Glass fiber with low dielectric constant for high frequency high-density circuit board

A low-dielectric constant, glass fiber technology, used in the reinforcement material of high-frequency high-density multi-layer interconnection printed circuit boards, in the field of low-dielectric constant glass fiber, can solve the problem that the adhesion of glass fiber water-resistant resin is not ideal , The dielectric properties are not ideal, the moisture resistance is not ideal, etc., to achieve the effect of easy subsequent processing, good resin adhesion, and good product performance
CN101696089AInactive Publication Date: 2010-04-21SICHUAN FIBERGLASS GRP

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SICHUAN FIBERGLASS GRP
Publication Date
2010-04-21
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a glass fiber with a low dielectric constant for a high frequency high-density circuit board, which is characterized in that: the glass fiber comprises the following components in percentage by weight: 50 to 60 percent of SiO2, 12 to 18 percent of Al2O3, 0 to 1.8 percent of CaO, 0.5 to 3.2 percent of MgO, 0.5 to 3.2 percent of ZnO, 21 to 27 percent of B2O3, 0 to 0.25 percent of Li2O, 0 to 0.25 percent of Na2O, 0.4 to 4 percent of TiO2, 0.5 to 3 percent of CaF2, and 0.2 to 0.6 percent of CeO2. The glass fiber disclosed by the invention has the advantages of excellent water resistance, excellent adhesion with the resin and easy follow-up processing. At room temperature, when the frequency is 1MHz, the dielectric constant is between 4.2 and 4.6 and the dielectric loss factor is between 10*10<-4> and 12*10<-4>. The glass fiber is particularly suitable to be used as a reinforcing material of the high frequency high-density multilayer interconnection printed circuit board.
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Description

Technical field

[0001] The invention belongs to glass fiber and relates to a low dielectric constant glass fiber used for high-frequency and high-density circuit boards. Mainly used for high-frequency and high-density circuit boards, especially suitable as reinforcement material for high-frequency and high-density multi-layer interconnection printed circuit boards. Background technique

[0002] With the development of the electronics industry, equipment miniaturization, circuit multi-layering, high density, and miniaturization have also developed rapidly. The frequency of electromagnetic waves used for line transmission can reach GHz or MHz. And the signal propagation speed V=C / ε 1 / 2 (where C is the speed of light, ε is the relative dielectric constant) It can be seen from the formula that the smaller ε is, the faster the signal propagates; the signal propagation loss from the circuit α ​​= Ktg α × f (where K is a constant and f is the propagation frequency) It can be seen...

Claims

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