Bismuthic acid barium series negative temperature coefficient semiconductor ceramic and preparation method thereof
A negative temperature coefficient, semiconductor technology, applied to resistors with negative temperature coefficients and other directions, can solve problems such as no reports, and achieve the effects of good electrical conductivity, overcoming large room temperature resistivity, and simple preparation process
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Embodiment 1
[0018] By Bi 2 o 3 、BaCO 3 , La 2 o 3 and Sb 2 o 3 Synthesized as raw material (Ba 0.999 La 0.001 )(Sb 0.01 Bi 0.99 )O 3 .
[0019] Preparation:
[0020] 1) According to the chemical formula (Ba 0.999 La 0.001 )(Sb 0.01 Bi 0.99 )O 3 Carry out batching, be the standard of 1:1:2 to add agate ball and deionized water with the mass ratio of ball, material, water, ball mill 8 hours, dry;
[0021] 2) drying the obtained material and roasting at 900°C, and keeping it warm for 4 hours;
[0022] 3) Add a polyvinyl alcohol solution with a concentration of 2 wt% to the roasted material, dry the mixture and then granulate it, then pass through a 60-mesh sieve;
[0023] 4) Dry pressing at 200MPa, the diameter of the sample is 18mm, and the thickness is 2mm;
[0024] 5) The obtained sample was sintered at 970°C, kept for 2 hours, under an air atmosphere, and cooled with the furnace;
[0025] 6) Screen-print the low-temperature silver electrode paste on both sides of the ...
Embodiment 2
[0027] By Bi 2 o 3 、BaCO 3 , La 2 o 3 and Sb 2 o 3 Synthesized as raw material (Ba 0.998 La 0.002 )(Sb 0.05 Bi 0.95 )O 3 .
[0028] Preparation:
[0029] According to the chemical formula (Ba 0.998 La 0.002 )(Sb 0.05 Bi 0.95 )O 3 Batching, sintering temperature is 1020 ℃, other preparation process steps are the same as embodiment 1.
Embodiment 3
[0031] By Bi 2 o 3 、BaCO 3 , La 2 o 3 and Sb 2 o 3 Synthesized as raw material (Ba 0.995 La 0.005 )(Sb 0.08 Bi 0.92 )O 3 .
[0032] Preparation:
[0033] According to the chemical formula (Ba 0.995 La 0.005 )(Sb 0.08 Bi 0.92 )O 3 Batching, sintering temperature is 1040 ℃, other preparation process steps are the same as embodiment 1.
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