Rapid subtractive manufacturing process of circuit boards

A production process and circuit board technology, applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of large process loss, complicated process, environmental pollution, etc., to reduce the discharge of industrial wastewater, improve economic benefits, reduce The effect of production costs

Inactive Publication Date: 2009-12-09
陈立峰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The fast circuit board manufacturing process in Germany uses the engraving knife and laser method. This process has a large loss and high cost. It is only suitable for promotion in a limited range such as laboratories, and is not suitable for promotion to industrial equipment. Because of the traditional circuit board production , 28 processes such as multiple exposure, development and pattern electroplating are required, so the process is complicated, and it takes 16 to 24 hours to make a circuit board, low efficiency, high cost, and serious environmental pollution

Method used

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Examples

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Effect test

Embodiment Construction

[0010] In order to further understand the characteristics and effects of the present invention, the following examples are given in detail as follows.

[0011] The present invention uses a subtractive method to protect the circuit pattern that needs to be retained on the entire copper skin through a special coating (such as photosensitive film or ink), and then chemically etches the unprotected copper skin Etching away, and finally cleaning off the protective coating, the required circuit pattern is obtained; the present invention adopts 1200 dots / inch inkjet printing technology to replace the original method of transferring the circuit pattern in the process of film, by using ordinary ink or resist Chemically corroded ink and industrial inkjet nozzles are used to transfer the graphics to the circuit board, and the inkjet process replaces the original process of silk screen solder mask oil and text oil. The process is as follows:

[0012] ①. Circuit board surface pretreatment,...

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PUM

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Abstract

The invention relates to a rapid subtractive manufacturing process of circuit boards. In the process, ink-jet printing technology is adopted and graphs are transferred to the circuit boards by a spray head by means of ink; the working procedure is as follows: punching-deburring, cleaning and passivating-copper plating-cleaning-front and back coating-front and back graphic printing-graphic curing-etching-cleaning and passivating-quality inspecting-solder mask ink front and back printing and UV curing-UV curing-text ink front and back printing and UV curing-UV curing-tin spraying and surface processing-molding-electrical testing-quality inspecting-packaging-factory leaving; the manufacturing process takes about 5h. The process has the advantages of simpleness, convenience, one-step forming, sharp graphic margin, high circuit graph precision, simple materials, manufacturing cost reduction, manufacturing cycle shrinkage and economic benefit increase; wherein, the line width of the circuit graph is increased to be less than 1 / 1000 from 3 / 1000 and the graphs are mainly transferred by means of ink. The electroplating link is omitted, thereby dramatically the energy consumption and industrial wastewater discharge, and ensuring good energy saving and environmental protection effects and low cost.

Description

technical field [0001] The invention relates to a circuit board production process, in particular to a subtractive circuit board rapid production process with simple process, time saving, high efficiency and low cost. Background technique [0002] As we all know, the demand for circuit boards at home and abroad is increasing year by year. However, most of the current circuit board production processes still adopt the traditional method of exposing with film, and then plating anti-corrosion metals and then corroding. The traditional film exposure process requires photolithography. A master chip, through light irradiation on the circuit board covered with photosensitive film, then the light passes through the transparent part of the master chip without graphics to expose the photosensitive film on the circuit board, after developing and cleaning, the graphics that do not need to be retained cover the developed film, The copper of the required circuit part will be exposed. Aft...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02
Inventor 潘昶陈菁陈立峰
Owner 陈立峰
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