Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

57results about How to "Reduce loop area" patented technology

System and method for dynamic bandwidth allocation on PONs

Mechanisms for providing a subscriber-side interface with a passive optical network are described herein. An optical network termination (ONT) having an integrated broadband passive optical network processor is utilized to receive downstream data from an optical line termination (OLT) via a passive optical network and provide the contents of the downstream data to one or more subscriber devices via one or more data interfaces. Similarly, the ONT is adapted to receive and transmit upstream data from the one or more subscriber devices to the OLT via the passive optical network. The ONT preferably implements one or burst buffers for buffering upstream and / or downstream data. The ONT can be adapted to notify the OLT of the status of the burst buffer, thereby allowing the OLT to modify the bandwidth allocations.
Owner:IKANOS COMMUNICATIONS

Interposer containing bypass capacitors for reducing voltage noise in an IC device

One embodiment of the present invention provides an apparatus that reduces voltage noise for an integrated circuit (IC) device. This apparatus includes an interposer, which is configured to be sandwiched between the IC device and a circuit board. This interposer has a bottom surface, which is configured to receive electrical connections for power, ground and other signals from the circuit board, and a top surface, which is configured to provide electrical connections for power, ground and the other signals to the IC device. A plurality of bypass capacitors are integrated into the interposer and are coupled between the power and ground connections for the IC device, so that the plurality of bypass capacitors reduce voltage noise between the power and ground connections for the IC device.
Owner:APPLE INC

Interposer containing bypass capacitors for reducing voltage noise in an IC device

One embodiment of the present invention provides an apparatus that reduces voltage noise for an integrated circuit (IC) device. This apparatus includes an interposer, which is configured to be sandwiched between the IC device and a circuit board. This interposer has a bottom surface, which is configured to receive electrical connections for power, ground and other signals from the circuit board, and a top surface, which is configured to provide electrical connections for power, ground and the other signals to the IC device. A plurality of bypass capacitors are integrated into the interposer and are coupled between the power and ground connections for the IC device, so that the plurality of bypass capacitors reduce voltage noise between the power and ground connections for the IC device.
Owner:APPLE INC

System and method for improved data protection in PONs

Mechanisms for providing a subscriber-side interface with a passive optical network are described herein. An optical network termination (ONT) having an integrated broadband passive optical network processor is utilized to receive downstream data from an optical line termination (OLT) via a passive optical network and provide the contents of the downstream data to one or more subscriber devices via one or more data interfaces. Similarly, the ONT is adapted to receive and transmit upstream data from the one or more subscriber devices to the OLT via the passive optical network. The ONT preferably implements one or more encryption / decryption mechanisms, such as the digital encryption standard (DES), to provide data protection in addition to, or in place of, data churning provided for by the ITU G.983 recommendations.
Owner:SYNAPTICS INC

Wiring method for printed circuitboard and printed circuitboard

The invention is applied to PCB making field, providing a PCB routing method and the PCB. As routing, it routes power and ground lines in parallel with signal lines. And it provides nearby power and ground return paths for signals, reducing signal circuit area and improving PCB EMC. Besides, it improves PCB EMC effect by placing filter capacitors in the signal layer transfer position on this basis according to actual requirements, or gridding power and ground network, or placing filter capacitors between power and ground network traces.
Owner:HUAWEI TECH CO LTD

Radiation source screening and positioning method based on STFT time frequency analysis

The invention discloses a radiation source screening and positioning method based on STFT time frequency analysis. According to the method, an independent component analysis ICA algorithm is in combination with STFT, and a systematic, comprehensive, standardized radiated EMI analysis and diagnosis method is proposed. Firstly, radiation noise of EUT is separated through an ICA algorithm, and multiple radiation noise sources are screened out; secondly, short-time rapid Fourier transform and time frequency analysis on exceeding-standard frequency ranges of the overall radiation noise are carried out, and signal characteristics causing exceeding-standard radiation are extracted; lastly, the extracted signal characteristics and the multiple radiation noise sources screened out by the ICA are contrasted, positioning diagnosis on the noise sources causing exceeding-standard radiation noise is carried out, and pertinent rectification inhibition measures are adopted. The method can rapidly and effectively inhibit exceeding-standard noise of equipment through searching the corresponding device causing exceeding-standard radiation.
Owner:NANJING NORMAL UNIVERSITY

