Glass fiber with low dielectric constant for high frequency high-density circuit board

Abstract

The invention relates to a glass fiber with a low dielectric constant for a high frequency high-density circuit board, which is characterized in that: the glass fiber comprises the following components in percentage by weight: 50 to 60 percent of SiO2, 12 to 18 percent of Al2O3, 0 to 1.8 percent of CaO, 0.5 to 3.2 percent of MgO, 0.5 to 3.2 percent of ZnO, 21 to 27 percent of B2O3, 0 to 0.25 percent of Li2O, 0 to 0.25 percent of Na2O, 0.4 to 4 percent of TiO2, 0.5 to 3 percent of CaF2, and 0.2 to 0.6 percent of CeO2. The glass fiber disclosed by the invention has the advantages of excellent water resistance, excellent adhesion with the resin and easy follow-up processing. At room temperature, when the frequency is 1MHz, the dielectric constant is between 4.2 and 4.6 and the dielectric loss factor is between 10*10<-4> and 12*10<-4>. The glass fiber is particularly suitable to be used as a reinforcing material of the high frequency high-density multilayer interconnection printed circuit board.

Description

Technical field [0001] The invention belongs to glass fiber and relates to a low dielectric constant glass fiber used for high-frequency and high-density circuit boards. Mainly used for high-frequency and high-density circuit boards, especially suitable as reinforcement material for high-frequency and high-density multi-layer interconnection printed circuit boards. Background technique [0002] With the development of the electronics industry, equipment miniaturization, circuit multi-layering, high density, and miniaturization have also developed rapidly. The frequency of electromagnetic waves used for line transmission can reach GHz or MHz. And the signal propagation speed V=C / ε 1 / 2 (where C is the speed of light, ε is the relative dielectric constant) It can be seen from the formula that the smaller ε is, the faster the signal propagates; the signal propagation loss from the circuit α ​​= Ktg α × f (where K is a constant and f is the propagation frequency) It can be seen...

AI Technical Summary

Problems solved by technology

A kind of glass disclosed in Japan 8-33317, its composition is: SiO 2 50-60%, Al 2 o 3 10-20%, B 2 o 3 20-30%, CaO 0-5%, MgO 0-4%, Li 2 O+Na 2 O+K 2 O 0-0.5%, TiO 2 0.5-5%; the dielectric constant of this glass fiber is below 4.5, and it has good workability in the spinning stage, but due to B 2 o 3 High content, easy to stick to the nozzle of the watering can, resulting in wire breakage

WO 02 / 094728 discloses a low dielectric glass composition, which consists of: SiO 2 50-60%, Al 2 o 3 10-19%, B 2 o 3 16-25%, P 2 o 5 0.5-4%, RO 4-15%, R 2 O0-2%, F0-2%, where R 2 O is for Li 2 O+Na 2 O+K 2 O, RO is CaO+MgO; Also US patent application publication 20030054936 also discloses a glass fiber with a low dielectric constant, which consists of: SiO 2 50-60%, Al 2 o 3 10-18%, B 2 o 3 14-20%, CaO 1-6%, MgO 2-5%, TiO 2 0.5-5%, Li 2 O+Na 2 O+K 2 O 0-0.6%, F 0-2%; the dielectric constant of these two fibers can be reduced to about 5, but crystallization may occur after spinning, and the moisture resistance is not ideal

[0004] Chinese Patent Application Publication No. CN 1752040A discloses "glass with low dielectric constant" provided by Taiwan Glass Industry Co., Ltd., which consists of: Al 2 o 3 10-12%, B 2 o 3 15-22%, CaO5-10%, MgO2-5%, Fe 2 o 3 0.05-0.15%, Na 2 O 0-0.2%, K 2 O 0-0.2%, the balance is SiO 2 , the fiber made of this glass has a dielectric constant of 4.5-5.0, a low liquefaction temperature and good moisture resistance, but its dielectric properties are still not ideal

In addition, Taishan Glass Fiber Co., Ltd. (Chinese Patent Application Publication No. CN101012105A) provides a low dielectric constant glass fiber, which consists of: SiO 2 50-60%, Al 2 o 3 6-9.5%, B 2 o 3 30.5-35%, CaO 0-5%, MgO 0-5%, ZnO 0-5% TiO 2 0.5-5%, in which ZnO acts as a substitute for part of CaO and MgO to reduce the dielectric constant. The dielectric constant of this glass fiber is 3.9-4.4 at 1MZ, and the dielectric loss factor is 0.0004-0.00085, but the water resistance of the glass fiber and Adhesion to resin is not ideal

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