High thermal conducting composite material and preparation method thereof

Abstract

This invention relates to a high thermal conducting composite material for injecting or extrusion molding, which is prepared from the following components in parts by weight: 100 parts of plastic substrate, 30 to 100 parts of thermal conducting filler with a diameter between 50 to 300 microns, 0 to 50 parts of thermal conducting filler with a small diameter between 1 to 10 microns, 10 to 50 parts of fiberglass or silicon whisker, 0 to 5 parts of coupling agent and 0 to 8 parts of additive. The preparation of the high thermal conducting composite material comprises the following steps: adding the coupling agent to the thermal conducting filler with a small diameter and the thermal conducting filler with a big diameter respectively to do surface treatment for later use; putting the plastic substrate material, the processed thermal conducting filler with a big diameter and other additives to a super mixer to mix for 1 to 5 minutes; adding the processed thermal conducting filler with a small diameter into the super mixer to mix for 2 to 3 minutes; putting the mixed material into a feeding bucket of a twin screw extruder; adding the fiberglass into a glass fiber orifice; and pelleting after melting and extruding. The composite material prepared by the invention has good thermal conducting property and processing property.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a high-conductivity thermoplastic composite material for injection or extrusion molding and a preparation method thereof. technical background [0002] Due to the good thermal conductivity of metal materials, metal materials are mostly used in traditional heat exchange and heat dissipation materials, but metal materials are easy to conduct electricity, high in weight, and complex in machining. With technological progress and industrial upgrading, in more and more application fields such as electronic information and thermal engineering, materials are required to be lightweight, easy to process, and insulated. These requirements make technical materials difficult to meet. Polymer materials have good processability and are easy to mold by injection or extrusion. However, most polymer materials are poor conductors of heat, and the thermal conductivity is usually hundreds ...

AI Technical Summary

Problems solved by technology

However, the patent does not disclose the particle size of the thermally conductive filler used, but the research of the inventors shows that for various plastic materials including polyphenylene sulfide, the particle size distribution of the filler used has an important impact on the material properties

[0006] In addition, foreign reports have polyphenylene sulfide high thermal conductivity plastics, with a thermal conductivity as high as 25-100W / m K, but no disclosure of its formula and preparation method