Giant magneto-impedance effect sensing probe based on flexible circuit board

InactiveCN101699309AReduce loop areaGood anti-interference abilityMagnetic measurementsEngineeringMagneto impedance
The invention discloses a giant magneto-impedance effect sensing probe based on a flexible circuit board. The sensing probe belongs to the technical field of magnetic field detection and is characterized in that the probe uses a double-layer flexible circuit board comprising two coincident straight wires with a longer length than an end effect critical length of a magnetic alloy wire or belt. The two wires are in short connection through vias at one end, and the other end of each wire leads out a twin conductor by means of a bonding pad to provide a sensing signal. One wire is disconnected for a certain gap in the middle, and the middle section of a magnetic alloy wire or a magnetic alloy belt is accessed on two bonding pads at the two sides of the gap by constant temperature welding spots. The magnetic alloy wire or belt is straightened along the wire direction and attached on the surface of the flexible circuit board by virtue of an inviscid insulating film, and is fixed by a viscous insulating film to constitute the integral sensing probe. The sensing probe has a sensitive giant magneto-impedance effect within 10MHz to 30MHz, and the machined probe has consistent measuring properties and is strong in anti-interference performance when in application.
Owner:TSINGHUA UNIV

PCB and wiring method thereof

The invention discloses a PCB and wiring method thereof. The method comprises the following steps: accompanying ground holes are additionally formed near layer changing through holes, and are wrapped in the middle of signal wires. According to the invention, as the accompanying ground holes are additionally formed, the signal wires and the accompanying ground holes form a signal loop circuit; the problem that reversed flow ground plane is missing is solved; a favorable reversed flow track is provided for signals; convenience is provided for nearby reversed flow after the signals change layer; loop circuit area is reduced; electromagnetic radiation caused by layer changing of the signals is reduced, so that the signal quality and stability of a system are improved.
Owner:INSPUR BEIJING ELECTRONICS INFORMATION IND

Embedded type wiring terminal sealing cover for large aluminium electrolytic capacitors

Disclosed is an embedded type wiring terminal sealing cover for large aluminium electrolytic capacitors, wherein an insulating material which is identical with a terminal cover and integrated with an insulating terminal block is used for coating a naked positive wiring terminal post and a naked negative wiring terminal post respectively or integrally, or the wiring terminal posts are embedded into the insulating material body of the cover, so that the distance between the positive wiring terminal post and the negative wiring terminal post in the insulating material is reduced, the area of a loop is reduced, the equivalent series inductance (ESL) value is reduced, and at the same time, the risk that the positive pole and the negative pole are short-circuited caused by an electrolyte splashed during release of a pressure valve is eliminated.
Owner:周旺龙

System and method for flexible circuits

A flexible printed circuit improves data transfer rates by disposing ground wires in a ground plane proximate to signal wires disposed in a signal channel plane. One or more ground wires is associated with each signal wire pair or each signal wire for imaging of the return currents of the signal pairs. An overlapping alignment minimizes loop area between a ground wire and its associated signal wire. An offset alignment provides a reduced loop area and reduced breakage risk since movement of the flexible-circuit does result in compression of the signal wire and its associated ground wire. A combination of overlapping and offset alignment balances signal transfer effectiveness with breakage risk by offsetting ground and signal wires is stress sensitive regions and overlapping ground and signal wires in stress tolerant regions. In one embodiment, the flexible circuit interfaces a portable computer with a display lid to support high-speed display signals with reduced breakage risk from cycling the display lid between an open and closed position.
Owner:DELL PROD LP

