Non-metallic component with metalized surface and manufacturing method thereof
A technology for non-metal parts and surface metal, which is applied to the non-metal parts with surface metallization and its manufacturing field, can solve the problems of cumbersome process, polluted environment, complicated formulation of roughening agent, etc., and achieves the effect of simple process and less reagent pollution
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Embodiment 1
[0034] Dissolve 0.94g of copper nitrate in 100mL of water to prepare a 0.05mol / L copper nitrate solution, adjust its pH to 11 with concentrated ammonia water, take out 10mL, add isopropanol and polyvinyl alcohol to dilute the 0.05mol / L copper nitrate solution to The concentration of water / isopropanol / polyvinyl alcohol mixed solution is 0.01mol / L solution, wherein the dosage of polyvinyl alcohol is 0.2g. Nitrogen was blown into the solution for 5 minutes to remove oxygen. Add 12g of polyacrylic acid resin to the solution that has been deoxygenated, print a pre-designed circuit on the insulating substrate of the flexible circuit board with screen printing, and then move it to 60Gy / min gamma rays (Shenzhen Changyuan Company's γ-ray irradiator) for 3 min.
[0035] Electroless copper plating is then performed. Plating solution composition: 200ml water, 2.0g copper sulfate pentahydrate, 2ml formaldehyde, 6gEDTA 2Na, 4g potassium sodium tartrate, adjust the pH value to 12.5 with Na...
Embodiment 2
[0037] According to the method of Example 1, the difference is that the copper circuit is plated on the insulating substrate of the rigid printed wiring board.
Embodiment 3
[0039] According to the method of Example 1, the difference is that the solution after adding the polyacrylic acid resin is spin-coated on the ceramic surface by the spin-coating film-forming method. Subsequent steps of γ-ray radiation and electroless plating are the same. The process parameters of spin coating film formation: 800 rpm, 5s.
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