically unsaturated bond in a side chain.

Description

technical field [0001] The present invention relates to a photosensitive composition, a photosensitive film, a permanent pattern, a photosensitive film, a permanent pattern (a protective film, an interlayer insulating film, a solder resist pattern, etc.) which are excellent in sensitivity, resolution and storage stability and can efficiently form a high-definition permanent pattern (protective film, interlayer insulating film, solder resist pattern, etc.). A pattern forming method and a printed circuit board using the permanent pattern forming method to form a permanent pattern. Background technique [0002] Conventionally, when forming permanent patterns, such as a solder resist pattern, the photosensitive film which forms a photosensitive layer by apply|coating and drying a photosensitive resin composition on a support is used. As a method for producing the permanent pattern, for example, on a substrate such as a copper-plated laminate on which the permanent pattern is for...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/038G03F7/004H01L21/027H05K3/00
CPCG03F7/033H05K3/287G03F7/038
Inventor 藤牧一广神川弘
Owner FUJIFILM CORP