Self-excitation driving and power conversion circuit based on GaN HEMT device

The invention discloses a self-excitation driving and power conversion circuit based on a GaN HEMT device. The self-excitation driving and power conversion circuit adopts the novel GaN-based HEMT device, and improves the working frequency of the circuit to MHz. The device adopts a silicon substrate, and adopts on-chip design of a Q1 transistor and a Q2 transistor, wherein the two transistors share one wafer, so that the size is reduced, the cost is reduced, and the reliability control is improved. The device further adopts an integrated anti-parallel diode structure, so that the reverse conduction characteristic of the device is improved. According to the self-excitation driving and power conversion circuit, through using a third auxiliary winding Na in a main transformer of a power circuit, a self-excitation driving cavity in a positive feedback mode is adopted to automatically provide a driving signal for Q1, a control chip is not needed, and the driving of the Q1 needs to be ensured to be reliable through a special driving buffer circuit for the GaN HEMT device. The self-excitation driving and power conversion circuit further adopts an integrated high-frequency current cycle-by-cycle detection scheme, and shares one coil with the self-excitation driving cavity, so that a current detection resistor is omitted, and lossless current detection is realized.
Owner:扬州江新电子有限公司

Input rectifying/filtering circuit capacitor board in large power switch power supply

The invention relates to an A-typed capacitor plate of an input rectifier / filter circuit in a large-power switch power, consisting of a capacitor cathode plate and a capacitor anode plate; the capacitor cathode plate takes the shape of inverted-U, the upper half part of which has a parallel capacitor, the left lower half part of which is connected with the output cathode of a rectifier bridge and the right lower half part of which is connected with an IGBT cathode; the capacitor plate anode takes the hilt shape, the left folding part of which is connected with a filter resistor, the right lower-half part of which is connected with the IGBT anode; the capacitor cathode plate is connected with the capacitor anode plate by a cushion column. The cathode of the capacitor plate and the anode of the capacitor plate are respectively two copper plates which are superposed upwards and downwards, close to each other, and connected with each other by the cushion column; therefore, the capacitor plate reduces the inductance of the current circuit, overcomes the defects of shortening the service life of the capacitor, increasing the corrugation of output voltage and ESL-induced electromagnetic interference, as the conductive wires with the flat rectangular section have close distance, the corrugated current passing by the capacitor is large, and the heating is severer.
Owner:INST OF MODERN PHYSICS CHINESE ACADEMY OF SCI

Semiconductor device and electronic apparatus

According to a semiconductor device (101), a first switching active element (103) of a normally-on type and a second switching active element (104) of a normally-off type are cascode-connected to each other. This causes an electric current path to be formed. The first and second switching active elements (103, 104) are provided and connected so that loop area of the electric current path is a minimum area in a plan view of the semiconductor device (101).
Owner:SHARP KK

Compact structure of power-supply apparatus capable of minimizing electromagnetic noise

A power-supply apparatus is provided which includes a transformer, a primary semiconductor unit, a secondary semiconductor unit, and a secondary electronic device. Each of the primary semiconductor unit and the secondary semiconductor units has a plurality of semiconductor devices installed therein. The transformer, the primary semiconductor unit, the secondary semiconductor unit, and the secondary electronic device are electrically joined through connecting conductors. The transformer is laid on the primary semiconductor unit to make a first stack. Similarly, the secondary electronic device is laid on the secondary semiconductor unit. This permits the power-supply apparatus to be reduced in overall size thereof and minimizes adverse effects of electromagnetic noise to ensure the high efficiency in power supply operation.
Owner:DENSO CORP

