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Method for preparing quartz crystal devices by laser soldering seal

A quartz crystal and laser technology, applied in the field of electricity, can solve the problems of poor quality of welded metal cover, difficulty in welding of small-sized ceramic package base, low efficiency, etc., and achieve the effect of fast welding speed, small deformation and large depth

Inactive Publication Date: 2010-02-17
珠海粤科京华电子陶瓷有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the defects of the prior art that it is difficult to weld the small-sized ceramic package base, and the quality of the welded metal cover is poor and the efficiency is low.

Method used

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  • Method for preparing quartz crystal devices by laser soldering seal
  • Method for preparing quartz crystal devices by laser soldering seal
  • Method for preparing quartz crystal devices by laser soldering seal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] combine figure 1 and figure 2 As shown, the tungsten metal layer is printed with nickel or gold plating around the opening of the upper end of the ceramic package base 8, and then the silver copper solder 7 is placed and the punched Kovar ring 6 is welded in a reducing atmosphere at 850±20°C, and then the Kovar ring 6 is welded on the Kovar alloy Cover the metal cover 5 above the ring 6; Figure 5 As shown, the semi-finished product 3 after the above steps is placed in an airtight transparent space 4 filled with inert gas such as nitrogen or argon, and the laser source 20 is a CO2 laser or a YAG laser. 5 and Kovar alloy ring 6 are laser welded, so that the quartz crystal is packaged in a four-layer structure composed of ceramic package base 8, silver-copper solder 7, Kovar alloy ring 6 and metal cover 5, forming a quartz crystal device 9 (such as figure 2 shown).

Embodiment 2

[0020] combine image 3 and Figure 4 As shown, a quartz crystal is placed in the ceramic package base 8, specifically, the quartz crystal is mounted on the internal terminal (not shown) of the ceramic package base 8 that is conducted with the external terminal; surrounding the upper end of the ceramic package base 8 The opening is printed to form a Kovar ring 10, and sintered in a reducing atmosphere such as hydrogen at 850±20°C to obtain a ceramic package base with a Kovar ring 10, and then a metal cover 5 is placed on the top of the Kovar ring 10; Figure 5 As shown, the semi-finished product 3 after the above steps is placed in an airtight transparent space 4 filled with inert gases such as nitrogen or argon, and the laser source 20 is CO 2 Laser or YAG laser, after the laser beam 1 is focused by the prism 2, the metal cover 5 and the Kovar alloy ring 10 are laser welded, so that the quartz crystal is packaged on the ceramic packaging base 8, the Kovar alloy ring 10 and t...

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Abstract

The invention relates to a method for preparing quartz crystal devices by laser soldering seal, including that: (1) a ceramic packaged foundation support internally provided with quartz element is prepared; (2) an opening is opened around the upper end of the ceramic packaged foundation support to form a kovar alloy ring; and (3) a metal cover and the kovar alloy ring are welded so as to package the ceramic packaged foundation support; the method is characterized in that in the step (3), a laser beam is utilized to weld the metal cover and the kovar alloy ring in a sealing way. Compared with prior art, the invention has the following advantages: non-contact distant laser welding technology is adopted, production efficiency is greatly improved, heat affected zone is small, welding point ispollution free, welding quality is greatly improved, and deformation and dislocation problem of the traditional metal cover is avoided. The encapsulation method of the invention has high production efficiency, fast welding speed, large depth and small deformation and is especially applicable to small size micro welding and mass production.

Description

technical field [0001] The invention relates to basic components and devices in the electrical field, in particular to a preparation method for quartz crystal devices that can be used as resonators, oscillators, surface acoustic wave devices and the like. Background technique [0002] With the development of electronic products towards portability, miniaturization, networking and multimedia, the demand for quartz crystal devices has experienced double-digit growth, and the size of quartz crystals and their ceramic packaging bases has also become smaller and smaller. [0003] The production process of the traditional quartz crystal device mainly includes: setting the quartz crystal inside the ceramic packaging base, forming a Kovar alloy ring on the ceramic packaging base (Kvar alloy is also called Kovar alloy, which is mainly suitable for electrical components and hard glass , soft glass, ceramic matching sealing glass seal alloy), and then covered with a metal cover, throug...

Claims

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Application Information

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IPC IPC(8): H03H3/02H03H3/08
Inventor 黎柏其吴崇隽雷云燕苏方宁
Owner 珠海粤科京华电子陶瓷有限公司
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