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Epoxy organosilicone ultraviolet curing coating modified by (methyl) acrylic acid and preparation method thereof

A technology for curing coatings and epoxy curing agents, applied in the field of coatings, can solve the problems of low weather resistance, less photosensitive groups, low water resistance, etc., and achieve good hardness and adhesion, increased crosslinking density, and compatibility. good effect

Active Publication Date: 2009-10-14
CHANGXING PHOTOELECTRIC MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the shortcomings of these existing technologies are: the raw materials of silicone resin are difficult to obtain, and the preparation process is relatively complicated; the silicone component contains less photosensitive groups, which easily leads to insufficient compactness of the coating, resulting in low weather resistance and low water resistance. properties; the participation of a single unsaturated carbon-carbon double bond in the curing will result in incomplete curing of the paint coating and low physical and chemical properties; silicones use monomers or low molecular weight components as coating components to make the coating film less flexible

Method used

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  • Epoxy organosilicone ultraviolet curing coating modified by (methyl) acrylic acid and preparation method thereof
  • Epoxy organosilicone ultraviolet curing coating modified by (methyl) acrylic acid and preparation method thereof
  • Epoxy organosilicone ultraviolet curing coating modified by (methyl) acrylic acid and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0039] (1) Synthesis of methacrylic acid modified epoxidized silicone: take 100 parts of epoxidized silicone with an epoxy value of 0.51mol / 100g and put it into a reactor equipped with a stirrer, dropping funnel and thermometer, heat and stir until At 75°C, slowly add dropwise a mixture of 30 parts of methacrylic acid, 0.78 parts of trimethylbenzyl ammonium chloride and 0.22 parts of hydroquinone, and react for 1 hour to obtain methacrylic acid-modified epoxidized silicone;

[0040] (2) Take 100 parts of bisphenol A epoxy resin (epoxy value 0.20) and put it into a reactor equipped with a stirrer, dropping funnel and thermometer, heat and stir to 85°C, slowly add 17 parts of methacrylic acid, three A mixture of 1.3 parts of methyl benzyl ammonium bromide and 0.02 parts of p-hydroxyanisole was heated up to 105 ° C for 5 hours to obtain bisphenol A epoxy methacrylate resin;

[0041] (3) Add 100 parts of methacrylic acid modified epoxy silicone into the container;

[0042] (4) Ad...

Embodiment 2

[0049] (1) Synthesis of acrylic acid modified epoxidized silicone: take 88 parts of epoxidized silicone with an epoxy value of 0.30mol / 100g and put it into a reactor equipped with a stirrer, dropping funnel and thermometer, heat and stir to 80 ℃, slowly drop a mixture of 15 parts of acrylic acid, 0.8 parts of tetrabutylammonium bromide and 0.2 parts of p-methoxyphenol, and react for 1.2 hours to obtain acrylic acid-modified epoxidized silicone;

[0050](2) Take 100 parts of bisphenol A epoxy resin (epoxy value 0.42) and put it into a reactor equipped with a mixer, dropping funnel and thermometer, heat and stir to 90°C, slowly add 30 parts of acrylic acid, triethyl A mixture of 1.5 parts of benzyl ammonium chloride and 0.05 parts of 2,5-dimethylhydroquinone was heated to 110° C. for 4 hours to obtain bisphenol A epoxy acrylate resin;

[0051] (3) Add 100 parts of acrylic acid modified epoxidized silicone into the container;

[0052] (4) Add 50 parts of bisphenol A type epoxy a...

Embodiment 3

[0059] (1) Synthesis of methacrylic acid-modified epoxidized silicone: Take 100 parts of epoxidized silicone with an epoxy value of 0.12mol / 100g and put it into a reactor equipped with a stirrer, dropping funnel and thermometer, heat and stir To 80°C, slowly add dropwise a mixture of 8 parts of methacrylic acid, 0.8 parts of trimethylbenzyl ammonium bromide and 0.2 parts of p-methoxyphenol, and react for 1.2 hours to obtain methacrylic acid modified epoxidized silicone ;

[0060] (2) Take 100 parts of bisphenol A epoxy resin (epoxy value 0.31) and put it into a reactor equipped with a mixer, a dropping funnel and a thermometer, heat and stir to 80°C, slowly add 22 parts of acrylic acid, tetrabutyl A mixture of 1.1 parts of ammonium bromide and 0.02 parts of p-hydroxyanisole was heated up to 100 ° C for 4.5 hours to obtain bisphenol A epoxy acrylate resin;

[0061] (3) Add 100 parts of methacrylic acid modified epoxy silicone into the container;

[0062] (4) Add 70 parts of b...

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Abstract

The invention discloses epoxy organosilicone ultraviolet curing coating modified by (methyl) acrylic acid and a preparation method thereof. The coating comprises epoxy organosilicone modified by (methyl) acrylic acid, an epoxy (methyl) acrylate resin, active diluent, a photoinitiator, an epoxy hardener and an auxiliary agent. The coating not only has the advantages of the epoxy organosilicone modified by (methyl) acrylic acid, has high toughness, weather resistance and water resistance, but also needs no organic solvents in the process of preparing the coating and enjoys simple required curingconditions.

Description

technical field [0001] The invention relates to the field of coatings, in particular to a (meth)acrylic acid-modified epoxidized silicone UV-curable coating and a preparation method thereof. Background technique [0002] Silicone has the advantages of low temperature flexibility, low surface energy, weather resistance, heat resistance, water resistance, anti-oxidation, non-toxic, odorless and non-volatile, and can be used for sealing, bonding, lubrication, surface activity, mold release, defoaming, waterproofing And inert filling, etc., widely used in aerospace, electrical and electronic, construction, medical, chemical, light industry and other industries. As a new generation of green chemical products, UV-curable coatings have many advantages that traditional coatings cannot match, such as fast curing speed, energy saving, high coating gloss, and are suitable for heat-sensitive substrates. Therefore, the application of organosilicon in UV-curable coatings has attracted mu...

Claims

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Application Information

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IPC IPC(8): C09D183/07C09D163/10
Inventor 刘伟区唐春怡
Owner CHANGXING PHOTOELECTRIC MATERIAL
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