Circuit and method capable of lowering loop noise of active earphone

ActiveCN104469617AReduces active headphone loop noiseLow magnetic field radiationEarpiece/earphone attachmentsTransducer circuitsLine widthCapacitance
The invention provides a circuit capable of lowering loop noise of an active earphone. The circuit comprises an integrated circuit module and a power module which are arranged on a PCB, a capacitor is further connected between the integrated circuit module and the power module, and the capacitor is arranged on one side of the integrated circuit module. The circuit further comprises a grounding wire which is arranged parallel to a power line, and the horizontal gap between the power line and the grounding wire is smaller than or equal to one half the sum of the width of the power line and the width of the grounding wire. One pole of the capacitor is electrically connected with a power pin of the integrated circuit module through the power line, the other pole of the capacitor is electrically connected with a ground pin of the integrated circuit module through the grounding wire, and the arrangement direction of the capacitor is consistent with the current direction of the power line. The invention further provides a method capable of lowering the loop noise of the active earphone. The capacitor is arranged in the direction of currents passing the power line, the distance between the power line and the grounding wire is shortened, and thus the current loop area is decreased to the maximal degree. According to the circuit and method, the cost is low, the efficiency is high and the applicability is wide.
Owner:QINGDAO GOERTEK

Diode bridge low-inductance module for circuit breaker

The invention discloses a diode bridge low-inductance module for a circuit breaker. The diode bridge low-inductance module comprises an IEGT press-fitting structure, a diode press-fitting structure, adamping capacitor, a damping resistor and a connecting busbar set; a C-pole conducting plate is shared by C poles of two IEGTs welded in a pressed mode in the IEGT press-fitting structure, and an E-pole arched connecting bar is shared by E poles; a negative electrode conducting plate is shared by diodes welded in a pressed mode in the diode press-fitting structure share, so that electrical connecting lines in most units are removed, the number of the electrical connecting lines is reduced, the loop area is reduced, the structure of the diode bridge low-inductance module is more compact, the space occupation is small, and the cost is reduced; and the branch inductance and the loop inductance of the diode bridge low-inductance module used for a transfer branch of the circuit breaker are greatly reduced.
Owner:NORTH CHINA ELECTRIC POWER UNIV (BAODING)

Metal foil interconnection of electrical devices

An electrical assembly (300, 400) includes a power IC such as a MOSFET (112, 412) attached to a substrate module (114, 214). The MOSFET includes a top surface comprising first and second conductive device surfaces (A, B), associated with first and second device ports, and a bottom surface comprising a third conductive device surface C associated with a third device port. A first foil element is bonded to the first conductive device surface(s) A and to each of the first conductive substrate surfaces (A1, A2) and provides a continuous conductive pathway from each conductive surface (A) to each other conductive surface (A) and to each conductive surface (A1, A2). A second foil element is bonded to the second conductive device surface(s) B and to the second conductive substrate surface B1 and provides a continuous conductive pathway from each device conductive surface (B) to the substrate conductive surface (B1). A third foil element may be installed to electrically interconnect the discrete second device surfaces (B). The foil elements reduce interconnection parasitics and reduce charge and thermal energy density at device conductive surfaces as compared to wire bonded electrical interconnections. The foil elements may be comprised of formed metal elements that are flexible but sufficiently rigid to hold a formed shape or flexible foils supported on a flexible dielectric substrate.
Owner:RAYTHEON CO

Electric control board and refrigerating apparatus

The invention discloses an electric control board and a refrigerating apparatus. The electric control board comprises a strong current component, a weak current component, a printed substrate and a refrigerant radiator sleeve, wherein the strong current component comprises an electric reactor and a cooled element needing to be cooled; the cooled element is arranged in the refrigerant radiator sleeve; the electric reactor and the weak current component are arranged on the two sides of the refrigerant radiator sleeve respectively; the strong current component, the weak current component and the refrigerant radiator sleeve are all arranged on the printed substrate; and the refrigerant radiator sleeve performs cooling of the cooled element through a refrigerant. By virtue of the technical scheme, circuit connection of the electric control board is simplified and electromagnetic interference is reduced.
Owner:GD MIDEA AIR-CONDITIONING EQUIP CO LTD

