56results about How to "Reduce loop area" patented technology

Mechanisms for providing a subscriber-side interface with a passive optical network are described herein. An optical network termination (ONT) having an integrated broadband passive optical network processor is utilized to receive downstream data from an optical line termination (OLT) via a passive optical network and provide the contents of the downstream data to one or more subscriber devices via one or more data interfaces. Similarly, the ONT is adapted to receive and transmit upstream data from the one or more subscriber devices to the OLT via the passive optical network. The ONT preferably implements one or burst buffers for buffering upstream and/or downstream data. The ONT can be adapted to notify the OLT of the status of the burst buffer, thereby allowing the OLT to modify the bandwidth allocations.

One embodiment of the present invention provides an apparatus that reduces voltage noise for an integrated circuit (IC) device. This apparatus includes an interposer, which is configured to be sandwiched between the IC device and a circuit board. This interposer has a bottom surface, which is configured to receive electrical connections for power, ground and other signals from the circuit board, and a top surface, which is configured to provide electrical connections for power, ground and the other signals to the IC device. A plurality of bypass capacitors are integrated into the interposer and are coupled between the power and ground connections for the IC device, so that the plurality of bypass capacitors reduce voltage noise between the power and ground connections for the IC device.

Mechanisms for providing a subscriber-side interface with a passive optical network are described herein. An optical network termination (ONT) having an integrated broadband passive optical network processor is utilized to receive downstream data from an optical line termination (OLT) via a passive optical network and provide the contents of the downstream data to one or more subscriber devices via one or more data interfaces. Similarly, the ONT is adapted to receive and transmit upstream data from the one or more subscriber devices to the OLT via the passive optical network. The ONT preferably implements one or more encryption/decryption mechanisms, such as the digital encryption standard (DES), to provide data protection in addition to, or in place of, data churning provided for by the ITU G.983 recommendations.

The invention is applied to PCB making field, providing a PCB routing method and the PCB. As routing, it routes power and ground lines in parallel with signal lines. And it provides nearby power and ground return paths for signals, reducing signal circuit area and improving PCB EMC. Besides, it improves PCB EMC effect by placing filter capacitors in the signal layer transfer position on this basis according to actual requirements, or gridding power and ground network, or placing filter capacitors between power and ground network traces.

The invention discloses a giant magneto-impedance effect sensing probe based on a flexible circuit board. The sensing probe belongs to the technical field of magnetic field detection and is characterized in that the probe uses a double-layer flexible circuit board comprising two coincident straight wires with a longer length than an end effect critical length of a magnetic alloy wire or belt. The two wires are in short connection through vias at one end, and the other end of each wire leads out a twin conductor by means of a bonding pad to provide a sensing signal. One wire is disconnected for a certain gap in the middle, and the middle section of a magnetic alloy wire or a magnetic alloy belt is accessed on two bonding pads at the two sides of the gap by constant temperature welding spots. The magnetic alloy wire or belt is straightened along the wire direction and attached on the surface of the flexible circuit board by virtue of an inviscid insulating film, and is fixed by a viscous insulating film to constitute the integral sensing probe. The sensing probe has a sensitive giant magneto-impedance effect within 10MHz to 30MHz, and the machined probe has consistent measuring properties and is strong in anti-interference performance when in application.

The invention discloses a PCB and wiring method thereof. The method comprises the following steps: accompanying ground holes are additionally formed near layer changing through holes, and are wrapped in the middle of signal wires. According to the invention, as the accompanying ground holes are additionally formed, the signal wires and the accompanying ground holes form a signal loop circuit; the problem that reversed flow ground plane is missing is solved; a favorable reversed flow track is provided for signals; convenience is provided for nearby reversed flow after the signals change layer; loop circuit area is reduced; electromagnetic radiation caused by layer changing of the signals is reduced, so that the signal quality and stability of a system are improved.

Disclosed is an embedded type wiring terminal sealing cover for large aluminium electrolytic capacitors, wherein an insulating material which is identical with a terminal cover and integrated with an insulating terminal block is used for coating a naked positive wiring terminal post and a naked negative wiring terminal post respectively or integrally, or the wiring terminal posts are embedded into the insulating material body of the cover, so that the distance between the positive wiring terminal post and the negative wiring terminal post in the insulating material is reduced, the area of a loop is reduced, the equivalent series inductance (ESL) value is reduced, and at the same time, the risk that the positive pole and the negative pole are short-circuited caused by an electrolyte splashed during release of a pressure valve is eliminated.

