Magnesium alloy direct chemical plating NI-P-SiC plating solution formula and plating process
A ni-p-sic and electroless plating technology, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problem of poor corrosion resistance and wear resistance of magnesium alloy electroless nickel plating layer, high cost, Solving problems such as difficulty in preparation of electroless nickel plating solution for magnesium alloys, to achieve the effect of good combination, stable plating solution and simplified plating solution preparation process
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Embodiment 1
[0034] A plating process and method for electroless Ni-P-SiC plating on a magnesium alloy, comprising the steps of:
[0035] 1. Prepare the electroless Ni-P plating solution, and weigh the medicine according to the above formula 1: first dissolve the above medicine with a small amount of distilled water, then dilute the mixed water to 1L, and adjust the pH value to 4.8 with concentrated ammonia water.
[0036] 2. Pretreatment of SiC particles: Before composite plating, SiC powder is dipped in 1:1 hydrochloric acid solution for 24 hours to remove impurities, then finely neutralized with distilled water, dehydrated with ethanol, and dried for later use.
[0037] 3. Prepare SiC dispersion liquid and composite plating liquid: weigh the medicine according to the above formula and mix them as the dispersion liquid. Mix 2 g of the treated SiC particles with a small amount of distilled water and the above-mentioned surfactant, first ultrasonically disperse for 30 minutes, then add a s...
Embodiment 2
[0042] A kind of electroless Ni-P-SiC plating process and method for magnesium alloy, concrete steps are as follows:
[0043] 1. Prepare the electroless Ni-P plating solution, and weigh the medicine according to the above formula 2: first dissolve the above medicine with a small amount of distilled water, then mix and dilute to 1L, and adjust the pH value to 5.2 with concentrated ammonia water.
[0044] 2. Pretreatment of SiC particles: Before composite plating, SiC powder is dipped in 1:1 hydrochloric acid solution for 24 hours to remove impurities, then finely neutralized with distilled water, dehydrated with ethanol, and dried for later use.
[0045] 3. Preparation of SiC dispersion liquid and composite plating liquid: Weigh 40 mg of sodium dodecylbenzene sulfonate and 20 mg of polyethylene glycol as dispersion liquid, mix 6 g of treated SiC particles with a small amount of distilled water and surfactant, and ultrasonically Disperse for 30 minutes, then add a small amount o...
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