Signal interconnector

The invention provides a signal interconnector which is applicable to the field of signal transmission. The signal interconnector comprises a first ground pin unit and one or a plurality of clock signal pins for transmitting clock signals, wherein the first ground pin unit comprises one or a plurality of first ground pins, and at least one first ground pin is arranged adjacent to one clock signal pin. The first ground pin arranged adjacent to the clock signal pin is used for controlling the transmission impedance of the clock signal pin and reducing the area of a return circuit of the clock signals. The signal interconnector controls the effective transmission of the clock signals by arranging the ground pin in the adjacent position of the clock signal pin, so that the clock signals have a low-impedance return circuit. The area of the return circuit is reduced, the mutual crosstalk of the signals is avoided, and the seamless connection as well as the integrity and the compatibility of the signals are realized.
Owner:深圳市研祥通讯终端技术有限公司

Metal foil interconnection of electrical devices

An electrical assembly (300, 400) includes a power IC such as a MOSFET (112, 412) attached to a substrate module (114, 214). The MOSFET includes a top surface comprising first and second conductive device surfaces (A, B), associated with first and second device ports, and a bottom surface comprising a third conductive device surface C associated with a third device port. A first foil element is bonded to the first conductive device surface(s) A and to each of the first conductive substrate surfaces (A1, A2) and provides a continuous conductive pathway from each conductive surface (A) to each other conductive surface (A) and to each conductive surface (A1, A2). A second foil element is bonded to the second conductive device surface(s) B and to the second conductive substrate surface B1 and provides a continuous conductive pathway from each device conductive surface (B) to the substrate conductive surface (B1). A third foil element may be installed to electrically interconnect the discrete second device surfaces (B). The foil elements reduce interconnection parasitics and reduce charge and thermal energy density at device conductive surfaces as compared to wire bonded electrical interconnections. The foil elements may be comprised of formed metal elements that are flexible but sufficiently rigid to hold a formed shape or flexible foils supported on a flexible dielectric substrate.
Owner:RAYTHEON CO

Modular power conversion system with galvanic insulation

A modular power conversion system is provided which includes a plurality of building blocks comprised of transformers and power conversion bridges, and a high frequency AC link that transfers power and provides galvanic isolation between the building blocks. The high frequency link includes an insulating tube separating an AC link conductor and the building blocks. The insulating tube is further provided with conductive or semiconductive layers on its inner and outer surfaces for referencing them to the electric potentials of the adjacent conductors and windings, thereby placing the high electric fields substantially directly across the tube and reducing electric fields and partial discharge or corona in the adjoining space or media. The building blocks may be arranged in multiple stacks for DC or AC interface, preferably with neutral or lower voltage connections at the outer edges of the stacks and higher voltage terminals at the centers of the stack.
Owner:RAJU RAVISEKHAR NADIMPALLI

Interface terminal of thin-film capacitor

InactiveCN105957711AReduce the equivalent inductance valueSimple structureThin/thick film capacitorStacked capacitorsPower flowBusbar
The invention provides an interface terminal of a thin film capacitor, which includes a shell, and a bus bar is arranged in the shell, and a DC bus bar interface terminal and an IGBT interface terminal are drawn out from the bus bar. The interface terminals are all composed of a vertical connection plate connected to the busbar and a horizontal connection plate for connecting IGBTs. The positive and negative interface terminals are separated by an insulating plate. Since the area of ​​the current loop is proportional to the inductance, changing the IGBT interface terminal from the horizontal setting to the vertical setting can reduce the loop area, thereby reducing the loop inductance accordingly. The interface terminal provided by the invention overcomes the shortcomings of the prior art, effectively reduces the equivalent inductance value of the film capacitor, and meanwhile has simple structure, convenient processing and manufacturing, and low cost.
Owner:SHANGHAI EAGTOP ELECTRONICS TECH

