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Noise suppression wiring components and printed circuit boards

A noise suppression and circuit substrate technology, applied in printed circuit parts, electrical components, magnetic field/electric field shielding, etc., can solve problems such as inability to fully suppress radiation noise, not suitable for high-density installation, etc., and achieve suppression of conduction noise and radiation noise , Suppressing noise radiation, the effect of suppressing noise radiation

Inactive Publication Date: 2011-12-28
SHIN-ETSU POLYMER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] However, since the capacitive laminate has a certain thickness, the capacitive printed circuit board must be thickened, and it is not suitable for high-density mounting.
Furthermore, if the capacitive printed wiring board is thickened, resonance tends to occur between conductors having a parallel plate structure, so radiation noise cannot be sufficiently suppressed

Method used

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  • Noise suppression wiring components and printed circuit boards
  • Noise suppression wiring components and printed circuit boards
  • Noise suppression wiring components and printed circuit boards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3

[0186] (thickness of noise suppression layer)

[0187] The cross-section of the noise suppression layer was observed using a transmission electron microscope H9000NAR manufactured by Hitachi, Ltd., and the thicknesses of the noise suppression layer were measured at five places and averaged.

[0188] (Bond strength)

[0189] According to JIS C5012, using TENSILON, the peeling strength between the copper foil of a wiring part and an insulating resin layer was measured at a pulling angle of 90 degrees and a pulling speed of 50 mm / min.

[0190] (noise suppression effect)

[0191] Create a 2-layer substrate consisting of a ground plane and a power plane, mount SMA connectors connected to the power plane and ground plane on both ends of the power plane divided into two, and use a network analyzer connected to the connectors (manufactured by Anritsu Corporation, 37247D), S21 (transmission attenuation, unit: dB) was measured by the S parameter method, and the resonance state of the ...

Embodiment 1

[0195] A 1% by mass solution of 3-glycidyl ether propyltrimethoxysilane was coated on a smooth surface of an electrolytic copper foil and dried to form an adhesion promoting layer, wherein one surface (smooth surface) of the electrolytic copper foil was The surface roughness Rz of the other roughened surface was 2 μm, the surface roughness Rz was 5.3 μm, and the thickness thereof was 35 μm.

[0196] 30 parts by mass of bisphenol A type epoxy resin (manufactured by Japan Epoxy Resins Corporation, 828), 30 parts by mass of brominated bisphenol A type resin (manufactured by Tohto Kasei Co., Ltd., YDB-500), and cresol novolac type epoxy resin ( Tohto Kasei Co., Ltd., YDCN-704) 35 parts by mass were dissolved in methyl ethyl ketone, and then 0.2 parts by mass of imidazole hardening accelerator (Shikoku Chemicals Co., Ltd., Curezol 2E4MZ) was added to prepare a resin composition of 8 mass % varnish for objects.

[0197] The varnish of this resin composition was coated on the adhesi...

Embodiment 2

[0202] A 1% by mass solution of 3-mercaptopropyltrimethoxysilane was coated on a smooth surface of an electrolytic copper foil and dried to form an adhesion promoting layer, wherein one surface (smooth surface) of the electrolytic copper foil had a rough surface The surface roughness Rz was 0.4 μm, and the surface roughness Rz of the other roughened surface was 5.3 μm, and its thickness was 18 μm.

[0203] 95 parts by mass of polyethersulfone resin (manufactured by Sumitomo Chemical Co., Ltd., PES5003P), 5 parts by mass of bisphenol A epoxy resin (manufactured by Japan Epoxy Resins Corporation, 828EL), imidazole-based hardening accelerator (manufactured by Shikoku Chemicals, Curezol 2MZ) ) 0.1 parts by mass was dissolved in a mixed solvent (50 / 50 mass ratio) of N,N-dimethylformamide / cyclohexane to prepare a 0.5 mass % varnish A of a resin composition.

[0204] The varnish A of this resin composition was coated on the adhesion promotion layer to form a coating film so that the ...

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Abstract

The present invention provides a wiring part for a printed wiring board and a printed wiring board having the wiring part, wherein the wiring part can stabilize a power supply by suppressing resonance between a power supply layer and a ground plane caused by a synchronous switch potential, and can suppress unwanted noise radiation. The wiring member includes: a copper foil having a smooth surface with a surface roughness Rz of 2 μm or less; a noise suppression layer containing metal or conductive ceramics and having a thickness of 5 nm to 200 nm; and an insulating resin layer provided on the copper foil between the smooth surface side and the noise suppression layer.

Description

technical field [0001] The present invention relates to a noise suppressing wiring member and a printed wiring board for constituting a printed wiring board. In addition, the present invention relates to a noise suppression structure and a multilayer printed wiring board. [0002] This application claims the benefit of Japanese Patent Application No. 2006-181179 filed on June 30, 2006 and Japanese Patent Application No. 2006-199286 filed on July 21, 2006, the contents of which are incorporated herein. Background technique [0003] In recent years, with the popularization of the use of the Internet, personal computers, information appliances, wireless LAN, Bluetooth, optical modules, portable phones, game consoles, portable information terminals, and intelligent transportation systems have high clock speeds of quasi-microwave band (0.3-10GHz). High-frequency CPUs, electronic equipment using high-frequency buses, and information and communication equipment using radio waves a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K9/00
Inventor 川口利行田原和时佐贺努根岸满明
Owner SHIN-ETSU POLYMER CO LTD