Preparation method of planar magnetic core spiral structure micro-inductance device

A technology of helical structure and plane helix is ​​applied in the field of preparation of micro-inductance devices, which can solve the problems of device performance impact, difficulty in obtaining high-performance micro-inductance devices, etc., achieve high operating frequency, avoid undercutting phenomenon, and improve high-frequency characteristics. Effect

Inactive Publication Date: 2012-02-15
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Moreover, in the production process, the author uses a semi-closed magnetic core structure, which produces magnetic flux leakage and affects the performance of the device, so it is difficult to obtain high-performance micro-inductance devices

Method used

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  • Preparation method of planar magnetic core spiral structure micro-inductance device
  • Preparation method of planar magnetic core spiral structure micro-inductance device
  • Preparation method of planar magnetic core spiral structure micro-inductance device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] (1) Sputter a 30nm-thick Cr layer on one side of the cleaned glass substrate (referred to as the B side), throw the positive glue AZ4000 series, the thickness of the photoresist is 3 μm, and then dry the photoresist ; Expose and develop the photoresist on the back, etch the Cr layer in the etching solution, and then remove all the photoresist with acetone; throw polyimide to a thickness of 3 μm, and then perform polyimide drying and curing process , resulting in a double-sided overlay alignment symbol.

[0050] (2) Spray epoxy resin AB glue on the other side of the glass substrate (called A side), and then bond the magnetic core material on the A side of the substrate, and let it dry naturally. The following processes are all carried out on side A;

[0051] (3) Throw away the positive resist, the thickness of the photoresist is 5 μm, dry the photoresist; expose and develop; then etch the magnetic core material in the acid etching solution, remove the photoresist and ep...

Embodiment 2

[0067] (1) Sputter a 50nm-thick Cr layer on one side of the cleaned glass substrate (referred to as the B side), throw the positive glue AZ4000 series, the thickness of the photoresist is 4 μm, and then dry the photoresist ; Expose and develop the photoresist on the back, etch the Cr layer in the etching solution, and then remove all the photoresist with acetone; throw polyimide to a thickness of 4 μm, and then perform polyimide drying and curing process , resulting in a double-sided overlay alignment symbol.

[0068] (2) Spray epoxy resin AB glue on the other side of the glass substrate (called A side), and then bond the magnetic core material on the A side of the substrate, and let it dry naturally. The following processes are all carried out on side A;

[0069] (3) Throw away the positive resist, the thickness of the photoresist is 8 μm, dry the photoresist; expose and develop; then etch the magnetic core material in the acid etching solution, remove the photoresist and ep...

Embodiment 3

[0085] (1) Sputter a layer of 80nm thick Cr layer on one side of the cleaned glass substrate (referred to as the B side), throw the positive glue AZ4000 series, the thickness of the photoresist is 5 μm, and then dry the photoresist ; Expose and develop the photoresist on the back side, etch the Cr layer in the etching solution, and then remove all the photoresist with acetone; throw polyimide with a thickness of 5 μm, and then perform polyimide drying and curing process , resulting in a double-sided overlay alignment symbol.

[0086] (2) Spray epoxy resin AB glue on the other side of the glass substrate (called A side), and then bond the magnetic core material on the A side of the substrate, and let it dry naturally. The following processes are all carried out on side A;

[0087](3) Throw away the positive resist, the thickness of the photoresist is 10 μm, dry the photoresist; expose and develop; then etch the magnetic core material in the acid etching solution, remove the ph...

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Abstract

A planar magnetic core spiral structure micro-inductance device in the field of microelectronic technology and a preparation method thereof. The micro-inductance device includes a substrate, a magnetic core material, an insulating material, a planar spiral structure coil, pins, and leads. The planar spiral structure coil is wrapped by two layers of magnetic core materials and separated by polyimide. The center pin and the outer lead The feet are connected. The process is as follows: sputtering Cr layer, removing glue, photolithography, developing, etching, making overlay alignment symbols; bonding magnetic core material, removing glue, photolithography, developing, etching magnetic core material; throwing polyimide amine and drying, curing, polishing; sputtering, glue removal, photolithography, development, electroplating, making planar spiral coils, leads and pins; drying polyimide and curing, polishing; sputtering Ti layer, throwing Glue, photolithography, development, etching; bonded magnetic core material, plastic rejection, photolithography, development, etching magnetic core material. The invention greatly reduces the high-frequency loss of the micro-inductance device, and effectively improves the high-frequency performance of the device.

Description

technical field [0001] The invention relates to a preparation method of a micro-inductance device in the technical field of microelectronics, in particular to a preparation method of a planar magnetic core spiral structure micro-inductance device. Background technique [0002] In recent years, miniaturized portable electronic products such as mobile communication products CDMA (Code Division Multiple Access), laptops, network products ADSL (Asymmetric Digital Subscriber Line), microprocessors, digital cameras, flash memory devices, audio, chargers, etc. It is getting more and more attention and welcome from the market. The miniaturization and miniaturization of these portable electronic products must first consider the miniaturization and miniaturization of electronic components. Magnetic devices such as inductive devices and their power transformers, DC-DC converters, oscillators, filters, amplifiers and tuners are indispensable and important components in electronic circu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F17/04H01F27/26H01F27/28H01F27/32H01F41/00
Inventor 周勇冯书谊周志敏雷冲
Owner SHANGHAI JIAOTONG UNIV
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