Full-bridge integration module based on PCB embedding process

The invention discloses a full-bridge integration module based on PCB embedding process. The full-bridge integration module comprises a full-bridge power circuit, high-frequency decoupling capacitors,a drive circuit, power devices and a radiator which are arranged on a PCB embedding module. The power devices are four gallium nitride devices or four silicon carbide devices which are connected in series and in parallel to form a full-bridge circuit, the full-bridge circuit is connected with the high-frequency decoupling capacitors and the drive circuit, and the full-bridge circuit, the high-frequency decoupling capacitors and the drive circuit are connected with the radiator to form an embedded full-bridge integration module. The full-bridge integration module greatly reduces the parasiticinductance, can promote the high-frequency operation of the wide bandgap device and is beneficial to the promotion of the power density of the system.
Owner:XI AN JIAOTONG UNIV

PoE power supply-based discrete motor driver

The invention relates to a PoE power supply-based discrete motor driver comprising a shell body, a driving circuit board, an IO connector and a state indicating lamp, wherein the driving circuit board, the IO connector and the state indicating lamp are mounted on the shell body; the diver also comprises a POE power supply system mounted on the shell body, the POE power supply system is connected with the driving circuit board, and transmission data and power supply are supplied to the driving circuit board at the same. Compared with technology of the prior art, the PoE power supply-based discrete motor driver is advantaged by simple structure, good universality, low implementation cost and the like.
Owner:SHANGHAI ANPU MINGZHI AUTOMATION EQUIP

Anti-interference device and method

An anti-interference device and method are provided. The anti-interference device comprises an anti-interference module and a control module. The control module is used for sending a working signal to the anti-interference module. The anti-interference module is used for receiving the working signal and controlling the working state of a first element according to the working signal. The first element is connected with the control module through at least one first connecting wire and the at least one first connecting wire is divided into at least two sections by an anti-interference material which is connected with the ground. The anti-interference module is also used for sending a backflow signal to the control module, and the backflow signal flows to the control module through the anti-interference material. An anti-interference method is also disclosed. According to the technical solution provided by the embodiments of the invention, the connecting wire between the control module and the anti-interference module is divided by the anti-interference material, so that the loop area of the backflow signal is reduced and the electromagnetic radiation interference generated in a circuit can be effectively reduced with low cost.
Owner:HUAWEI DEVICE CO LTD

Metal foil interconnection of electrical devices

An electrical assembly (300, 400) includes a power IC such as a MOSFET (112, 412) attached to a substrate module (114, 214). The MOSFET includes a top surface comprising first and second conductive device surfaces (A, B), associated with first and second device ports, and a bottom surface comprising a third conductive device surface C associated with a third device port. A first foil element is bonded to the first conductive device surface(s) A and to each of the first conductive substrate surfaces (A1, A2) and provides a continuous conductive pathway from each conductive surface (A) to each other conductive surface (A) and to each conductive surface (A1, A2). A second foil element is bonded to the second conductive device surface(s) B and to the second conductive substrate surface B1 and provides a continuous conductive pathway from each device conductive surface (B) to the substrate conductive surface (B1). A third foil element may be installed to electrically interconnect the discrete second device surfaces (B). The foil elements reduce interconnection parasitics and reduce charge and thermal energy density at device conductive surfaces as compared to wire bonded electrical interconnections. The foil elements may be comprised of formed metal elements that are flexible but sufficiently rigid to hold a formed shape or flexible foils supported on a flexible dielectric substrate.
Owner:RAYTHEON CO