The invention discloses a self-excitation driving and power conversion circuit based on a GaN HEMT device. The self-excitation driving and power conversion circuit adopts the novel GaN-based HEMT device, and improves the working frequency of the circuit to MHz. The device adopts a silicon substrate, and adopts on-chip design of a Q1 transistor and a Q2 transistor, wherein the two transistors share one wafer, so that the size is reduced, the cost is reduced, and the reliability control is improved. The device further adopts an integrated anti-parallel diode structure, so that the reverse conduction characteristic of the device is improved. According to the self-excitation driving and power conversion circuit, through using a third auxiliary winding Na in a main transformer of a power circuit, a self-excitation driving cavity in a positive feedback mode is adopted to automatically provide a driving signal for Q1, a control chip is not needed, and the driving of the Q1 needs to be ensured to be reliable through a special driving buffer circuit for the GaN HEMT device. The self-excitation driving and power conversion circuit further adopts an integrated high-frequency current cycle-by-cycle detection scheme, and shares one coil with the self-excitation driving cavity, so that a current detection resistor is omitted, and lossless current detection is realized.

The invention provides a circuit capable of lowering loop noise of an active earphone. The circuit comprises an integrated circuit module and a power module which are arranged on a PCB, a capacitor is further connected between the integrated circuit module and the power module, and the capacitor is arranged on one side of the integrated circuit module. The circuit further comprises a grounding wire which is arranged parallel to a power line, and the horizontal gap between the power line and the grounding wire is smaller than or equal to one half the sum of the width of the power line and the width of the grounding wire. One pole of the capacitor is electrically connected with a power pin of the integrated circuit module through the power line, the other pole of the capacitor is electrically connected with a ground pin of the integrated circuit module through the grounding wire, and the arrangement direction of the capacitor is consistent with the current direction of the power line. The invention further provides a method capable of lowering the loop noise of the active earphone. The capacitor is arranged in the direction of currents passing the power line, the distance between the power line and the grounding wire is shortened, and thus the current loop area is decreased to the maximal degree. According to the circuit and method, the cost is low, the efficiency is high and the applicability is wide.

The invention discloses a diode bridge low-inductance module for a circuit breaker. The diode bridge low-inductance module comprises an IEGT press-fitting structure, a diode press-fitting structure, adamping capacitor, a damping resistor and a connecting busbar set; a C-pole conducting plate is shared by C poles of two IEGTs welded in a pressed mode in the IEGT press-fitting structure, and an E-pole arched connecting bar is shared by E poles; a negative electrode conducting plate is shared by diodes welded in a pressed mode in the diode press-fitting structure share, so that electrical connecting lines in most units are removed, the number of the electrical connecting lines is reduced, the loop area is reduced, the structure of the diode bridge low-inductance module is more compact, the space occupation is small, and the cost is reduced; and the branch inductance and the loop inductance of the diode bridge low-inductance module used for a transfer branch of the circuit breaker are greatly reduced.

An electrical assembly (300, 400) includes a power IC such as a MOSFET (112, 412) attached to a substrate module (114, 214). The MOSFET includes a top surface comprising first and second conductive device surfaces (A, B), associated with first and second device ports, and a bottom surface comprising a third conductive device surface C associated with a third device port. A first foil element is bonded to the first conductive device surface(s) A and to each of the first conductive substrate surfaces (A1, A2) and provides a continuous conductive pathway from each conductive surface (A) to each other conductive surface (A) and to each conductive surface (A1, A2). A second foil element is bonded to the second conductive device surface(s) B and to the second conductive substrate surface B1 and provides a continuous conductive pathway from each device conductive surface (B) to the substrate conductive surface (B1). A third foil element may be installed to electrically interconnect the discrete second device surfaces (B). The foil elements reduce interconnection parasitics and reduce charge and thermal energy density at device conductive surfaces as compared to wire bonded electrical interconnections. The foil elements may be comprised of formed metal elements that are flexible but sufficiently rigid to hold a formed shape or flexible foils supported on a flexible dielectric substrate.

The invention provides an interface terminal of a thin film capacitor, which includes a shell, and a bus bar is arranged in the shell, and a DC bus bar interface terminal and an IGBT interface terminal are drawn out from the bus bar. The interface terminals are all composed of a vertical connection plate connected to the busbar and a horizontal connection plate for connecting IGBTs. The positive and negative interface terminals are separated by an insulating plate. Since the area of ​​the current loop is proportional to the inductance, changing the IGBT interface terminal from the horizontal setting to the vertical setting can reduce the loop area, thereby reducing the loop inductance accordingly. The interface terminal provided by the invention overcomes the shortcomings of the prior art, effectively reduces the equivalent inductance value of the film capacitor, and meanwhile has simple structure, convenient processing and manufacturing, and low cost.

