Nano-ceramic compound bonding agent

Abstract

The invention relates to a ceramic compound bonding agent, in particular to a nano-ceramic compound bonding agent, which is suitable for manufacturing super-hard grinding tools with various granularity and belongs to the technical field of materials. The bonding agent is prepared by adding second phases, such as nano-grade granules, nano-grade lamellas, nano-grade whiskers, nano-grade fibers and the like to a ceramic bonding agent matrix to form a nano-compound material, wherein at least one phase of the nano-compound material is of nano-size. Because the of small granularity and large specific surface area, the nano-ceramic material presents evident small size effect, quantum size effect and surface interface effect, which ensures that the nano-ceramics have special properties different from traditional ceramics, such as high intensity, good tenacity, low sintering temperature and the like. Thus, when the nano-powder is adopted to carry out sintering, the densifying speed is high, the sintering temperature is lower and is 400-600 DEG C lower than that of the traditional ceramics manufacturing, and the sintering process is greatly shortened.

Description

technical field [0001] The invention relates to a ceramic bond, in particular to a nano-ceramic composite bond, which is suitable for the manufacture of superhard abrasive tools with various grain sizes, and belongs to the field of material technology. Background technique [0002] The metal bond has better grip on abrasive grains, high strength and good toughness, but its self-sharpening is poor, porosity is low, and maintenance is difficult, especially when processing metal materials, it is prone to workpiece adhesion, burns and tool clogging . The resin bond has good self-sharpening performance, is not easy to block, has high grinding efficiency and low grinding temperature, but its heat resistance is poor. The large amount of heat generated during the grinding process will easily cause the resin to soften or decompose, resulting in its bonding. Vitrified bond is a kind of bond that is widely used at present, and its performance is between metal bond and resin bond. The ...

AI Technical Summary

Problems solved by technology

[0002] The metal bond has better grip on abrasive grains, high strength and good toughness, but its self-sharpening is poor, porosity is low, and maintenance is difficult, especially when processing metal materials, it is prone to workpiece adhesion, burns and tool clogging

The resin bond has good self-sharpening performance, is not easy to block, has high grinding efficiency and low grinding temperature, but its heat resistance is poor. The large amount of heat generated during the grinding process will easily cause the resin to soften or decompose, resulting in its bonding. Vitrified bond is a kind of bond that is widely used at present, and its performance is between metal bond and resin bond. The common superhard abrasive tools of vitrified bond mainly include grinding wheel, oil stone, grinding bar and grinding disc and grinding head etc.

However, due to the poor thermal stability of diamond, chemical reactions such as oxidation or graphitization are prone to occur when the temperature is higher than 800 °C.