Multi-channel voltage converter based on integral packaging

The invention provides a multi-channel voltage converter based on integral packaging. The multi-channel voltage converter comprises a plurality of mutually independent voltage conversion units packaged inside an integral shell; each voltage conversion unit comprises a voltage conversion unpacked chip, the input end of each voltage conversion unpacked chip is grounded through a corresponding firstcapacitor, the output end of each voltage conversion unpacked chip is grounded through a corresponding second capacitor and is connected to an output voltage adjusting end of the voltage conversion unpacked chip through a corresponding resistor, the output voltage adjusting end of each voltage conversion unpacked chip is externally connected to an adjustable resistor, the output voltage of each voltage conversion unpacked chip is adjusted by adjusting the resistance value of the corresponding adjustable resistor, and pins correspondingly connected with the input end, output end, output voltageadjusting end and enabled end of each voltage conversion unpacked chip are led out from one side of the integral shell. According to the multi-channel voltage converter, the multi-channel integrationof the power device is realized by using the integral packaging, so that the size of circuit packaging is reduced, the heat dissipation effect is preferable, and the operating temperature range is wide.
Owner:NO 24 RES INST OF CETC

Method and Device for Sealing

The present invention refers to a method for sealing a first packaging material laminate (10) to a second packaging laminate (12), at least the first laminate (10) comprising at least one layer of magnetizable particles and a sealable layer (34). The method is characterized in facing the sealable layer (34) towards the second laminate (12), providing an alternating magnetic field to the laminates in a sealing zone, thereby generating magnetic hysteresis losses in the laminate (10) comprising the magnetizable particles, which losses create heat substantially melting the sealable layer (34) in the sealing zone, and applying a sealing pressure to the first and second laminate (10, 12), which pressure causes the first and second laminate (10, 12) to be pressed together in the sealing zone, thereby sealing the laminates (10, 12) to each other. The invention also relates to a device for carrying out the method.
Owner:TETRA LAVAL HLDG & FINANCE SA

PCB layout system suitable for automotive LED lamp

PendingCN109413799AOptimizing EMC Electromagnetic Interference ProblemsExcellent EMC electromagnetic compatibility performanceElectrical apparatusElectroluminescent light sourcesElectromagnetic interferenceEngineering
The invention provides a PCB layout system suitable for an automotive LED lamp. The PCB layout system comprises an LED light source module and an LED driving module, wherein the LED light source module is arranged in the central area of the PCB; and the LED driving module is used for driving the LED light source module, and comprises a plurality of electronic components which are arranged in a first area and a second area which are separated by the central area. According to the system, the technical problem that an LED driving circuit and an LED light source of a traditional vehicle signal lamp are separately arranged on two different PCBs and a connecting line needs to be arranged between the two PCBs is solved, so that the wiring harness is saved, and the loop area from the LED light source to the LED driving circuit is reduced, thereby optimizing the EMC electromagnetic interference problem; and through precise and excellent PCB layout, the LED signal lamp module has excellent EMCelectromagnetic compatibility performance.
Owner:HASCO VISION TECHNOLOGY CO LTD

Variable frequency controller

The invention relates to a variable frequency controller, which comprises a PCB, wherein the PCB comprises a first side edge and a second side edge which are opposite to each other, a first semiconductor circuit, a second semiconductor circuit and a bridge rectifier are sequentially arranged on the PCB close to the first side edge, the first semiconductor circuit is arranged close to a first connecting edge connecting the first side edge and the second side edge, an EMI circuit is further arranged on the PCB, the input end of the EMI circuit is connected with the input end of an alternating current power supply, the output end of the EMI circuit is connected with the input end of the bridge rectifier, and the EMI circuit is arranged close to a second connecting edge opposite to the first connecting edge. By arranging one side of the bridge rectifier close to the second connecting edge, the length of the alternating current input side routing can be effectively reduced, so that the loop area of the alternating current input side routing is reduced, the interference of the loop area on peripheral circuits, especially low-voltage circuits such as an MCU control circuit is reduced, the PCB area occupied by the alternating current routing is also reduced, and then the cost is reduced while the working reliability is enhanced.
Owner:GUANGDONG HIIC SEMICON LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products