The invention discloses a full-bridge integration module based on PCB embedding process. The full-bridge integration module comprises a full-bridge power circuit, high-frequency decoupling capacitors,a drive circuit, power devices and a radiator which are arranged on a PCB embedding module. The power devices are four gallium nitride devices or four silicon carbide devices which are connected in series and in parallel to form a full-bridge circuit, the full-bridge circuit is connected with the high-frequency decoupling capacitors and the drive circuit, and the full-bridge circuit, the high-frequency decoupling capacitors and the drive circuit are connected with the radiator to form an embedded full-bridge integration module. The full-bridge integration module greatly reduces the parasiticinductance, can promote the high-frequency operation of the wide bandgap device and is beneficial to the promotion of the power density of the system.

The invention relates to a PoE power supply-based discrete motor driver comprising a shell body, a driving circuit board, an IO connector and a state indicating lamp, wherein the driving circuit board, the IO connector and the state indicating lamp are mounted on the shell body; the diver also comprises a POE power supply system mounted on the shell body, the POE power supply system is connected with the driving circuit board, and transmission data and power supply are supplied to the driving circuit board at the same. Compared with technology of the prior art, the PoE power supply-based discrete motor driver is advantaged by simple structure, good universality, low implementation cost and the like.

An anti-interference device and method are provided. The anti-interference device comprises an anti-interference module and a control module. The control module is used for sending a working signal to the anti-interference module. The anti-interference module is used for receiving the working signal and controlling the working state of a first element according to the working signal. The first element is connected with the control module through at least one first connecting wire and the at least one first connecting wire is divided into at least two sections by an anti-interference material which is connected with the ground. The anti-interference module is also used for sending a backflow signal to the control module, and the backflow signal flows to the control module through the anti-interference material. An anti-interference method is also disclosed. According to the technical solution provided by the embodiments of the invention, the connecting wire between the control module and the anti-interference module is divided by the anti-interference material, so that the loop area of the backflow signal is reduced and the electromagnetic radiation interference generated in a circuit can be effectively reduced with low cost.

The invention provides a multi-channel voltage converter based on integral packaging. The multi-channel voltage converter comprises a plurality of mutually independent voltage conversion units packaged inside an integral shell; each voltage conversion unit comprises a voltage conversion unpacked chip, the input end of each voltage conversion unpacked chip is grounded through a corresponding firstcapacitor, the output end of each voltage conversion unpacked chip is grounded through a corresponding second capacitor and is connected to an output voltage adjusting end of the voltage conversion unpacked chip through a corresponding resistor, the output voltage adjusting end of each voltage conversion unpacked chip is externally connected to an adjustable resistor, the output voltage of each voltage conversion unpacked chip is adjusted by adjusting the resistance value of the corresponding adjustable resistor, and pins correspondingly connected with the input end, output end, output voltageadjusting end and enabled end of each voltage conversion unpacked chip are led out from one side of the integral shell. According to the multi-channel voltage converter, the multi-channel integrationof the power device is realized by using the integral packaging, so that the size of circuit packaging is reduced, the heat dissipation effect is preferable, and the operating temperature range is wide.

The present invention refers to a method for sealing a first packaging material laminate (10) to a second packaging laminate (12), at least the first laminate (10) comprising at least one layer of magnetizable particles and a sealable layer (34). The method is characterized in facing the sealable layer (34) towards the second laminate (12), providing an alternating magnetic field to the laminates in a sealing zone, thereby generating magnetic hysteresis losses in the laminate (10) comprising the magnetizable particles, which losses create heat substantially melting the sealable layer (34) in the sealing zone, and applying a sealing pressure to the first and second laminate (10, 12), which pressure causes the first and second laminate (10, 12) to be pressed together in the sealing zone, thereby sealing the laminates (10, 12) to each other. The invention also relates to a device for carrying out the method.

The invention provides a PCB layout system suitable for an automotive LED lamp. The PCB layout system comprises an LED light source module and an LED driving module, wherein the LED light source module is arranged in the central area of the PCB; and the LED driving module is used for driving the LED light source module, and comprises a plurality of electronic components which are arranged in a first area and a second area which are separated by the central area. According to the system, the technical problem that an LED driving circuit and an LED light source of a traditional vehicle signal lamp are separately arranged on two different PCBs and a connecting line needs to be arranged between the two PCBs is solved, so that the wiring harness is saved, and the loop area from the LED light source to the LED driving circuit is reduced, thereby optimizing the EMC electromagnetic interference problem; and through precise and excellent PCB layout, the LED signal lamp module has excellent EMCelectromagnetic compatibility performance.